Instruction Manual Revision 1.2 Our company continuously devotes to product development and technical improvement, if this parameter has change, we will not inform at first.…

반도체 제조 사업장에 종사하는 근로자의 작업환경 및 유해요인 노출특성 연구 (연구결과 보고서) 2012. 2 차 례 …i 차 례 Ⅰ. 서론…

SMTA Ohio Valley Chapter Advanced Packaging Technologies: Chip Scale, Embedded Chip and 3D Packaging Ray Fillion Fillion Consulting [email protected] 518-810-1519…

Folie 1 Technische Universität Berlin Fakultät für Verkehrs- und Maschinensysteme, Institut für Mechanik Lehrstuhl für Kontinuumsmechanik und Materialtheorie, Prof.…

ACHI ® Settings of parameter for ACHI® series BGA Rework Stations 1 First, we need to know the difference between lead ball(the melting point is 183 ) and lead-free ball(217…

(12) United States Patent Sato et al. US006517602B2 (10) Patent N0.: (45) Date of Patent: US 6,517,602 B2 Feb. 11,2003 (54) SOLDER BALL AND METHOD FOR PRODUCING SAME (75)…

1. Thank you! Thank you for downloading one of our whitepapers – we hope you enjoy it. Have questions? Need more information? Please don’t hesitate to contact us! We…

Slide 1 BB Electronics DfM – Land Pattern Design: The bad and good ones. 2011-10, CNN – PE/DL Slide 2 1 Abstract: A series of examples of bad land pattern designs will…

PLAIN PLASTIC LEAVES Kit composed of 4 leaves of thermoformable transparent plastic. This material is peculiarly prepared to realise the technique. It’s non- toxic, even…