Documents FR8695_IndProj

1. Manufacturing Process Mechanics Individual Project (P2R2) NAME: SIDDHESH OZARKAR [email protected]  DESIGNATION OF MODEL: P2R2 Model Number 2 with Radius of 0.015mm…

Documents 0c96052cc399abcce8000000.pdf

See discussions, stats, and author profiles for this publication at: http://www.researchgate.net/publication/222837321 Experimental damage mechanics of microelectronic solder…

Documents Lee2011a.pdf

1 A CREEP MODEL FOR SOLDER ALLOYS Yongchang Lee1,2 Cemal Basaran1 1 Electronic Packaging Laboratory, State University of New York at Buffalo and 2 University of Tabuk, Saudi…