DOCUMENT RESOURCES FOR EVERYONE
Documents tagged
Documents L7805CV

L7800 SERIES POSITIVE VOLTAGE REGULATORS s s s s s OUTPUT CURRENT TO 1.5A OUTPUT VOLTAGES OF 5; 5.2; 6; 8; 8.5; 9; 12; 15; 18; 24V THERMAL OVERLOAD PROTECTION SHORT CIRCUIT…

Technology Dig c curr

1. DigCCurr 2009Digital Curation Tools and Demos II Mediapedia:managing the identification of media carriers carriers. Prometheus:managing the ingest of media carriers at…

Business 7818

1/29February 2003 n OUTPUT CURRENT TO 1.5A n OUTPUT VOLTAGES OF 5; 5.2; 6; 8; 8.5; 9; 12; 15; 18; 24V n THERMAL OVERLOAD PROTECTION n SHORT CIRCUIT PROTECTION n OUTPUT TRANSITION…

Technology Breakthrough in Quality Management

Breakthrough in Quality management Dan Glotter CEO & Founder OptimalTest Devices’ Quality drive profitability  Big electronics players changed the game rules …

Technology Escape Prevention & RMA Management

Dan Glotter CEO & Founder OptimalTest Escape prevention & RMA management Trends driving quality (1) -- Wafer level packaging -- (WLCSP | WCSP | WLP | WLBGA) 7/1/2013…

Technology "Escape Prevention and RMA Management"

1. Dan GlotterCEO & Founder, OptimalTest9 September 2013Escape prevention& RMA managementIt’s time to check is “good” really good ? 2. QualityTop fabless executives…

Documents MP1472 - MonolithicPower

MP1472 2A, 18V Synchronous Rectified Step-Down Converter MP1472 Rev. 1.0 www.MonolithicPower.com 1 9/2/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy…

Documents APDS 9960 Digital Proximity Ambient Light RGB and Gesture Sensor

APDS-9960 Digital Proximity, Ambient Light, RGB and Gesture Sensor Data Sheet Description The APDS-9960 device features advanced Gesture detec- tion, Proximity detection,…

Documents MP1582EN

M PS C ON FI DE NT IA L DO N OT D IS TR IB UT E MP1582 2A, 28V, 1.5MHz Step-Down Converter MPS CONFIDENTIAL AND PROPRIETARY INFORMATION – SUPA USE ONLY MP1582 Rev. 1.0…

Documents M.Nuzaihan DMT 243 – Chapter 3 Wafer Backgrinding, Die Preparation, Die Attach, Wire Bonding, Die....

Slide 1 M.Nuzaihan DMT 243 – Chapter 3 Wafer Backgrinding, Die Preparation, Die Attach, Wire Bonding, Die Overcoat, Molding, Sealing, Marking, DTFS, Lead Finish, Electrical…