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Department of Industrial Engineering Professor Shashi Shathaye Chinmay Raval Estevao Pinheiro Nikunj Jadawla MN-GY 7893: Production Science – Fall 2014 HAL Inc. Case Study – Production Science December 14, 2014
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  • 1

    Department of Industrial Engineering

    Professor Shashi Shathaye

    Chinmay Raval

    Estevao Pinheiro

    Nikunj Jadawla

    M N - G Y 7 8 9 3 : P r o d u c t i o n S c i e n c e F a l l 2 0 1 4

    HAL Inc. Case Study Production Science

    December 14, 2014

  • 2

    ACKNOWLEDGEMENT

    We would like to thank Prof. Robert Albano for his guidance and unconditional

    support throughout the course.

    Thank you.

    Chinmay Raval Estevao Pinheiro

    M.S. Industrial Engineering M.S. Industrial Engineering

    [email protected] [email protected]

    Nikunj Jadawala

    M.S. Industrial Engineering

    [email protected]

  • 3

    Table of Contents

    ACKNOWLEDGEMENT ................................................................................................................................... 2

    ABSTRACT ......................................................................................................................................................... 4

    INTRODUCTION (CURRENT SCENARIO) .................................................................................................. 5

    PROBLEMS FACED ........................................................................................................................................... 6

    DATA .................................................................................................................................................................... 7

    PROCESS FLOW DIAGRAM ........................................................................................................................... 8

    CALCULATIONS ................................................................................................................................................ 9

    VUT CHART (CURRENT SCENARIO) ....................................................................................................... 10

    VALUE STREAM MAPPING ......................................................................................................................... 11

    VUT CHART (RECOMMENDED) ................................................................................................................ 12

    LAYOUT OF PROCESS CENTERS (CURRENT SCENARIO) ................................................................. 13

    LAYOUT OF PROCESS CENTERS (RECOMMENDED) .......................................................................... 14

    IMPROVEMENTS AND RECOMMENDATIONS ...................................................................................... 15

    SUGGESTIONS ................................................................................................................................................ 16

  • 4

    ABSTRACT

    HAL, Inc. is a major manufacturer of computers and computer components producing Printed

    Circuit Boards (PCB's, also referred to as "Panels"). The plant was built in 1982 and has

    approximately 450,000 sq. ft. of manufacturing space which represents an $80 million investment.

    The company makes two families of products:

    Small Panels: These are 10" x 15" panels, the overall demand for which is gradually

    declining. There are roughly 40,000 different types of these panels, most of which are

    made for replacement parts in older computers.

    Large Panels: These are 19.5" x 24" panels, currently having 150 different types of large

    panels but the number for which is steadily increasing. They are primarily used for

    personal computer cards.

  • 5

    INTRODUCTION (CURRENT SCENARIO)

    The plant runs a 3 shift/day schedule but works for only 19.5hrs/day when breaks, lunches and

    shift changes are considered. For both the product families, the company follows a basic sequence

    of manufacturing operations:

    1. Treater Process

    2. Lamination-Core

    3. Machining

    4. Internal Circuitize

    5. Optical Test and Repair - Internal

    6. Lamination - Composites

    7. External Circuitize

    8. Optical Test and Repair - External

    9. Drilling

    10. Copper Plate

    11. Pro-coat

    12. Sizing

    13. End-of-line Test

    Some of the above stated process (specially Treater, Lamination, Copper Plate) are shared

    between the two product families. But before 1990, Large Panel line had a very low volume and a

    small range of part numbers. During that time order acceptance and scheduling were handled by

    the Production Control Department. The Manufacturing Department ran the line as the number of

    products was small, became accustomed to a de-facto rule of running only 1 part number per day

    on a process. Managing the line was easy as very few changeovers were required and the operators

    could develop a rhythm.

    By 1990, the number of large panels had increased to about 150 and the de-facto rule was no

    longer viable. Capacity estimated by the manufacturing department was to be more than 2000

    panels/day, but the daily output was around 1400panels/day. The actual amount of processing

    time required to make the PCB was less than 2 days and the manufacturing cycle times had grown

    to 34days. The number of PCB's (WIP) in the line had averaged about 47,600 in the recent months.

    While, the objective was estimated to be 3000panels/day.

  • 6

    PROBLEMS FACED

    Following problems were faced by the company, which were discussed during the 4:00 meeting

    of all the first line managers:

    Manufacturing department kept on changing the MRP schedule as per their needs of

    meeting the high priority customer orders. Due to this, the Production Control

    Department had to always change the MRP schedule as and when the manufacturing

    department prioritized the work. This made queues to build up and longer delays.

    The production control department contended that the 34 days cycle time actually had a

    20 days frozen period. Because of this, the manufacturing dept. made releases

    depending on forecast which were often poor or wrong resulting in wrong products

    being released. This in turn built up extra WIP in the system because of work waiting in

    the queue.

    The bottleneck machine moved from one machine to another because of variable

    breakdown amongst the various machines. This made it very difficult to manage the line

    since the WIP required to meet the schedule was not available due to machines breaking

    down.

    Understaffing was another reason for a machine becoming a bottleneck and hence the

    Large Panel Line seemed to be running below the expected capacity.

    Manufacturing said that the numbers generated for capacity by the manufacturing

    engineering team were unrealistic, even though the manufacturing personnel didn't have

    convincing reasons. Also, the workers were not motivated enough, which led to

    underproduction.

    Continuous evolution of products made it difficult to standardize the processes being

    used by the company.

    Errors were detected in a very later stage rather than detecting them in an earlier stage

    which led to loss of inventory, which in turn resulted in yield loss and/or rework and

    thereby resulting in loss of high capital.

    Managing the line was difficult as there was an uneven demand placed on the Large

    Panel Line. This was so because there was under production in some months while there

    was over production in the other leading to building up high WIP.

  • 7

    DATA

    A team of engineers from Manufacturing, Manufacturing Engineering and Production Control

    discussed about the capacity of Large Panel Line and compiled a set of capacity numbers

    representing the basic flow through the Large Panel Line. The data for the current production line is

    as follows:

  • 8

    PROCESS FLOW DIAGRAM

    External Internal

    Treator Tower

    Lamination Presses

    Lamination Machining

    Circuitise

    Internal Test & Repair

    Pro-coat

    EOL Sizing

    Copper Plate

    EOL Test

    External Test & Repair

    Drills

  • 9

    CALCULATIONS

  • 10

    VUT CHART (CURRENT SCENARIO)

  • 11

    VALUE STREAM MAPPING

  • 12

    VUT CHART (RECOMMENDED)

  • 13

    LAYOUT OF PROCESS CENTERS (CURRENT SCENARIO)

    Drills

    Copper Plate Internal

    Test & Repair Procoat

    EOL Sizing

    EOL Test

    Circuitize

    External Test & Repair

    Lamination

    Machining

    Lamination

    Presses

    Treater Tower

  • 14

    LAYOUT OF PROCESS CENTERS (RECOMMENDED)

    Drills

    Copper Plate Procoat Internal Test &

    Repair

    EOL Sizing

    EOL Test

    Circuitize

    External Test & Repair

    Lamination

    Machining

    Lamination

    Presses

    Treater Tower

  • 15

    IMPROVEMENTS AND RECOMMENDATIONS

    A new plant layout was designed which was streamlined and was favorable for the easy

    flow of products as it minimized the distances between workstations. Thus, reducing the

    non-bottleneck time.

    Increase the capacity of critical stations: Increasing capacity is enough to reach the

    production of 3000 panels/day, but value of WIP increases. This can be overcome by

    reducing the variation.

    Workers should be cross-trained to perform tasks on various stations to reduce or minimize

    understaffing problems.

    To reduce the machine breakdowns which cause bottlenecks, schedule preventive

    maintenance.

    Maintenance reports must be checked and discussed in the daily meetings.

    Introduce Push/ Pull boundary in the production flow process to maintain standardization

    of parts and reduce variability in products.

    Implement quality control checks at major stations to detect the problems in early stages of

    the production process.

  • 16

    SUGGESTIONS