Slide 1 LOW COST AND LOW MASS BUMP BONDING SAMI VAEHAENEN – CERN PH-ESE 1 Slide 2 Outline Introduction Electroless Ni Under Bump Metallization (UBM) deposition process…
Slide 1 EMERGING FINE-PITCH BUMP BONDING TECHNIQUES SAMI VAEHAENEN – CERN PH-ESE LCD-WG4 Vertex detector technology meeting 3-September-2010 1 Slide 2 Outline Introduction…
Low-cost Bump Bonding Project at CERN – status and future tests Low cost and low mass bump bonding Sami Vaehaenen – CERN PH-ESE 1 1 Outline Introduction Electroless Ni…