- 39 - 이슈 3 차세대 반도체 공정/소자 개발 동향 한태희 반도체 PD KEIT PD ISSUE VOL 11-4
- 39 -
3 /
PD
KEIT PD ISSUE VOL 11-4
- 41 -
3. /
, ,
IT , ,
,
,
Breakthrough
,
- 3D 20 D
,
3
- 42 -
.
1.
, , ,
, , ,
* : (09.9)
[ 1 : ]
, ,
, , 5
- 43 -
[ 1 : ]
( : )
PC 640 487 TV 125 13 84
264 177 LCD 103 40 29
342 226 1 75 18
34 Gray 22 e- 5 31 25
24 LAN 52 STB 41 15 40
SSD 16 37 DSC 66 11 58
23 26 PMP/MP3 68 2 28
* : KSIA 2010
, (,
) //
* : 2011
[ 2 : ]
- 44 -
2.
/
Application
, , ,
, ,
, /
Needs
// 20nm
IT ,
,
- 45 -
.
1.
3,045(09)
50% 14.6%
3
[ 2 : 2010 ]( : , %)
410.3 13.5 1,467.1 48.2 632.5 20.8 280.2 9.2 3,040.8
336.0 50.0 128.6 19.1 140.4 20.9 6.6 1.0 673.4
45.2 2.9 1,198.7 64.0 290.5 15.5 188.7 10.1 1,874.4
19.1 3.9 139.8 28.3 201.5 40.9 84.8 17.2 493.0
18.3 5.5 65.8 19.7 190.2 57.0 8.3 2.5 333.8
* : 2011 (iSuppli '11)
2.
D-TV,
IT
, 2013 ,
IT 10%
- 46 -
[ 3 : ]( : US$, )
2009 2010 2011 2012 2013 CAGR
Total Market 3,045 3,573 3,853 4,136 4,264 8.8%
447 535 562 574 507 3.2%
1,575 1,790 1,879 2,000 2,059 6.9%
IT 448 519 573 639 691 11.5%
167 294 364 404 446 27.0%
409 435 475 519 561 8.3%
* : 2011 (isuppli 2010.3, Gartner 2010.3)
.
1.
Auska II , Mirai
- , 50
NSF 18.2M , IBM, TI,
AMD, Freescale, Micron
EU 10 3 ()
IMEC() ()
- 47 -
4G LTE ST-
, Freescale, MediaTek
VDEC ,
, ,
- , NEC, Fujitsu LTE SoC
LTE 3G ST- Huawei
WiFi, Bluetooth, GPS Wireless connectivity
, CSR, , TI
- WiFi
Infineon, ST Micro, Fairchild
, , ,
LED IC
IT
2030 02
3 , , LiS
- HEV 85% , PHVEV
Alcatel-Lucent, Cisco, Fujitsu Finisar,
Opnext, Emcore, JDSU
TI, ST Micro, Fairchild TSMC,
UMC, X-Fab
- 48 -
//
ArF ArF immersion double patterning
EUV IMEC
, High-k/Metal Gate
300mm Fab 450mm Fab
/ , , TSMC
2.
, 40 D
20 , 30
, P
3
PCRAM, ReRAM , STT-M
KIST
2G, 3G /
DMB, WiBro
- 49 -
B3G 4G ETRI
LTE (08) LG LTE
(AP) 62.6%
,
* DDI(Display Driver IC, 3 / 21.5%), CIS(CMOS Image Sensor, 4 / 12%)
* 09 : 34, 8.6, PC CPU 7
3DLED TV (Scaler, MPEG decoder), DTV , 3D
,
CPU,
IT
RFID/USN, ,
,
- 99 LG, 00 SDI
(09 24.5)
- 20%
PON WDM-PON
//
- 50 -
//
7
- , 20 , High-k gate/metal
ALD , PECVD ,
* 7 : , , LED, , , ,
* (09) : 11.1%, 41.4%, EU
( 7)
TSV
3D
. /
, ( )
,
() Ge,
() ArF
(EUV)
- EUV(Extreme UltraViolet) :
() DPT, SPT, Cell Shrink, TSV
- 51 -
- DPT(Double Patterning Tech.) : 2
design rule 1/2
- SPT(Spacer Patterning Tech.) :
- Cell Shrink : 4
- TSV(Through Silicon Via) :
- Wafer Immersion Lithography :
ArF
1. /
2 2 Moore
40
,
14
,
Gate
, Al
Cu
- 52 -
* : Semiconductor & FPD Monthly 201105
[ 3 : MOS FET ]
lithography ()
13.5nm X
EUV
* EUV : (Extreme Ultra Violet)
(Stepper)
* : Semiconductor & FPD Monthly 201105
[ 4 : ]
- 53 -
(Optical Proximity Correction)
2. /
Gate
Leak
Hf (HfO2) (Hf-SiO), Hf-Si-ON,
(Hf-Al-O)
Si SiGe Epitaxi Si
Si MOS FET
-
SourceDrain
, eV
(RTA; Rapid Thermal Annealing)
Annealing
- 54 -
(Low-k)
Cu Dry Etching Duel Damasecene
* : Semiconductor & FPD Monthly 201105
[ 5 : Dual Damascene process]
[ 4 : Low-k ]
Si
SOG HSQ MSQ BCB Teflon Porous MSQ Xerogels
2.74.0 2.93.2 2.62.8 2.62.7 2.1 1.72.2 1.12.2
* : Semiconductor & FPD Monthly 201105
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3.
1 () 3D Transistor
5 4, 22nm (Ivy Bridge) 3D Transistor
-(Tri-Gate)
CPU ,
3D Tr.
* ('03-'09) : 62 120B$ 1/3 58B$
3D Tr. 10
* 3D Tr. : 1 3D Tr.('02) 3D Tr.('03) 3D Tr. S ('06)
* 3D Tr Gate 37%, 50%, 2-3%
< 2D 3D (FinFET) >
22
AP
PC SoC
PC 3D Tr.
+
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* 40W ( ) 15W ()
2 (IDF 2011 )
* , 3D Tr. PC
, ARM SoC
GPU( )
2 () 25nm D
4 25, 25nm 7
* 30nm 20nm 30% 20%
'80 (D) 80%
('99 ) D 16.2% 3
, '11.1Q 4
, '10 16% 13.5%
* ()/(%) : (08) 36.0/15.2 (09) 39.5/17.4 (10) 64.5/16.2
(11.1A) 11.2/13.6
* ()/(%) : (08) 9.0/8.4 (09) 4.2/9.0 (10) 7.4/6.7 (11)
4.6/5.3
* D (%) : () 17.9, () 12.0, () 8.0, () 5.7
,
, 6 (30nm )
* ( ) : 40nm('09.10 /'09 '10 1 ),
30nm(10.09 /'10.12 '11.05 )
30nm 5 , 20nm 7
, 6
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< (iSuppli) >
2009 2010 2011
1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q
7xnm 22% 11% 3% 1% 1% 0% 0% 0% 0% 0% 0% 0%
6xnm 78% 89% 97% 99% 88% 70% 51% 34% 25% 8% 3% 0%
5xnm 0% 0% 0% 0% 9% 23% 34% 36% 35% 26% 21% 11%
4xnm 0% 0% 0% 0% 2% 7% 15% 30% 41% 66% 70% 75%
3xnm 0% 0% 0% 0% 0% 0% 0% 0% 0% 2% 7% 13%
< D (11.1Q) >
70 0% 0% 1% 0% 0% 71% 0% 0%
60 0% 1% 7% 25% 0% 29% 0% 89%
50 21% 34% 72% 35% 70% 0% 87% 0%
40 75% 65% 20% 41% 30% 0% 13% 11%
30 4% 0% 0% 0% 0% 0% 0% 0%
20 0% 0% 0% 0% 0% 0% 0% 0%
< D (11.1Q) >
/
()
()
()
600%
07 3
1%
07 2
25%
08 3
5021%
08 4
34%
08 235%
4075%
09 7
65%
09 4
41%
10 1
304%
10 7
0%
11 1
0%
11 5
200%
11
0%
12
0%
11 7
3 () AP TSMC
AP A5
TSMC
- 58 -
AP
* AP '10 ,
AP
(: A4A5)
4Q A5 , A6
* 2010 (%) : (TSMC) 38.5, (UMC) 11.6, GF 11.3, () 2.5
4 () 3 14
6 1, PC 2011
3 14
3 32 22 14
22 3D
12
5 () ATIC
ATIC AMD
219% 2 UMC
2% , , TSMC
- 59 -
.
- , SW+ 3F
- 3F(Fusion + Future + Frontier) : + +
TV, PC
SW SoC
( )
-
- (: 3D )
, ,
,
3
- 60 -
< >
2009 2010 2011 2012 2013 2014CAGR
('10-'14)
404,206 443,505 471,269 500,883 518,501 532,786 4.7% 5,676 6,508 7,216 7,960 8,668 9,347 9.5% 86,088 117,711 119,498 120,719 120,404 125,451 1.6%
PC136,188 152,741 169,336 191,754 207,568 220,664 9.6%
308 354 411 477 526 558 12.0%47,512 64,038 62,015 67,521 62,978 65,374 0.5%
11,306 10,495 10,015 9,581 9,083 8,247 -5.8%
33 34 35 36 37 36 1.4%2,902 3,357 3,093 2,902 2,734 2,737 -5.0%
- 6,237 13,572 21,856 30,058 38,232 57.3%- 19 55 103 154 208 81.9%- 2,367 5,819 10,273 14,069 17,791 65.6%
218,196 251,057 302,718 338,164 379,709 413,271 13.3%3,051 3,358 3,729 3,938 4,208 4,404 7.0%47,454 59,072 72,621 75,025 83,844 95,842 12.9%
176,442 207,193 238,163 258,524 282,533 300,752 9.8%1,340 1,604 1,801 1,974 2,120 2,226 8.5%39,547 48,727 55,376 58,822 63,023 67,138 8.3%
57,418 85,254 119,755 146,399 178,796 202,955 24.2%
180 280 432 581 745 898 33.8%11,268 17,693 25,475 31,105 37,218 43,166 25.0%
Gray8,134 11,856 12,750 10,011 8,640 7,515 -10.8%145 228 255 213 192 167 -7.5%
1,416 2,228 2,203 1,498 1,229 1,083 -16.5%
321,706 338,383 353,025 372,958 383,147 385,945 3.3%14,997 15,584 16,006 16,611 17,227 17,715 3.3%44,611 57,706 59,219 59,362 60,997 63,558 2.4%
TV99,217 109,055 121,403 136,081 139,568 136,148 5.7%
213 232 241 263 280 292 5.9%8,296 12,542 13,745 14,839 15,772 16,563 7.2%
E-Book811 1,526 2,137 2,319 2,421 2,387 11.8%5 10 17 21 24 25 25.7%
236 533 747 824 853 827 11.6%
()81,215 92,421 97,502 102,732 107,913 113,265 5.2%15,299 21,587 21,910 23,204 24,758 26,572 5.3%
Power Train23,555 27,418 29,200 30,952 32,655 34,418 5.8%5,141 7,498 7,813 8,227 8,789 9,563 6.3%
Safety10,275 11,991 12,914 13,844 14,799 15,806 7.1%2,097 3,076 3,160 3,358 3,597 3,902 6.1%
298,994 332,042 351,847 367,781 387,072 408,786 5.3%21,227 28,258 28,514 29,121 30,918 31,977 3.1%
73,617 79,175 84,014 89,327 95,902 102,442 6.7%6,639 8,424 8,383 8,565 9,166 9,529 3.1%
1,410,367 1,554,775 1,679,815 1,791,040 1,890,993 1,973,230 6.1%
10,701 11,991 13,147 14,206 15,282 16,253 7.9%229,506 304,006 320,549 326,017 339,826 364,232 4.6%
: ISuppli/Gartner '10, /