Transcript
Surface Mount Technology Limited
12345
Customer Name:
Customer Model:
SMT Model:Production Qty.:
Ship out Qty.:
Production Date:
Production Line:
PIC Signature Date PIC SignaturePrepared: Engineering:Checked: QA:Approved: Production:
Surface Mount Technology Limited
12345
PIC Signature Date
12345 PP Report
Contents
1. Process Flow2. Materials & sub-materials 3. Yield results4. PNP QA summary5. Production Problem Analysis & Actions Follow6. Assembly QA summary7. Conclusion & RecommendationAppendix A - Reflow Soldering Temperature Profile
12345 PP Report
Appendix A - Reflow Soldering Temperature Profile
1.Process Flow Chart
SymbolPP Production Process Flow
No Operation Transportation Inspection Storage
1 ● ▽ □ △ Incoming material
2 ○ ▽ ■ △ Incoming material inspection
3 ○ ▽ □ ▲ Store in warehouse
4 ● ▽ □ △ Receive material on production line
5 ● ▽ □ △ Classing the material for different station
6 ● ▽ □ △ Paste the solder screen
7 ○ ▽ ■ △8 ● ▽ □ △ Loading the material
9 ○ ▽ ■ △10 ● ▽ □ △ PNP placement
11 ○ ▽ ■ △12 ○ ▽ ■ △ Visual inspection after reflow soldering
13 ○ ▽ ■ △ Reflow oven temperature detect
14 ● ▽ □ △ Convey to reflow oven for soldering
15 ○ ▽ ■ △ AOI inspection
16 ○ ▽ ■ △ Visual inspection after reflow soldering
17 ○ ▽ ■ △ IPQC selective inspection
18 ○ ▽ ■ △19 ○ ▼ □ ▲ Return to warehouse for casing assembly
20 ○ ▽ ■ △21 ● ▽ □ △ Apply the screw
22 ○ ▽ ■ △ IPQC selective inspection
23 ○ ▽ ■ △ Inspection SMD component
24 ● ▽ □ △25 ○ ▽ ■ △26 ● ▽ □ △ Inspection and wavesoldering
27 ● ▽ □ △ Inspecion after wavesoldering
28 ○ ▽ ■ △29 ● ▽ □ △ PCB separation
30 ● ▽ □ △ Overall insepction
31 ● ▽ □ △ Visula inspecion and casing assembly
32 ● ▽ □ △ Apply the screw A
33 ● ▽ □ △ Apply the screw B
34 ○ ▽ ■ △ FCT TEST
35 ○ ▽ ■ △ Apperance and packing
36 ○ ▽ □ ▲ Finish good to warehouse
IPQC selective inspection
IPQC selective inspection
IPQC first article approve
QA inspection
IPQC selective inspection
Insert component(一)IPQC selective inspection
IPQC selective inspection
PP Production Process Flow
Incoming material
Incoming material inspection
Store in warehouse
Receive material on production line
Classing the material for different station
Paste the solder screen
Loading the material
PNP placement
Visual inspection after reflow soldering
Reflow oven temperature detect
Convey to reflow oven for soldering
AOI inspection
Visual inspection after reflow soldering
IPQC selective inspection
Return to warehouse for casing assembly
Apply the screw
IPQC selective inspection
Inspection SMD component
Inspection and wavesoldering
Inspecion after wavesoldering
PCB separation
Overall insepction
Visula inspecion and casing assembly
Apply the screw A
Apply the screw B
FCT TEST
Apperance and packing
Finish good to warehouse
IPQC selective inspection
IPQC selective inspection
IPQC first article approve
QA inspection
IPQC selective inspection
Insert component(一)IPQC selective inspection
IPQC selective inspection
2. Materials Issues
Scrap Materials (Major parts)NO. P/N Description Qty. (pcs) Problems Reasons Actions Affected Area PIC Due date
1
2
3
NO. SMT P/N Description Qty. (pcs) Problems Reasons Actions Affected Area PIC Due date
1
Sub-materials No. Sub-materials SMT P/N Specification
1 Lead-free solder Wire SUBBING006 SENJU M705 1.0MM
2 Lead-free solder bar SUBAINTG007 SENJU M705
3 Flux MS02-0021-03 AOKI EC-19S-8
4 Solvent MS02-0023-02 CLEANING SOLVENT TF-2000-6
5 solder paste SUBAINT61
Incoming Materials Failure Analysis
M705-GRN360-K2-V(Lead free)
Remarks
Remarks
/
3. Results
OK Qty. (pcs) NG Qty. (pcs) Ship Out Qty. (pcs) Remarks
72 72 72 72 72
Process PNP Section Casing Assembly
Input Qty 1 1
1 1
100.00% 100.00%
Final Pass Output 1 1
Final Pass Yield 100.00% 100.00%
Testing Result - (Production Line)
FCT
1pcs Defect Rate: 00
100.00% Final Defect Rate: 0
100.00%
PNP Production Qty. (pcs)
Assembly Production Qty. (pcs)
1st Pass Output Qty
1st Pass Yield
Testing Item:
Tested Qty.:
1st Pass Yield:
Final Pass Yield:
4. PNP QA Results(MAIN BOARD)
Viscosity SPEC:200+50 pa.s
QA full inspection results
Test Position No.1 No.2 No.3 No.4 No.5 Checked Lot:1
X1 Passed Lot: 1
X2 LAR%:100%
X3 QA PASS Q'ty:72pcs
X4 PPM:0
Total
x
R
Process Capability Analysis - Solder Paste Thickness
Solder Paste Model: SUBAINT61
Solder Paste Height SPEC:130--210um (stencil thickness: 150um)
IPQC measured results: 200 pa.s IPQC measured results:(AVG: 202.4 um)
SMT adhesive model: NaIPQC measured results on adhesive tension
12345 Solder Paste Thickness
1 9 51 8 51 7 51 6 51 5 51 4 5
U S LL S L
B J H - 7 5 8 2 M A I N
P P M T o t a l
P P M > U S L
P P M < L S L
P P M T o t a l
P P M > U S L
P P M < L S L
P P M T o t a l
P P M > U S L
P P M < L S L
P p k
P P L
P P U
P p
C p m
C p k
C P L
C P U
C p
S t D e v ( L T )
S t D e v ( S T )
S a m p l e N
M e a n
L S L
T a r g e t
U S L
0 . 6 6
0 . 5 5
0 . 1 1
2 . 9 0
2 . 3 2
0 . 5 8
0 . 0 0
0 . 0 0
0 . 0 0
1 . 6 2
1 . 7 3
1 . 6 2
1 . 6 7
*
1 . 5 3
1 . 6 2
1 . 5 3
1 . 5 7
7 . 9 6 0 7 5
8 . 4 7 1 2 4
1 0
1 7 1 . 2
1 3 0 . 0
*
2 1 0 . 0
E x p e c t e d L T P e r f o r m a n c eE x p e c t e d S T P e r f o r m a n c eO b s e r v e d P e r f o r m a n c eO v e r a l l ( L T ) C a p a b i l i t y
P o t e n t i a l ( S T ) C a p a b i l i t y
P r o c e s s D a t aS T
L T
4. PNP QA Results(SUB-BOARD)
Viscosity SPEC:200+50 pa.s
QA full inspection results
Test Position No.1 No.2 No.3 No.4 No.5 Checked Lot:1
X1 Passed Lot: 1
X2 LAR%:100%
X3 QA PASS Q'ty:72pcs
X4 PPM:0
Total
x
R
Process Capability Analysis - Solder Paste Thickness
Solder Paste Model: SUBAINT61
Solder Paste Height SPEC:130--210um (stencil thickness: 150um)
IPQC measured results: 210 pa.s IPQC measured results:(AVG: 171.2 um)
SMT adhesive model: NaIPQC measured results on adhesive tension
12345 Solder Paste Thickness
1 9 51 8 51 7 51 6 51 5 51 4 5
U S LL S L
P r o c e s s C a p a b i l i t y A n a l y s i s f o r C 1
P P M T o t a l
P P M > U S L
P P M < L S L
P P M T o t a l
P P M > U S L
P P M < L S L
P P M T o t a l
P P M > U S L
P P M < L S L
P p k
P P L
P P U
P p
C p m
C p k
C P L
C P U
C p
S t D e v ( L T )
S t D e v ( S T )
S a m p l e N
M e a n
L S L
T a r g e t
U S L
0 . 6 6
0 . 5 5
0 . 1 1
1 4 . 8 4
1 1 . 4 0
3 . 4 4
0 . 0 0
0 . 0 0
0 . 0 0
1 . 6 2
1 . 7 3
1 . 6 2
1 . 6 7
*
1 . 4 1
1 . 5 0
1 . 4 1
1 . 4 6
7 . 9 6 0 7 5
9 . 1 6 0 7 6
1 0
1 7 1 . 2
1 3 0 . 0
*
2 1 0 . 0
E x p e c t e d L T P e r f o r m a n c eE x p e c t e d S T P e r f o r m a n c eO b s e r v e d P e r f o r m a n c eO v e r a l l ( L T ) C a p a b i l i t y
P o t e n t i a l ( S T ) C a p a b i l i t y
P r o c e s s D a t aS T
L T
6. Assembly QA Summary
CUSTOMER CUSTOMER Model NAME SMT Model
Libra / / 577582
QUALITY CLASS /PLANMIN: 3.00%
ACC:
□ □ □Ⅰ Ⅱ Ⅲ MAJ: 0.40% ACC:
ITEM INSPECTION ITEM STANDARD SAMPLE Q'TY
COMPONENT
1.WRONG COMPONENT NO ACCEPT 10pcs
2.MISSING COMPONENT NO ACCEPT 10pcs
3.BROKEN COMPONENT IPC-A-610C-II 10pcs
4.REVERSE NO ACCEPT 10pcs
5.COMPONENT FLOAT UP IPC-A-610C-II 10pcs
6.COMPONENT APPEARANCE IPC-A-610C-II 10pcs
SOLDER
1.POOR SOLDER IPC-A-610C-II 10pcs
2.SHORT(OPEN) CIRCUIT NO ACCEPT 10pcs
3.SOLDER TIP IPC-A-610C-II 10pcs
4.SOLDER HOLE/BALL IPC-A-610C-II 10pcs
PCB
1.CIRCUIT BROKEN IPC-A-610C-II 10pcs
2.MISSING SOLDER MASK IPC-A-610C-II 10pcs
ACCOUNT: VISUAL DEFECT: 0 PCS MINOR DEFECT: 0 PCS
MAJOR DEFECT: 0 PCS
10 PCS REJ QTY: 0 PCS
REMARK:
CHECKED: Weimingxiong QA PIC: WeimingXiong
PCS
PCS
FUNCTION DEFECT: 0 PCS
ACC QTY: PCS
RESULT : □ ACC □REJ □ U.A.I □ ALL CHECK OTHERS
AQL AQL AQL
6. Assembly QA SummaryDATE 26.Jun.2006
SMT NAME LOT QTY
/ 72pcs
REJ: PCS
REJ: PCS
OK NG REMARK
10 pcs 0
11 pcs 0
12 pcs 0
13 pcs 0
14 pcs 0
15 pcs 0
16 pcs 0
17 pcs 0
18 pcs 0
19 pcs 0
20 pcs 0
21 pcs 0
MINOR DEFECT: 0 PCS
MAJOR DEFECT: 0 PCS
REJ QTY: 0 PCS
PE PIC: YilinChen
Assembly Section
Station Phenomena NG Qty. (pcs) Reasons Actions Location PIC Due Date REMARK
Wave soldering
此脚步不见脚步型No protuberant feet on the buttom
side for proper soldering
7. Conclusion
8.suggestion
a.fabricate the fixture for screw fixing
b.fabricate the fixture for label appling
There were total 10 pcs built in this phase ,the first pass yield 88.9%,last pass yield 100% ,the pending issues was mainly existed on the incoming materials problem.
There were total 10 pcs built in this phase ,the first pass yield 88.9%,last pass yield 100% ,the pending issues was mainly
Appendix A
Reflow Soldering Temperature Profile(MAIN BOARD)
Reflow Soldering Temperature Profile(SUB-BOARD)
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