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Documents Page 1 Laminate Based System in Package (SiP) Utilizing High Density Interconnect (HDI) Substrates.....

Slide 1Page 1 Laminate Based System in Package (SiP) Utilizing High Density Interconnect (HDI) Substrates in High Reliability Applications Ron Nowak Senior Manager, Application…

Documents packaging-trends-in-2014-140302201354-phpapp01

2014
 PACKAGING TRENDS PRESENTED BY: PETER SENA @petesena Let’s take a look at the
 state of packaging today DID YOU KNOW? 64% of consumers will sometimes buy a product…