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Documents 1 Objective 3.2 Smart Components and Systems Integration Georg Kelm, DG INFSO, Nanoelectronics...

Slide 11 Objective 3.2 Smart Components and Systems Integration Georg Kelm, DG INFSO, Nanoelectronics InfoDay, Brussels, 11 October 2010 FP7 ICT Work Programme 2011-2012…

Documents 3D-IC an Enabler Technology and a new Landscape Yves Leduc Advanced System Technology November 2009.

Slide 1 3D-IC an Enabler Technology and a new Landscape Yves Leduc Advanced System Technology November 2009 Slide 2 What every Architect should know about Technology, Sani…

Documents Digital Circuit Design on FPGA

Digital Circuit Design on FPGA Nattha Jindapetch November 2008 Agenda Design trends IC technology revolution Design styles System integration Programmable logic FPGA design…

Documents What every Architect should know about Technology, Sani R. Nassif,

3D-IC an Enabler Technology and a new Landscape Yves Leduc Advanced System Technology November 2009 What every Architect should know about Technology, Sani R. Nassif, IBM…

Documents Communication Electromagnetics.pdf

This page intentionally left blank Electromagnetics for High-Speed Analog and Digital Communication Circuits Modern communications technology demands smaller, faster, and…

Documents AN OVERVIEW OF ADVANCED ELECTRONIC PACKAGING TECHNOLOGY.pdf

TECHNICAL REPORT: CVEL-07-001 AN OVERVIEW OF ADVANCED ELECTRONIC PACKAGING TECHNOLOGY Hocheol Kwak and Dr. Todd Hubing May 1, 2007 Clemson Vehicular Electronics Laboratory,…

Documents Laminate Based System in Package (SiP) Utilizing High Density Interconnect (HDI) Substrates in High....

Laminate Based System in Package (SiP) Utilizing High Density Interconnect (HDI) Substrates in High Reliability Applications. Ron Nowak Senior Manager, Application Engineering…