INTELLIGENT TOOLING
Team 99.08
Joseph Staley Jeffrey Roushey
Glenn Gardner Andrew Graybill
Design Concept Review
• Background - Mission - Approach• Customers - Wants - Constraints• Benchmarking• Quality Metrics - Target Values• Concept Generation• Concept Selection • Schedule - Budget
Background
• What is Metal Foam?
• How is it Produced?
• Why Use Metal Foam?
Project Summary
Mission• To develop a sensor system that will signal the
completion of the metal foaming process inside a mold.
Approach• By working together as a team, making use of
the customer’s resources, and performing extensive research we will provide the best possible sensor system design for our problem.
Customers - Wants - Constraints
Customers Wants Constraints MetricsChin-Jye Yu,FraunhoferUSA
High % ofSuccessfulFoams, SystemSimplicity /Reliability,Low Cost
Cost,OperatingTemperature,LabVIEW,Furnace
Dimensions,Surface Defects,Max. temp, SignalAlts., Set-up time,Mold Alts., Life,Cost, Programtime
Harald Eifert,FraunhoferUSA
High % ofSucessful Foams,Low Cost
Dimensions,Surface Defects,Cost
Customers - Wants - Constraints
Customers Wants Constraints MetricsBernard McGuiness,Lab RA, FRC-DE
Jim Adkins, LabCoordinator, FRC-DE
High % ofSuccessfulFoams, SystemSimplicity /Reliability
OperatingTemperature,Furnace
Dimensions,Surface Defects,Max. temp,Signal Alts., Set-up time, MoldAlts., Life
Automotive,Aerospace, Building/ConstructionIndustries
High % ofSuccessfulFoams, SystemSimplicity /Reliability,Low Cost
OperatingTemperature
Dimensions,Surface Defects,Max. temp,Signal Alts., Set-up time, MoldAlts., Life
System Benchmarking
• Die Casting / Injection Molding– general process, sensors
• High Temperature Monitoring– high temperature materials (Macor)– data acquisition
• Materials Level Monitoring– sensors
Functional Benchmarking
• Electrical Properties Sensors
• Piezo-electric Transducer
• Thermocouple
• Optical Fiber
• Eddy Current Detector
Target Values
Metric Target ValueDimensions 3.5 X 3.5 X 0.5# Surface Defects 0Sensor System Life 5 yearsMaximum Operating Temp. 700 C# Signal Alterations 0Programming Time 20 hoursSet-up Time 30 minutes# Mold Alterations 0Cost $2,000
Critical Functions
• Sense metal foaming process completion
• Attenuate/Amplify the sensor output signal
• Channel signal(s) into data acquisition card
• Use LabVIEW software to interpret signals and alert user that the process is complete
Concept Generation
• Electrical Circuit Completion
• Piezo-Electric Force Sensor
• Thermocouple Array
• Optical Fiber
• Eddy Current Position Sensor
Concept Selection Method
Metric RawScore
SSDCorrelation
WeightedScore
EstimatedTarget Value
Dimensions 4 9.89 39.56 ?# Surface Defects 3 9.89 9.67 No (1)Sensor Sys. Life 5 13.187 65.935 YesMax. Op. Temp. 5 14.286 71.43 Yes# Signal Alts. 5 9.89 49.45 YesProgrmg. Time 5 9.89 49.45 YesSet-up Time 4 9.89 39.56 Yes# Mold Alts. 2 9.89 19.78 No (2)Cost 5 13.187 65.935 Yes
Total Score 430.77
Concept Selection
Concept Total Weighted ScoreElectrical Circuit Completion 431
Piezo-Electric Force Plate 325
Thermocouple Array 312
Eddy Current Position Sensor 235
Optical Fiber 196
Conductivity Testing at Room Temperature
Conductivity Testing at 700 °C
Schedule - Fall ‘98
Schedule - Spring ‘99
Estimated Budget
Part MaterialCost
MachiningCost
ApproximateCost
Copper Mold $5 $495 $500Ceramic Insulator $150 $450 $600Copper Electrode Large $2 $128 $130Copper Electrode Small $2 $128 $130Copper Wire $4 $0 $4Terminal Board $0 $0 $0Battery 9V $0 $0 $0Computer (CPU) $0 $0 $0
Total Cost $1,364
Future Direction
• Winter Break - Build Concept
• February - Testing and Design Iterations
• March - Cushion Period
• April - Final Report Preparation
