INTELLIGENT TOOLING Team 99.08 Joseph StaleyJeffrey Roushey Glenn GardnerAndrew Graybill.

INTELLIGENT TOOLING

Team 99.08

Joseph Staley Jeffrey Roushey

Glenn Gardner Andrew Graybill

Design Concept Review

• Background - Mission - Approach• Customers - Wants - Constraints• Benchmarking• Quality Metrics - Target Values• Concept Generation• Concept Selection • Schedule - Budget

Background

• What is Metal Foam?

• How is it Produced?

• Why Use Metal Foam?

Project Summary

Mission• To develop a sensor system that will signal the

completion of the metal foaming process inside a mold.

Approach• By working together as a team, making use of

the customer’s resources, and performing extensive research we will provide the best possible sensor system design for our problem.

Customers - Wants - Constraints

Customers Wants Constraints MetricsChin-Jye Yu,FraunhoferUSA

High % ofSuccessfulFoams, SystemSimplicity /Reliability,Low Cost

Cost,OperatingTemperature,LabVIEW,Furnace

Dimensions,Surface Defects,Max. temp, SignalAlts., Set-up time,Mold Alts., Life,Cost, Programtime

Harald Eifert,FraunhoferUSA

High % ofSucessful Foams,Low Cost

Dimensions,Surface Defects,Cost

Customers - Wants - Constraints

Customers Wants Constraints MetricsBernard McGuiness,Lab RA, FRC-DE

Jim Adkins, LabCoordinator, FRC-DE

High % ofSuccessfulFoams, SystemSimplicity /Reliability

OperatingTemperature,Furnace

Dimensions,Surface Defects,Max. temp,Signal Alts., Set-up time, MoldAlts., Life

Automotive,Aerospace, Building/ConstructionIndustries

High % ofSuccessfulFoams, SystemSimplicity /Reliability,Low Cost

OperatingTemperature

Dimensions,Surface Defects,Max. temp,Signal Alts., Set-up time, MoldAlts., Life

System Benchmarking

• Die Casting / Injection Molding– general process, sensors

• High Temperature Monitoring– high temperature materials (Macor)– data acquisition

• Materials Level Monitoring– sensors

Functional Benchmarking

• Electrical Properties Sensors

• Piezo-electric Transducer

• Thermocouple

• Optical Fiber

• Eddy Current Detector

Target Values

Metric Target ValueDimensions 3.5 X 3.5 X 0.5# Surface Defects 0Sensor System Life 5 yearsMaximum Operating Temp. 700 C# Signal Alterations 0Programming Time 20 hoursSet-up Time 30 minutes# Mold Alterations 0Cost $2,000

Critical Functions

• Sense metal foaming process completion

• Attenuate/Amplify the sensor output signal

• Channel signal(s) into data acquisition card

• Use LabVIEW software to interpret signals and alert user that the process is complete

Concept Generation

• Electrical Circuit Completion

• Piezo-Electric Force Sensor

• Thermocouple Array

• Optical Fiber

• Eddy Current Position Sensor

Concept Selection Method

Metric RawScore

SSDCorrelation

WeightedScore

EstimatedTarget Value

Dimensions 4 9.89 39.56 ?# Surface Defects 3 9.89 9.67 No (1)Sensor Sys. Life 5 13.187 65.935 YesMax. Op. Temp. 5 14.286 71.43 Yes# Signal Alts. 5 9.89 49.45 YesProgrmg. Time 5 9.89 49.45 YesSet-up Time 4 9.89 39.56 Yes# Mold Alts. 2 9.89 19.78 No (2)Cost 5 13.187 65.935 Yes

Total Score 430.77

Concept Selection

Concept Total Weighted ScoreElectrical Circuit Completion 431

Piezo-Electric Force Plate 325

Thermocouple Array 312

Eddy Current Position Sensor 235

Optical Fiber 196

Conductivity Testing at Room Temperature

Conductivity Testing at 700 °C

Schedule - Fall ‘98

Schedule - Spring ‘99

Estimated Budget

Part MaterialCost

MachiningCost

ApproximateCost

Copper Mold $5 $495 $500Ceramic Insulator $150 $450 $600Copper Electrode Large $2 $128 $130Copper Electrode Small $2 $128 $130Copper Wire $4 $0 $4Terminal Board $0 $0 $0Battery 9V $0 $0 $0Computer (CPU) $0 $0 $0

Total Cost $1,364

Future Direction

• Winter Break - Build Concept

• February - Testing and Design Iterations

• March - Cushion Period

• April - Final Report Preparation