Transcript
Seminar Report on System on Chips
By
D. Venkatesh(Y09EI017)
B. Vamsi Satwik(Y09Ei007)
V. Santosh(Y09EI055)
Ch. Apparao(Y09EI003)
(IV/IV B.Tech, EIE)
Project Batch No:09
Project Guide: Mr. G. Jalalu
Assoc. Professor
Introduction
Technological Advances
today’s chip can contains 100M transistors .
transistor gate lengths are now in term of nano meters .
The number of transistors is based on Moore’s law .
The Consequences
components connected on a Printed Circuit Board can now be integrated onto single chip .
hence the development of System-On-Chip design .
SoC: System on Chip
System
A collection of all kinds of components and/or subsystems
that are appropriately interconnected to perform the
specified functions for end users.
A SoC design is a “product creation process”
which
Starts at identifying the end-user needs (or system)
Hardware
Software
Ends at delivering a product with enough functional
satisfaction to overcome the payment from the end-user
What is SoC ?
The VLSI manufacturing technology
advances has made possible to put
millions of transistors on a single chip.
It enables designers to put systems-on-a-
chip that move everything from the board
onto the chip eventually.
SoC not only chip, but more on “system”.
SoC = Chip + Software + Integration
The SoC chip includes:
Embedded processor
ASIC Logics and analog circuitry
Embedded memory
The SoC Software includes:
OS, compiler, simulator, firmware, driver, protoco
l stackIntegrated development environment
(debugger, linker, ICE)Application interface
(C/C++, assembly)
Example: Mobile Phone
Voice only; 2 processors
4 year product life cycle
Short talk time
Yesterday
Voice, data, video, SMS
<12 month product life cycle
Lower power; longer talk time
Today
• 5~8 Processors
• Memory
• Graphics
• Bluetooth
• GPS
• Radio
• WLAN
Single Chip
DSP
Radio
Flash
Memory
Processor
SOC Complexity / Abstraction
Yesterday Today
•Processor-centric (1 or 2)
•Simple I/O
•Manageable Complexity
•Many processing units
•Large amount of I/O
•Overwhelming Complexity!
Material Preparation
First stage.
Ordinary sand to pure
Si crystals.
Here the sand with
high silica content is
exposed to high
temperature ,where
the silica is turned
into crystals
Silicon rod preparation
Si crystals collected
in chamber.
Crystals converted
into perfectly shaped
rods with the help of
moulds.
This is done at high
temperatures.
Wafer Fabrication
2nd stage.
Si rod sliced into this
discs with great
accuracy called wafer.
Each disc is few mm
in thickness.
Each wafer will grow
100’s of transistors.
lithography
This is the most
important technique.
Si wafers are coated
with Light sensitive
photo sensitive
material.
These this disk’s are
then exposed to U.V
rays.
Etching
Acids are applied.
The unprotected
parts are etched away.
Tiny structures of
billions of small
switches are
generated which acts
as Transistors.
Several billions of
transistors are
generated and
connected forming
several 100’s of chip
on a single wafer.
Testing
Tests each chip for
manufacturing
defects.
For early identification
and elimination of
defective parts.
Reduces assembly
cost.
Laser cutting
Wafer then sliced into
several small
individual
components called
chips
Each part sent to
packaging unit
Major SoC Applications
Speech Signal Processing .
Image and Video Signal Processing .
Information Technologies
PC interface (USB, PCI,PCI-Express, IDE,..etc)
Computer peripheries (printer control, LCD monitor
controller, DVD controller,.etc) .
Data Communication
Wireline Communication: 10/100 Based-T, xDSL, Gigabit
Ethernet,.. Etc
Wireless communication:
BlueTooth, WLAN, 2G/3G/4G, WiMax, UWB, …,etc
The Benefits
• There are several benefits in integrating a large
digital system into a single integrated circuit .
• These include
– Lower cost per gate .
– Lower power consumption .
– Faster circuit operation .
– More reliable implementation .
– Smaller physical size .
– Greater design security .
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