DOCUMENT RESOURCES FOR EVERYONE
Documents tagged
Technology Avnet IP&E Technology Guide: Interconnect, Passive and Electromechanical Products

This guide simplifies application design and accelerates time-to-market by defining basic, system-level Interconnect, Passive and Electromechanical (IP&E)building blocks.…

Documents Cosmos Floworks 2006

2006 Contents First Steps - Ball Valve Design Open the SolidWorks Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Create a…

Documents TE147-163

5. Overvoltage protection • it is often advisable to install overvoltage protection as a precautionary measure in case of abnormal operating conditions. 5.1 Reasons for…

Documents UC12.Chapter02

The components of the System Unit System Unit  System unit: The main case of a computer  The case of the system unit sometimes called Chassis  Houses the computer…

Documents Cosmos 2008 Tutorial

Contents First Steps - Ball Valve Design Open the SolidWorks Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Create a COSMOSFloWorks…

Documents Solidworks - Flow Simulation-2009 - Tutorial

S l Wo k Fo Smua in 2 0 oi d r s lw i lt o 09 T tr l uoi a Contents First Steps - Ball Valve Design Open the SolidWorks Model. . . . . . . . . . . . . . . . . . . . . . .…

Documents To Make Comparative Study on Motherboards

Basic Hardware To Make Comparative Study on Motherboards MOTHERBOARD A motherboard (sometimes alternatively known as the Mainboard, mobo (abbreviation), MB (abbreviation),…

Documents HeatSink Basics Cisco Core v6

Heat Sink Basics Christine Nolan-Brady Technical Leader NPI/PLM GPO February 2009 © 2009 Cisco Systems, Inc. All rights reserved. Cisco Confidential 1 Objectives of this…

Documents Buck Converter

STUDY AND DESIGN OF BUCK CONVERTER ANIRBAN DASGUPTA & ANTIP GHOSH ELECTRICAL ENGG., NIT, ROURKELA ABSTRACT This project is based on the study and design of a buck converter…

Documents Chapter II

Literature Review CHAPTER 2 LITERATURE REVIEW 2.1 Introduction A new class of materials based on organic and inorganic species combined at nanoscale level has gained ever…