Documents NIST LeadfreeSolder v4 2

Database for Solder Properties with Emphasis on New Lead-free Solders National Institute of Standards and Technology & Colorado School of Mines Properties of Lead-Free…

Documents LOW COST AND LOW MASS BUMP BONDING SAMI VAEHAENEN – CERN PH-ESE 1.

Slide 1 LOW COST AND LOW MASS BUMP BONDING SAMI VAEHAENEN – CERN PH-ESE 1 Slide 2 Outline Introduction Electroless Ni Under Bump Metallization (UBM) deposition process…

Documents EMERGING FINE-PITCH BUMP BONDING TECHNIQUES SAMI VAEHAENEN – CERN PH-ESE LCD-WG4 Vertex detector.....

Slide 1 EMERGING FINE-PITCH BUMP BONDING TECHNIQUES SAMI VAEHAENEN – CERN PH-ESE LCD-WG4 Vertex detector technology meeting 3-September-2010 1 Slide 2 Outline Introduction…

Documents Low cost and low mass bump bonding

Low-cost Bump Bonding Project at CERN – status and future tests Low cost and low mass bump bonding Sami Vaehaenen – CERN PH-ESE 1 1 Outline Introduction Electroless Ni…