Slide 1EE464 Digital Systems Packaging Spring, 11 David M. Zar CSE Department Washington University [email protected] Slide 2 Packaging-2 - David M. Zar - 11/26/2015 Chapter…
APV25 for SuperBelle SVD M.Friedl HEPHY Vienna Markus Friedl (HEPHY Vienna) APV25 Developed for CMS by IC London and RAL (70k chips installed) 0.25 µm CMOS process (>100…
EE464 Digital Systems Packaging Spring, 2009 David M. Zar CSE Department Washington University [email protected] Chapter 1 of Text Why? It’s there Cover in order Future/Trends/What-Next…