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The process of removing heat from computer
components.
Excess heat must be dissipated in order to keep
the components within their safe operating
temperatures.
Varied cooling methods are also used to
achieve greater performance such as
overclocking.
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Excessive heat can cause all sorts of problems.
Overheated parts generally exhibit a shorter
maximum life-span and may give problems
resulting in system freezes or crashes.
Manufacturers have given very close tolerancesfor operating temperature and humidity.
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Using vacuum tubes
Using transistors
Using integrated circuits
Using microprocessors
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Vacuum tubes
produce heat while
operating.
This waste heat is
one of the principal
factors that affect
tube life.UNIVAC - I
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Method of anode cooling.
Radiates the heat by black body
radiation from the anode to the glass
envelope.
Natural air circulation, convection, then
removes the heat from the envelope.
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forced air cooling
adding fins to the anode. operating the anode at red hot
temperatures.
Tubes with external anodes may be
cooled using forced air, water, vapor,
and multiphase.
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There was less heat
generated per circuit.
There was only narrow
tolerances to temperature
variations.
A transistor, also normally
used as a switch, could turn
on accidently, when
overheated, causing chaos
in the system.AKAT - 1
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Room air conditioning
became very important.
Most systems were installed
on false floors, with a spaceof about 1 meter or 3ft
below the floor.
This allowed the air
conditioning to be supplied
under the floor, and
exhausted through the
false ceiling
A typical Air conditioning unit for cooling server racks.
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Tape drives(storage device) were particularly
large producers of heat.
Tapes produce a lot of heat due to the
powerful motors they use.
tapes and disks to be installed in a separate
room, or partitioned off from the mainframe, so
that air conditioning requirements could be
better controlled.
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Amount of heat generated
by an integrated circuit is
the prime cause of heat
build up in modern
computers.
It is a function of the
efficiency of its design, the
technology used in its
construction and the
frequency and voltage at
which it operates.
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In operation, the temperature levels of a computer's
components will rise until the temperature gradientbetween the computer parts and their surroundings is
such that the rate at which heat is lost to the
surroundings is equal to the rate at which heat is
being produced by the electronic component, and
thus the temperature of the component
reaches equilibrium.
For reliable operation, the equilibrium temperature
must be sufficiently low for the structure of the
computer's circuits to survive.
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Air Cooling
Liquid Cooling
Heat Sinks
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The term computer
fan usually refers to fans
attached to a computer.
Most common areCPU fan, GPU fan, Chipset
fan, PSU fan, HDD fan
& PCI slot fans.
It basically allows airflow that
will help cooling.
Size varies from 40mm
240mm dia.
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Sufficient number offans will create aneutral airflow that
will keep thetemperature inside
the cabin undercontrol.
Positions of fans isimportant.
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Air is drawn in at the front of the
rack and exhausted at the rear
blade chassis - In contrast to the
horizontal orientation of flat
servers, blade chassis are often
oriented vertically. This vertical
orientation
facilitates convection.
When the air is heated by the
hot components, it tends to flow
to the top on its own, creating a
natural air flow along the
boards.
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Submerse the computer's
components in a thermally
conductive liquid.
Does not require any fans or
pumps.
cooled exclusively by passive
heat exchange between the
computer's parts, the cooling
fluid and the ambient air.
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Water has the ability to
dissipate more heat from
the parts being cooled
than the various types of
metals used in heatsinks.
Can be set up to cool
the CPU
, GPU
, and othercomponents at the
same time with the same
system.
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Involves attaching a block of
machined or extruded metal to the
part that needs cooling.
This block usually has fins and ridges to
increase its surface area.
The heat conductivity of metal is much
better than that of air.
Its ability to radiate heat is better than
that of the component part it is
protecting.
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Same principle as passive, with
the addition of a fan that is
directed to blow over or
through the heat sink.
The moving air increases the
rate at which the heat sink can
exchange heat with the
ambient air.
Primary method of cooling a
modern processor or graphics
card.
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A hollow tube containing a heat
transfer liquid.
As the liquid evaporates, it carries
heat to the cool end, where it
condenses and then returns to the
hot end.
Heat pipes thus have a much
higher effective thermal
conductivity than solid materials.
In computers, the heat sink on the
CPU is attached to a larger radiator
heat sink by a large heat pipe.
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Dust acting as a thermal insulator and impeding airflow,
thereby reducing heat sink and fan performance.
Poor airflow including turbulence due to friction against
impeding components, or improper orientation of fans,
can reduce the amount of air flowing through a case
and even create localised whirlpools of hot air in thecase
Poor heat transfer due to a lack of, or poor application
of thermal compounds.
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Thermoelectric Cooling
Liquid Nitrogen Cooling
Liquid Helium Cooling
Phase-Change Cooling
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Run parts of computer (such as the CPU and GPU) at
higher voltages and frequencies than manufacturer
specifications call for.
This can dramatically increase the performance of the
computer.
Results in a greater amount of heat generated and thus
increasing the risk of damage to components and/or
premature failure.
More advanced and expensive cooling systems are
required in these cases.
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As liquid nitrogen evaporates at -
-196 C, far below the freezing
point of water, it is valuable as
an extreme coolant for short
overclocking sessions.
CPU will usually expire within a
relatively short period of time due
to temperature stress caused by
changes in internal temperature.
Liquid helium, colder than liquid
nitrogen, has also been used for
cooling.
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Based on Peltier effect inverse of Seebeck effect.
Applying a voltage to a thermocouple creates a
temperature difference between two sides.
Modern TECs use several stacked units each
composed of dozens or hundreds of thermocouples
laid out next to each other, which allows for a
substantial amount of heat transfer.
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Uses a compressor of the same type as in a
window air conditioner.
Compressor compresses a gas (or mixture of gases)which condenses it into a liquid.
Liquid evaporates (changing phase), absorbing the
heat from the processor.
The evaporation can produce temperatures
reaching around 15 to -150 degrees Celsius
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Some laptop components, such as hard drives and optical
drives, are commonly cooled by having them make contact
with the computer's frame, increasing the surface area whichcan radiate and otherwise exchange heat.
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Practice of running the CPU or any other
component with voltages below the device
specifications.
An undervolted component draws less power and
thus produces less heat.
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