Confidential & Proprietary (NDA Only) Slide 1

Basics of MultiBand OFDM Ultrawideband Technology

Semiconductor development and UWB Ecosystem

October 27th, 2004

Roberto Aiello, CTO

[email protected]

IEEE CCNC January 5, 2005

Slide 2

• Headquarters in San Diego, California

• WUSB Products• Single-chip all-CMOS PHY module• Single-chip all-CMOS MAC+PHY module• Sampling single-chip, all-CMOS, standard-compliant, 480Mbps, in Q1’05.

• Veteran management and engineering team• Broadcom, Intel, Nokia, Motorola, National, PCSI, Qualcomm Silicon Wave, Texas

Instruments

• Proven technical team• Key author and contributor of the standard (MBOA, WiMedia, 1394TA, Wireless USB).• Several key single-chip CMOS radio designs thru production (Bluetooth in iPAQ,

etc. .11bag, CDMA – Nokia handsets, etc)• Key innovator of UWB technology: impulse-radio → multiband → multiband OFDM

• Blue-chip funding• A-Round (April 2003) - $7.5M by Allegis, Bay Partners, Charles River Ventures• B-Round (March 2004) - $20M by original investors, Intel, InterWest

• Key partnerships and alliances established

About StaccatoAbout Staccato

Slide 3

UWB is spectrumUWB is spectrum

• UWB is about low power transmission and non-harmful co-existence with other services

• Unlicensed use sharing licensed spectrum• Radio systems are smarter than 70 years ago

• Spectrum management based on old assumptions

• Future UWB systems will be different from systems analyzed before rulemaking

• UWB spectrum characteristics allow • high bit rate, short range (MBOA)

• low power, location awareness (IEEE 802.15.4a)

ISM: Industrial, Scientific, Medical

U-NII: Universal National Information Infrastructure

MBOA: Multiband OFDM Alliance

UWB: Ultra-wideband

Slide 4Source: Ed Thomas, FCC, 2003

Slide 5

MBOA(*) specification summaryMBOA(*) specification summary

3432MHz

3960MHz

4488MHz

5016MHz

5544MHz

6072MHz

6600MHz

7128MHz

7656MHz

8184MHz

8712MHz

9240MHz

9768MHz

Band#1

Band#2

Band#3

Band#4

Band#5

Band#6

Band#7

Band#8

Band#9

Band#10

Band#11

Band#12

Band#13

Band Group 1 Band Group 2 Band Group 3 Band Group 4

Band#14

Band Group 5

10298MHz

Mandatory Optional Optional Optional OptionalMandatory Optional Optional Optional Optional

Link Margin Ref. (0 dB). -02.7 dB -04.9 dB -06.5 dBLink Margin Ref. (0 dB). -02.7 dB -04.9 dB -06.5 dB

… …

128tones

… …

128tones

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Band Group 1Length 6 TFC

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Band Group 1Length 6 TFC

MBOA PHY Specification 1.0• Band Switching

• Within Band Set #1• 3.168 – 4.752 GHz

• Bands 1, 2 and 3• Each occupy 528 MHz

• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK

MBOA PHY Specification 1.0• Band Switching

• Within Band Set #1• 3.168 – 4.752 GHz

• Bands 1, 2 and 3• Each occupy 528 MHz

• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK

Global Solution: Flexible band plan and use of OFDM subcarriers allows for “spectrum shaping” which can be used to meet worldwide regulatory requirements

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Band Group 1Length 6 TFC

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Band Group 1Length 6 TFC

MBOA PHY Specification 1.0• Band Switching

• Within Band Set #1• 3.168 – 4.752 GHz

• Bands 1, 2 and 3• Each occupy 528 MHz

• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK

MBOA PHY Specification 1.0• Band Switching

• Within Band Set #1• 3.168 – 4.752 GHz

• Bands 1, 2 and 3• Each occupy 528 MHz

• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK

Global Solution: Flexible band plan and use of OFDM subcarriers allows for “spectrum shaping” which can be used to meet worldwide regulatory requirements

(*) www.multibandofdm.org

Slide 6

RF CMOS for UWBRF CMOS for UWB

Standard CMOS Ultrawideband Single-Chip Solutions

By Dan Meacham and Krishnamurthy Soumyanath

EE TimesMay 17, 2004

Using appropriate design techniques and optimizations an ultrawideband multiband-OFDM analog front end can be implemented in low-cost standard CMOS.

Slide 7

Industry timelineIndustry timeline

Silicon Silicon prototypesprototypes

interop

Interoperability TestingInteroperability Testing

Silicon &Silicon &RF modulesRF modules

BoardsBoards(PCI, mini-PCI, etc.)(PCI, mini-PCI, etc.)

Silicon VendorsSilicon Vendors

IC SamplesIC Samples

3Q033Q03 1Q04 1Q04 3Q-4Q04 3Q-4Q04 1Q05 1Q05 2Q05 2Q05 4Q05– 2Q06 … 4Q05– 2Q06 …

Standards & Standards & Technology Technology

CreationCreation

EcosystemEcosystemFormationFormation

Corporate R&D

TechnologyTechnologyDemonstrationDemonstration

(Intel Developers Forum)(Intel Developers Forum)

Business Groups Engaged

SpecsReqs PC CE Mobile W-USB W-1394

Multi-Vendor Multi-Vendor InteroperabilityInteroperability

IC Development

C&I Program

Components

Develo

pm

ent

Pla

tform

CommercialCommercialDeploymentDeployment

Product Development

End productsEnd products

Slide 8

Staccato CommunicationsStaccato Communications

• UWB is available spectrum

• Ideal for very high bit rate, low power, short range application

• Wireless USB standard is set• First UWB high volume application• Interoperable products to market in 2H 2005

• Staccato is first to market with single-chip• All-CMOS radio implementation• Low cost, small size, efficient power consumption• Single-chip enables volume products