Thermo-Mechanical Simulations of
a Copper-to-Copper Direct Bonded 3D TSV Chip Package Interaction Test Vehicle
Ah-Young Park1, Daniel Ferrone1, Stephen Cain1, Dae Young Jung1, Bruce T. Murray1, Seungbae Park1, Klaus Hummler2
1 State University of New York at Binghamton, Binghamton, NY, USA 2 SEMATECH, Albany, NY, USA
