Confidential & Proprietary (NDA Only) Slide 1 Basics of MultiBand OFDM Ultrawideband Technology Semiconductor development and UWB Ecosystem October 27 th , 2004 Roberto Aiello, CTO [email protected] IEEE CCNC January 5, 2005
Feb 01, 2016
Confidential & Proprietary (NDA Only) Slide 1
Basics of MultiBand OFDM Ultrawideband Technology
Semiconductor development and UWB Ecosystem
October 27th, 2004
Roberto Aiello, CTO
IEEE CCNC January 5, 2005
Slide 2
• Headquarters in San Diego, California
• WUSB Products• Single-chip all-CMOS PHY module• Single-chip all-CMOS MAC+PHY module• Sampling single-chip, all-CMOS, standard-compliant, 480Mbps, in Q1’05.
• Veteran management and engineering team• Broadcom, Intel, Nokia, Motorola, National, PCSI, Qualcomm Silicon Wave, Texas
Instruments
• Proven technical team• Key author and contributor of the standard (MBOA, WiMedia, 1394TA, Wireless USB).• Several key single-chip CMOS radio designs thru production (Bluetooth in iPAQ,
etc. .11bag, CDMA – Nokia handsets, etc)• Key innovator of UWB technology: impulse-radio → multiband → multiband OFDM
• Blue-chip funding• A-Round (April 2003) - $7.5M by Allegis, Bay Partners, Charles River Ventures• B-Round (March 2004) - $20M by original investors, Intel, InterWest
• Key partnerships and alliances established
About StaccatoAbout Staccato
Slide 3
UWB is spectrumUWB is spectrum
• UWB is about low power transmission and non-harmful co-existence with other services
• Unlicensed use sharing licensed spectrum• Radio systems are smarter than 70 years ago
• Spectrum management based on old assumptions
• Future UWB systems will be different from systems analyzed before rulemaking
• UWB spectrum characteristics allow • high bit rate, short range (MBOA)
• low power, location awareness (IEEE 802.15.4a)
ISM: Industrial, Scientific, Medical
U-NII: Universal National Information Infrastructure
MBOA: Multiband OFDM Alliance
UWB: Ultra-wideband
Slide 4Source: Ed Thomas, FCC, 2003
Slide 5
MBOA(*) specification summaryMBOA(*) specification summary
3432MHz
3960MHz
4488MHz
5016MHz
5544MHz
6072MHz
6600MHz
7128MHz
7656MHz
8184MHz
8712MHz
9240MHz
9768MHz
Band#1
Band#2
Band#3
Band#4
Band#5
Band#6
Band#7
Band#8
Band#9
Band#10
Band#11
Band#12
Band#13
Band Group 1 Band Group 2 Band Group 3 Band Group 4
Band#14
Band Group 5
10298MHz
Mandatory Optional Optional Optional OptionalMandatory Optional Optional Optional Optional
Link Margin Ref. (0 dB). -02.7 dB -04.9 dB -06.5 dBLink Margin Ref. (0 dB). -02.7 dB -04.9 dB -06.5 dB
… …
128tones
… …
128tones
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Channel Number
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Band Group 1Length 6 TFC
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Band Group 1Length 6 TFC
MBOA PHY Specification 1.0• Band Switching
• Within Band Set #1• 3.168 – 4.752 GHz
• Bands 1, 2 and 3• Each occupy 528 MHz
• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK
MBOA PHY Specification 1.0• Band Switching
• Within Band Set #1• 3.168 – 4.752 GHz
• Bands 1, 2 and 3• Each occupy 528 MHz
• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK
Global Solution: Flexible band plan and use of OFDM subcarriers allows for “spectrum shaping” which can be used to meet worldwide regulatory requirements
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Band Group 1Length 6 TFC
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Channel Number
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Band Group 1Length 6 TFC
MBOA PHY Specification 1.0• Band Switching
• Within Band Set #1• 3.168 – 4.752 GHz
• Bands 1, 2 and 3• Each occupy 528 MHz
• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK
MBOA PHY Specification 1.0• Band Switching
• Within Band Set #1• 3.168 – 4.752 GHz
• Bands 1, 2 and 3• Each occupy 528 MHz
• Band Subcarriers• 128 tone OFDM• Tone width: 4.125 MHz• Tone modulation: QPSK
Global Solution: Flexible band plan and use of OFDM subcarriers allows for “spectrum shaping” which can be used to meet worldwide regulatory requirements
(*) www.multibandofdm.org
Slide 6
RF CMOS for UWBRF CMOS for UWB
Standard CMOS Ultrawideband Single-Chip Solutions
By Dan Meacham and Krishnamurthy Soumyanath
EE TimesMay 17, 2004
Using appropriate design techniques and optimizations an ultrawideband multiband-OFDM analog front end can be implemented in low-cost standard CMOS.
Slide 7
Industry timelineIndustry timeline
Silicon Silicon prototypesprototypes
interop
Interoperability TestingInteroperability Testing
Silicon &Silicon &RF modulesRF modules
BoardsBoards(PCI, mini-PCI, etc.)(PCI, mini-PCI, etc.)
Silicon VendorsSilicon Vendors
IC SamplesIC Samples
3Q033Q03 1Q04 1Q04 3Q-4Q04 3Q-4Q04 1Q05 1Q05 2Q05 2Q05 4Q05– 2Q06 … 4Q05– 2Q06 …
Standards & Standards & Technology Technology
CreationCreation
EcosystemEcosystemFormationFormation
Corporate R&D
TechnologyTechnologyDemonstrationDemonstration
(Intel Developers Forum)(Intel Developers Forum)
Business Groups Engaged
SpecsReqs PC CE Mobile W-USB W-1394
Multi-Vendor Multi-Vendor InteroperabilityInteroperability
IC Development
C&I Program
Components
Develo
pm
ent
Pla
tform
CommercialCommercialDeploymentDeployment
Product Development
End productsEnd products
Slide 8
Staccato CommunicationsStaccato Communications
• UWB is available spectrum
• Ideal for very high bit rate, low power, short range application
• Wireless USB standard is set• First UWB high volume application• Interoperable products to market in 2H 2005
• Staccato is first to market with single-chip• All-CMOS radio implementation• Low cost, small size, efficient power consumption• Single-chip enables volume products