DOCUMENT RESOURCES FOR EVERYONE
Documents tagged
Documents Wafer Level CSP Overview Fillion 2011

SMTA Ohio Valley Chapter Advanced Packaging Technologies: Chip Scale, Embedded Chip and 3D Packaging Ray Fillion Fillion Consulting [email protected] 518-810-1519…

Documents Chap 1Abstract

Abstract Multiprocessor architectures and platforms have been introduced to extend the applicability of Moore’s law. They depend on concurrency and synchronization in both…

Documents Chip Carrier Package as an Alternative for Known Good Die Raymond Kuang September 08, 2004.

Slide 1 Chip Carrier Package as an Alternative for Known Good Die Raymond Kuang September 08, 2004 Slide 2 206/MAPLD 2004KUANG 2 Driver for Known Good Die (KGD)  Applications…

Documents MEMS Packaging & Damping Mechanisms ד " ר דן סתר תכן וייצור התקנים...

Slide 1  Wafer -> Chip  First Level Package : Chip- Scale-Packaging (Single or Multi-chip Module).  Second Level Package : PCB or Card.  Third Level Package…