What is a 3D IC? Could be Heterogeneous Stacked 2D (Conventional) ICs Motivation Interconnect structures increasingly consume more of the power and delay budgets in modern…

Slide 1Chip amount matches bet amount – Deal button near chips – Clear Button Slide 2 Arrows indicate action required – clear choices – clear card totals Slide 3…

Code-O-Crats Under NUTECH’15 presents QuizOfThings -Parth Agrawal (SomeGuy) Rules 3 Rounds Teams of 2-3 allowed Mobile phones prohibited A presentation on Why Cellphones…

Series in Materials Science and Engineering 3D Nanoelectronic Computer Architecture and Implementation Edited by David Crawley, Konstantin Nikolic´ and Michael Forshaw Department…

3D-IC Dynamic Thermal Analysis with Hierarchical and Configurable Chip Thermal Model Stephen H. Pan and Norman Chang Apache Design, Inc. Subsidiary of ANSYS, Inc. San Jose,…

Slide 1Mohammed Shahid Ali, A.R Nazmus Sakib, Dereje Agonafer. The University of Texas at Arlington. Slide 2  Trend in 3D packaging  3D TSV Package Introduction and…

International Technology Roadmap for Semiconductors (ITRS 2000) Assembly & Packaging International Technical Working Group December 6, 2000 2000 Changes Cost/pin Hand…