Pilot Run Report 0702

Surface Mount Technology Limited

12345

Customer Name:

Customer Model:

SMT Model:Production Qty.:

Ship out Qty.:

Production Date:

Production Line:

PIC Signature Date PIC SignaturePrepared: Engineering:Checked: QA:Approved: Production:

Surface Mount Technology Limited

12345

PIC Signature Date

12345 PP Report

Contents

1. Process Flow2. Materials & sub-materials 3. Yield results4. PNP QA summary5. Production Problem Analysis & Actions Follow6. Assembly QA summary7. Conclusion & RecommendationAppendix A - Reflow Soldering Temperature Profile

12345 PP Report

Appendix A - Reflow Soldering Temperature Profile

1.Process Flow Chart

SymbolPP Production Process Flow

No Operation Transportation Inspection Storage

1 ● ▽ □ △ Incoming material

2 ○ ▽ ■ △ Incoming material inspection

3 ○ ▽ □ ▲ Store in warehouse

4 ● ▽ □ △ Receive material on production line

5 ● ▽ □ △ Classing the material for different station

6 ● ▽ □ △ Paste the solder screen

7 ○ ▽ ■ △8 ● ▽ □ △ Loading the material

9 ○ ▽ ■ △10 ● ▽ □ △ PNP placement

11 ○ ▽ ■ △12 ○ ▽ ■ △ Visual inspection after reflow soldering

13 ○ ▽ ■ △ Reflow oven temperature detect

14 ● ▽ □ △ Convey to reflow oven for soldering

15 ○ ▽ ■ △ AOI inspection

16 ○ ▽ ■ △ Visual inspection after reflow soldering

17 ○ ▽ ■ △ IPQC selective inspection

18 ○ ▽ ■ △19 ○ ▼ □ ▲ Return to warehouse for casing assembly

20 ○ ▽ ■ △21 ● ▽ □ △ Apply the screw

22 ○ ▽ ■ △ IPQC selective inspection

23 ○ ▽ ■ △ Inspection SMD component

24 ● ▽ □ △25 ○ ▽ ■ △26 ● ▽ □ △ Inspection and wavesoldering

27 ● ▽ □ △ Inspecion after wavesoldering

28 ○ ▽ ■ △29 ● ▽ □ △ PCB separation

30 ● ▽ □ △ Overall insepction

31 ● ▽ □ △ Visula inspecion and casing assembly

32 ● ▽ □ △ Apply the screw A

33 ● ▽ □ △ Apply the screw B

34 ○ ▽ ■ △ FCT TEST

35 ○ ▽ ■ △ Apperance and packing

36 ○ ▽ □ ▲ Finish good to warehouse

IPQC selective inspection

IPQC selective inspection

IPQC first article approve

QA inspection

IPQC selective inspection

Insert component(一)IPQC selective inspection

IPQC selective inspection

PP Production Process Flow

Incoming material

Incoming material inspection

Store in warehouse

Receive material on production line

Classing the material for different station

Paste the solder screen

Loading the material

PNP placement

Visual inspection after reflow soldering

Reflow oven temperature detect

Convey to reflow oven for soldering

AOI inspection

Visual inspection after reflow soldering

IPQC selective inspection

Return to warehouse for casing assembly

Apply the screw

IPQC selective inspection

Inspection SMD component

Inspection and wavesoldering

Inspecion after wavesoldering

PCB separation

Overall insepction

Visula inspecion and casing assembly

Apply the screw A

Apply the screw B

FCT TEST

Apperance and packing

Finish good to warehouse

IPQC selective inspection

IPQC selective inspection

IPQC first article approve

QA inspection

IPQC selective inspection

Insert component(一)IPQC selective inspection

IPQC selective inspection

2. Materials Issues

Scrap Materials (Major parts)NO. P/N Description Qty. (pcs) Problems Reasons Actions Affected Area PIC Due date

1

2

3

NO. SMT P/N Description Qty. (pcs) Problems Reasons Actions Affected Area PIC Due date

1

Sub-materials No. Sub-materials SMT P/N Specification

1 Lead-free solder Wire SUBBING006 SENJU M705 1.0MM

2 Lead-free solder bar SUBAINTG007 SENJU M705

3 Flux MS02-0021-03 AOKI EC-19S-8

4 Solvent MS02-0023-02 CLEANING SOLVENT TF-2000-6

5 solder paste SUBAINT61

Incoming Materials Failure Analysis

M705-GRN360-K2-V(Lead free)

Remarks

Remarks

/

3. Results

OK Qty. (pcs) NG Qty. (pcs) Ship Out Qty. (pcs) Remarks

72 72 72 72 72

Process PNP Section Casing Assembly

Input Qty 1 1

1 1

100.00% 100.00%

Final Pass Output 1 1

Final Pass Yield 100.00% 100.00%

Testing Result - (Production Line)

FCT

1pcs Defect Rate: 00

100.00% Final Defect Rate: 0

100.00%

PNP Production Qty. (pcs)

Assembly Production Qty. (pcs)

1st Pass Output Qty

1st Pass Yield

Testing Item:

Tested Qty.:

1st Pass Yield:

Final Pass Yield:

4. PNP QA Results(MAIN BOARD)

Viscosity SPEC:200+50 pa.s

QA full inspection results

Test Position No.1 No.2 No.3 No.4 No.5 Checked Lot:1

X1 Passed Lot: 1

X2 LAR%:100%

X3 QA PASS Q'ty:72pcs

X4 PPM:0

Total

x

R

Process Capability Analysis - Solder Paste Thickness

Solder Paste Model: SUBAINT61

Solder Paste Height SPEC:130--210um (stencil thickness: 150um)

IPQC measured results: 200 pa.s IPQC measured results:(AVG: 202.4 um)

SMT adhesive model: NaIPQC measured results on adhesive tension

12345 Solder Paste Thickness

1 9 51 8 51 7 51 6 51 5 51 4 5

U S LL S L

B J H - 7 5 8 2 M A I N

P P M T o t a l

P P M > U S L

P P M < L S L

P P M T o t a l

P P M > U S L

P P M < L S L

P P M T o t a l

P P M > U S L

P P M < L S L

P p k

P P L

P P U

P p

C p m

C p k

C P L

C P U

C p

S t D e v ( L T )

S t D e v ( S T )

S a m p l e N

M e a n

L S L

T a r g e t

U S L

0 . 6 6

0 . 5 5

0 . 1 1

2 . 9 0

2 . 3 2

0 . 5 8

0 . 0 0

0 . 0 0

0 . 0 0

1 . 6 2

1 . 7 3

1 . 6 2

1 . 6 7

*

1 . 5 3

1 . 6 2

1 . 5 3

1 . 5 7

7 . 9 6 0 7 5

8 . 4 7 1 2 4

1 0

1 7 1 . 2

1 3 0 . 0

*

2 1 0 . 0

E x p e c t e d L T P e r f o r m a n c eE x p e c t e d S T P e r f o r m a n c eO b s e r v e d P e r f o r m a n c eO v e r a l l ( L T ) C a p a b i l i t y

P o t e n t i a l ( S T ) C a p a b i l i t y

P r o c e s s D a t aS T

L T

4. PNP QA Results(SUB-BOARD)

Viscosity SPEC:200+50 pa.s

QA full inspection results

Test Position No.1 No.2 No.3 No.4 No.5 Checked Lot:1

X1 Passed Lot: 1

X2 LAR%:100%

X3 QA PASS Q'ty:72pcs

X4 PPM:0

Total

x

R

Process Capability Analysis - Solder Paste Thickness

Solder Paste Model: SUBAINT61

Solder Paste Height SPEC:130--210um (stencil thickness: 150um)

IPQC measured results: 210 pa.s IPQC measured results:(AVG: 171.2 um)

SMT adhesive model: NaIPQC measured results on adhesive tension

12345 Solder Paste Thickness

1 9 51 8 51 7 51 6 51 5 51 4 5

U S LL S L

P r o c e s s C a p a b i l i t y A n a l y s i s f o r C 1

P P M T o t a l

P P M > U S L

P P M < L S L

P P M T o t a l

P P M > U S L

P P M < L S L

P P M T o t a l

P P M > U S L

P P M < L S L

P p k

P P L

P P U

P p

C p m

C p k

C P L

C P U

C p

S t D e v ( L T )

S t D e v ( S T )

S a m p l e N

M e a n

L S L

T a r g e t

U S L

0 . 6 6

0 . 5 5

0 . 1 1

1 4 . 8 4

1 1 . 4 0

3 . 4 4

0 . 0 0

0 . 0 0

0 . 0 0

1 . 6 2

1 . 7 3

1 . 6 2

1 . 6 7

*

1 . 4 1

1 . 5 0

1 . 4 1

1 . 4 6

7 . 9 6 0 7 5

9 . 1 6 0 7 6

1 0

1 7 1 . 2

1 3 0 . 0

*

2 1 0 . 0

E x p e c t e d L T P e r f o r m a n c eE x p e c t e d S T P e r f o r m a n c eO b s e r v e d P e r f o r m a n c eO v e r a l l ( L T ) C a p a b i l i t y

P o t e n t i a l ( S T ) C a p a b i l i t y

P r o c e s s D a t aS T

L T

6. Assembly QA Summary

CUSTOMER CUSTOMER Model NAME SMT Model

Libra / / 577582

QUALITY CLASS /PLANMIN: 3.00%

ACC:

□ □ □Ⅰ Ⅱ Ⅲ MAJ: 0.40% ACC:

ITEM INSPECTION ITEM STANDARD SAMPLE Q'TY

COMPONENT

1.WRONG COMPONENT NO ACCEPT 10pcs

2.MISSING COMPONENT NO ACCEPT 10pcs

3.BROKEN COMPONENT IPC-A-610C-II 10pcs

4.REVERSE NO ACCEPT 10pcs

5.COMPONENT FLOAT UP IPC-A-610C-II 10pcs

6.COMPONENT APPEARANCE IPC-A-610C-II 10pcs

SOLDER

1.POOR SOLDER IPC-A-610C-II 10pcs

2.SHORT(OPEN) CIRCUIT NO ACCEPT 10pcs

3.SOLDER TIP IPC-A-610C-II 10pcs

4.SOLDER HOLE/BALL IPC-A-610C-II 10pcs

PCB

1.CIRCUIT BROKEN IPC-A-610C-II 10pcs

2.MISSING SOLDER MASK IPC-A-610C-II 10pcs

ACCOUNT: VISUAL DEFECT: 0 PCS MINOR DEFECT: 0 PCS

MAJOR DEFECT: 0 PCS

10 PCS REJ QTY: 0 PCS

REMARK:

CHECKED: Weimingxiong QA PIC: WeimingXiong

PCS

PCS

FUNCTION DEFECT: 0 PCS

ACC QTY: PCS

RESULT : □ ACC □REJ □ U.A.I □ ALL CHECK OTHERS

AQL AQL AQL

6. Assembly QA SummaryDATE 26.Jun.2006

SMT NAME LOT QTY

/ 72pcs

REJ: PCS

REJ: PCS

OK NG REMARK

10 pcs 0

11 pcs 0

12 pcs 0

13 pcs 0

14 pcs 0

15 pcs 0

16 pcs 0

17 pcs 0

18 pcs 0

19 pcs 0

20 pcs 0

21 pcs 0

MINOR DEFECT: 0 PCS

MAJOR DEFECT: 0 PCS

REJ QTY: 0 PCS

PE PIC: YilinChen

Assembly Section

Station Phenomena NG Qty. (pcs) Reasons Actions Location PIC Due Date REMARK

Wave soldering

此脚步不见脚步型No protuberant feet on the buttom

side for proper soldering

7. Conclusion

8.suggestion

a.fabricate the fixture for screw fixing

b.fabricate the fixture for label appling

There were total 10 pcs built in this phase ,the first pass yield 88.9%,last pass yield 100% ,the pending issues was mainly existed on the incoming materials problem.

There were total 10 pcs built in this phase ,the first pass yield 88.9%,last pass yield 100% ,the pending issues was mainly

Appendix A

Reflow Soldering Temperature Profile(MAIN BOARD)

Reflow Soldering Temperature Profile(SUB-BOARD)