DOCUMENT RESOURCES FOR EVERYONE
Documents tagged
Documents Dr Piotr Grabiec, prof. ITE Dept. of Silicon Microsystem and Nanostructure Technol. Instytut...

Slide 1Dr Piotr Grabiec, prof. ITE Dept. of Silicon Microsystem and Nanostructure Technol. Instytut Technologii Elektronowej (ITE) Warsaw, Poland ITE is a major Polish R&D…

Documents ITRS Design ITWG 2006 1 ITRS Design + System Drivers Hsinchu, December 2006 Design ITWG Japan:...

Slide 1ITRS Design ITWG 2006 1 ITRS Design + System Drivers Hsinchu, December 2006 Design ITWG Japan: Hiwatashi-san, Asada-san Taiwan: Chung-Ping Chen Europe: Wolfgang Rosenstiel…

Documents 1 Winter Public Conference ORTC 2010 Update A. Allan, Rev 2, 12/02/10.

Slide 11 Winter Public Conference ORTC 2010 Update A. Allan, Rev 2, 12/02/10 Slide 2 2 IRC 2010 Update Messages: 450mm timing presently unchanged from 2009 ITRS position…

Documents July 12, 2012ITRS public conference – San Francisco1 More-than-Moore Roadmapping Update.

Slide 1July 12, 2012ITRS public conference – San Francisco1 More-than-Moore Roadmapping Update Slide 2 Moores Law & More More than Moore: Diversification More Moore:…

Documents Seoul Korea December 9, 2008 Assembly and Packaging 2008 International Technology Roadmap for...

Slide 1Seoul Korea December 9, 2008 Assembly and Packaging 2008 International Technology Roadmap for Semiconductors Slide 2 ... 2 Assembly and Packaging Technical Working…

Documents ITRS Winter Conference 2006 The Ambassador Hotel Hsin Chu Taiwan 1 International Technology Roadmap....

Slide 1ITRS Winter Conference 2006 The Ambassador Hotel Hsin Chu Taiwan 1 International Technology Roadmap for Semiconductors Assembly and Packaging 2006 Slide 2 ITRS Winter…

Documents ITRS may in the future provide Research Guidance by defining better Innovation Questions for R&D...

Slide 1ITRS may in the future provide Research Guidance by defining better Innovation Questions for R&D ITRS Maastricht 04/07/06 Slide 2 2 Source: Siemens The engine…

Documents A Case for Wireless 3D NoCs for CMPs Hiroki Matsutani (1), Paul Bogdan (2), Radu Marculescu (2),...

Slide 1A Case for Wireless 3D NoCs for CMPs Hiroki Matsutani (1), Paul Bogdan (2), Radu Marculescu (2), Yasuhiro Take (1), Daisuke Sasaki (1), Hao Zhang (1), Michihiro Koibuchi…

Documents Page 1 Laminate Based System in Package (SiP) Utilizing High Density Interconnect (HDI) Substrates.....

Slide 1Page 1 Laminate Based System in Package (SiP) Utilizing High Density Interconnect (HDI) Substrates in High Reliability Applications Ron Nowak Senior Manager, Application…

Technology Placitus

1. Platform Circuit Technology UnderlyingHeterogeneous Nano & Tera SystemsProf. Dr. Q. Huang12 May 2011 2. Outline Background Motivation Sensor Interface and…