Final

Seminar Report on System on Chips

By

D. Venkatesh(Y09EI017)

B. Vamsi Satwik(Y09Ei007)

V. Santosh(Y09EI055)

Ch. Apparao(Y09EI003)

(IV/IV B.Tech, EIE)

Project Batch No:09

Project Guide: Mr. G. Jalalu

Assoc. Professor

Introduction to SoC

Introduction

Technological Advances

today’s chip can contains 100M transistors .

transistor gate lengths are now in term of nano meters .

The number of transistors is based on Moore’s law .

The Consequences

components connected on a Printed Circuit Board can now be integrated onto single chip .

hence the development of System-On-Chip design .

SoC: System on Chip

System

A collection of all kinds of components and/or subsystems

that are appropriately interconnected to perform the

specified functions for end users.

A SoC design is a “product creation process”

which

Starts at identifying the end-user needs (or system)

Hardware

Software

Ends at delivering a product with enough functional

satisfaction to overcome the payment from the end-user

What is SoC ?

The VLSI manufacturing technology

advances has made possible to put

millions of transistors on a single chip.

It enables designers to put systems-on-a-

chip that move everything from the board

onto the chip eventually.

SoC not only chip, but more on “system”.

SoC = Chip + Software + Integration

The SoC chip includes:

Embedded processor

ASIC Logics and analog circuitry

Embedded memory

The SoC Software includes:

OS, compiler, simulator, firmware, driver, protoco

l stackIntegrated development environment

(debugger, linker, ICE)Application interface

(C/C++, assembly)

What is SoC in your mind?

Definition: integration of a complete system

onto a single IC

SoC Evolution

First phase Second phase Third phase

Example: Mobile Phone

Voice only; 2 processors

4 year product life cycle

Short talk time

Yesterday

Voice, data, video, SMS

<12 month product life cycle

Lower power; longer talk time

Today

• 5~8 Processors

• Memory

• Graphics

• Bluetooth

• GPS

• Radio

• WLAN

Single Chip

DSP

Radio

Flash

Memory

Processor

Where SoC Goes To?

SOC Complexity / Abstraction

Yesterday Today

•Processor-centric (1 or 2)

•Simple I/O

•Manageable Complexity

•Many processing units

•Large amount of I/O

•Overwhelming Complexity!

Material Preparation

First stage.

Ordinary sand to pure

Si crystals.

Here the sand with

high silica content is

exposed to high

temperature ,where

the silica is turned

into crystals

Silicon rod preparation

Si crystals collected

in chamber.

Crystals converted

into perfectly shaped

rods with the help of

moulds.

This is done at high

temperatures.

Wafer Fabrication

2nd stage.

Si rod sliced into this

discs with great

accuracy called wafer.

Each disc is few mm

in thickness.

Each wafer will grow

100’s of transistors.

lithography

This is the most

important technique.

Si wafers are coated

with Light sensitive

photo sensitive

material.

These this disk’s are

then exposed to U.V

rays.

The exposed parts are

soluble.

This soluble part is

removed by cleaning

with fluid.

Etching

Acids are applied.

The unprotected

parts are etched away.

Tiny structures of

billions of small

switches are

generated which acts

as Transistors.

Several billions of

transistors are

generated and

connected forming

several 100’s of chip

on a single wafer.

Testing

Tests each chip for

manufacturing

defects.

For early identification

and elimination of

defective parts.

Reduces assembly

cost.

Laser cutting

Wafer then sliced into

several small

individual

components called

chips

Each part sent to

packaging unit

Assembling of chips

Each chip is

assembled as per

requirement.

Major SoC Applications

Speech Signal Processing .

Image and Video Signal Processing .

Information Technologies

PC interface (USB, PCI,PCI-Express, IDE,..etc)

Computer peripheries (printer control, LCD monitor

controller, DVD controller,.etc) .

Data Communication

Wireline Communication: 10/100 Based-T, xDSL, Gigabit

Ethernet,.. Etc

Wireless communication:

BlueTooth, WLAN, 2G/3G/4G, WiMax, UWB, …,etc

The Benefits

• There are several benefits in integrating a large

digital system into a single integrated circuit .

• These include

– Lower cost per gate .

– Lower power consumption .

– Faster circuit operation .

– More reliable implementation .

– Smaller physical size .

– Greater design security .