Documents M.Nuzaihan DMT 243 – Chapter 3 Wafer Backgrinding, Die Preparation, Die Attach, Wire Bonding, Die....

Slide 1 M.Nuzaihan DMT 243 – Chapter 3 Wafer Backgrinding, Die Preparation, Die Attach, Wire Bonding, Die Overcoat, Molding, Sealing, Marking, DTFS, Lead Finish, Electrical…