PoP Assembly PoP Assembly Challenges • The widely adopted process for PoP assembly is single pass reflow of the top and bottom packages after being assembled on the PCB.…

Report of Industrial Training at ITI Bangalore 2012 About the Company: India’s first Public Sector Unit (PSU) - ITI Ltd was established in 1948. Ever since, as a pioneering…

JEDEC STANDARD High Temperature Package Warpage Measurement Methodology JESD22B112 MAY 2005 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications…

ACHI ® Settings of parameter for ACHI® series BGA Rework Stations 1 First, we need to know the difference between lead ball(the melting point is 183 ) and lead-free ball(217…

1. Manufacturability andReliability of 0.3mm Pitch ChipScale Packages and QFNsGreg Caswell December 6, 20111 2. Focus on Quality/Reliability/Durability of Electronics2TechInsertionDesignSupplyChainWarrantyTestAll…

1. BGA Rework-Cleaning and InspectionRework and Repair of PCBs  Solder/Assembly Training Rework/Repair Soldering Tools www.solder.net 2. BGA Rework I. II. III.Why…

1. BGA MACHINE MODELS 1.RE7500 : (including accessories worth 15000 : stencils set 479 pcs, 3 solder balls, 1 BGA flux, debug card for laptop & desktop) 2.Jetronix Eco…

1. BGA MACHINEMODELS1.RE7500 : (including accessoriesworth 15000 : stencils set 479 pcs, 3solder balls, 1 BGA flux, debug card forlaptop & desktop)2.Jetronix Eco3.IR360…

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given…

REMEMBER THE DAYS when everything was in a DIP package? Big parts, easy to see, easily fixed by the soldering techni- cian. Those glorious days are gone. Ev- ery component,…