WAFER HANDLING COMPONENTS for the semiconductor industry
2
EFFICIENT & ECONOMICAL WAFER HANDLERSYOUR ADDED VALUE IN THE SEMI-CONDUCTOR INDUSTRY
• customer-specific solutions• high production depth made in Germany• ISO 1 Clean room certification for wafer handlers• free training for new customers• throughput analysis
33
This catalogue contains a variety of robotic products offered by the isel group. Our products are specifically designed and engineered to address the unique needs and requirements of the semiconductor, flat panel display, nano-technology, and related industries.
If you have special applications or product require-ments please contact us. With several thousand systems in field and many years of experience, we look forward to receiving your inquiries.
CONTENTGeneral ......................................................................4 Wafer handling robots .............................................8 Controller and software ...........................................20 Endeffectors ..............................................................24 Accessories ..............................................................26 Linear Track ..............................................................28 Prealigners ...............................................................30 Quality assurance and references .............................32 About us ..................................................................33 Notes .......................................................................34
Thomas VöllingerDivision manager+49 (0) 6659 [email protected]
Andreas MöllerTechnical sales+49 (0) 6659 [email protected]
Michael RaschkeService+49 (0) 6659 [email protected]
Vanessa KrackTeam assistant+49 (0) 6659 [email protected]
4
INNOVATIVE TECHNOLOGYThe ADVANCED controller has a defined path speed, so that speed and accelera-tion focus on the tool centre point (TCP) and not on the individual axes.
55
FIRST CLASS SERVICEFree training for new customers, telephone support and ongoing project support from experienced isel technicians. Our main focus is always to please our customers with excellent service. Trust our worldwide service, e.g. with long-term partners in Asia or our partner in the USA. The high spare part availability reduces your downtime to a minimum.
66
CUSTOMER-SPECIFIC SOLUTIONSYou will get the perfect handling system for your production. On request, we can tailor your handling robots individually from isel compo-nents to provide high-performance automation solutions that are optimally aligned to your production requirements and with significantly short production times. If the standard cannot meet the requirements, we offer you individual solutions.
7
INNOVATIVE ROBOT TECHNOLOGY FOR WAFER HANDLINGRobust and long-lasting-all-in-on solutions, customer-specific manufacturing, compre-hensive project support: isel Germany AG is the perfect partner for wafer handling components in the semiconductor industry.
8
WAFER HANDLING ROBOT | IWH WITH 2-LINK COMPACT ARM AND 7" BODY SERIES 1
CHARACTERISTICS• wafer handling up to 200 mm• cost-effective• excellent structural rigidity and precision• maximum reliability • top mounted (TA) or bottom mounted (BA)
versions available• customized solutions• incremental encoder• seamless integration with prealigner, linear
track and other peripheral components• including „STANDARD“ controller and software• ISO 1 clean-room environment compatible• MTBF: >70,000 operating hours
SPECIFICATIONS
Repeatability
T ±0.02°
R ±0.02 mm
Z ±0.02 mm
Working range
Z 7"
radial 10", 14"
theta 450°
Payload up to 1 kg*
Maximum speed
T 360°/s
R 1,000 mm/s
Z 450 mm/s
Power supply115 – 230 VAC 50 – 60 Hz 300 VA
Main interface RS-232 [DB9],Ethernet [RJ-45]
Weight approx. 19 kg
* depending on arm configuration
IWH TA07S10 F-1 (endeffector see page 24)
9
323,7 (S10)
430,8 (S14) 323,7 (S10)
430,8 (S14)
25
57
49
35,3 4x M3
S10
25
57
65
35,34x M3
50,84x M4
S14
323,7 (S10)
430,8 (S14) 323,7 (S10)
430,8 (S14)
25
57
49
35,3 4x M3
S10
25
57
65
35,34x M3
50,84x M4
S14
323,7 (S10)
430,8 (S14) 323,7 (S10)
430,8 (S14)
25
57
49
35,3
4x M3S10
25
57
65
35,34x M3
50,84x M4
S14
323,7 (S10)
430,8 (S14) 323,7 (S10)
430,8 (S14)
25
57
49
35,3 4x M3
S10
25
57
65
35,34x M3
50,84x M4
S14
IWH TA 07S_F-1 IWH BA 07S_F-1DIMENSIONS
10
IWH TA10S10HD F-1
Fraunhofer
IPAT E S T E DD E V I C E
isel Germany AGIWH-BA13S14HDF-1
Report No. IS 1103-547
WAFER HANDLING ROBOT | IWH WITH 2-LINK HEAVY DUTY ARM AND BODY SERIES 1
CHARACTERISTICS• excellent structural rigidity and precision• maximum reliability • top mounted (TA) or bottom mounted (BA)
versions available• customized solutions• absolute or incremental encoder• seamless integration with prealigner,
linear track and other peripheral components• including „STANDARD“ or „ADVANCED“
controller and software• ISO 1 clean-room
environment compatible• MTBF: >70,000 operating hours
SPECIFICATIONS
Repeatability
T ±0.02°
R ±0.02 mm
Z ±0.02 mm
Working range
Z 10", 13", 17", 21"
radial 10", 12", 14", 16", 20"
theta 500°
Payload up to 3 kg*
Maximum speed
T 360°/s
R 1,000 mm/s
Z 450 mm/s
Power supply
115 – 230 VAC 50 – 60 Hz500 VA (STANDARD)550 VA (ADVANCED)
Main interface RS-232 [DB9],Ethernet [RJ-45]
Weight approx. 25 – 32 kg
* depending on arm configuration
11
330 (TA13)
588,
5 (T
A13)
690
(TA1
7)
105
329,
9 (T
A13)
431,
8 (TA
17)
254
(TA1
0)
235
277 (TA10 / TA17 / TA21)
791
,5 (
TA21
) 5
33,4
(TA
21)
513,
5 (T
A10)
266,7 (S10)
365,8 (S14)
426,7 (S16)
508 (S20)
75
304,8 (S12)
259,
1 (3
13,7
)3
x M
6
341,7 (S10) 379,8 (S12)
440,8 (S14) 500,8 (S16)
583 (S20)
633,
5 (B
A10)
90
235
708,
5 (B
A13)
810
(BA1
7)
254
(BA1
0)
330,
2 (B
A13)
431,
5 (B
A17)
911
,5 (
BA21
) 5
33,4
(BA
21)
185
225
175195
266,7 (S10)
304,8 (S12)
365,8 (S14)
426,7 (S16)
508 (S20)
75
341,7 (S10) 379,8 (S12)
440,8 (S14) 501,7 (S16)
583 (S20)
4 x M6
67
25
50,8 (4x M4)
35,3 (4x M3)
IWH TA __ S __ HD F-1 IWH BA__ S __ HD F-1
330 (TA13)
588,
5 (T
A13)
690
(TA1
7)
105
329,
9 (T
A13)
431,
8 (TA
17)
254
(TA1
0)
235
277 (TA10 / TA17 / TA21)
791
,5 (
TA21
) 5
33,4
(TA
21)
513,
5 (T
A10)
266,7 (S10)
365,8 (S14)
426,7 (S16)
508 (S20)
75
304,8 (S12)
259,
1 (3
13,7
)3
x M
6
341,7 (S10) 379,8 (S12)
440,8 (S14) 500,8 (S16)
583 (S20)
633,
5 (B
A10)
90
235
708,
5 (B
A13)
810
(BA1
7)
254
(BA1
0)
330,
2 (B
A13)
431,
5 (B
A17)
911
,5 (
BA21
) 5
33,4
(BA
21)
185
225
175195
266,7 (S10)
304,8 (S12)
365,8 (S14)
426,7 (S16)
508 (S20)
75
341,7 (S10) 379,8 (S12)
440,8 (S14) 501,7 (S16)
583 (S20)
4 x M6
67
25
50,8 (4x M4)
35,3 (4x M3)
IWH TA __ S __ HD F-1 IWH BA__ S __ HD F-1
330 (TA13)
588,
5 (T
A13)
690
(TA1
7)
105
329,
9 (T
A13)
431,
8 (TA
17)
254
(TA1
0)
235
277 (TA10 / TA17 / TA21)
791
,5 (
TA21
) 5
33,4
(TA
21)
513,
5 (T
A10)
266,7 (S10)
365,8 (S14)
426,7 (S16)
508 (S20)
75
304,8 (S12)
259,
1 (3
13,7
)3
x M
6
341,7 (S10) 379,8 (S12)
440,8 (S14) 500,8 (S16)
583 (S20)
633,
5 (B
A10)
90
235
708,
5 (B
A13)
810
(BA1
7)
254
(BA1
0)
330,
2 (B
A13)
431,
5 (B
A17)
911
,5 (
BA21
) 5
33,4
(BA
21)
185
225
175195
266,7 (S10)
304,8 (S12)
365,8 (S14)
426,7 (S16)
508 (S20)
75
341,7 (S10) 379,8 (S12)
440,8 (S14) 501,7 (S16)
583 (S20)
4 x M6
67
25
50,8 (4x M4)
35,3 (4x M3)
IWH TA __ S __ HD F-1 IWH BA__ S __ HD F-1
330 (TA13)
588,
5 (T
A13)
690
(TA1
7)
105
329,
9 (T
A13)
431,
8 (TA
17)
254
(TA1
0)
235
277 (TA10 / TA17 / TA21)
791
,5 (
TA21
) 5
33,4
(TA
21)
513,
5 (T
A10)
266,7 (S10)
365,8 (S14)
426,7 (S16)
508 (S20)
75
304,8 (S12)
259,
1 (3
13,7
)3
x M
6
341,7 (S10) 379,8 (S12)
440,8 (S14) 500,8 (S16)
583 (S20)
633,
5 (B
A10)
90
235
708,
5 (B
A13)
810
(BA1
7)
254
(BA1
0)
330,
2 (B
A13)
431,
5 (B
A17)
911
,5 (
BA21
) 5
33,4
(BA
21)
185
225
175195
266,7 (S10)
304,8 (S12)
365,8 (S14)
426,7 (S16)
508 (S20)
75
341,7 (S10) 379,8 (S12)
440,8 (S14) 501,7 (S16)
583 (S20)
4 x M6
67
25
50,8 (4x M4)
35,3 (4x M3)
IWH TA __ S __ HD F-1 IWH BA__ S __ HD F-1
IWH TA __ S __ HD F-1 IWH BA__ S __ HD F-1DIMENSIONS
12
IWH TA10S16 F-1
WAFER HANDLING ROBOT | IWH WITH 3-LINK HEAVY DUTY ARM AND BODY SERIES 1
CHARACTERISTICS• excellent structural rigidity and precision• maximum reliability • top mounted (TA) or bottom mounted (BA) versions available• customized solutions• absolute or incremental encoder• seamless integration with prealigner, linear track
and other peripheral components• including „STANDARD“ or „ADVANCED“ controller and software• ISO 1 clean-room environment compatible• MTBF: >70,000 operating hours
SPECIFICATIONS
Repeatability
T ±0.02°
R ±0.02 mm
Z ±0.02 mm
Working range
Z 10", 13", 17"
radial 16", 21", 24", 28"
theta 500°
Payload up to 3 kg*
Maximum speed
T 360°/s
R 1,000 mm/s
Z 450 mm/s
Power supply
115 – 230 VAC 50 – 60 Hz500 VA (STANDARD)550 VA (ADVANCED)
Main interface RS-232 [DB9],Ethernet [RJ-45]
Weight approx. 25 – 32 kg
* depending on arm configuration
13
Ø 330 (TA13)
690
(TA1
7)
Ø 235
Ø 277 ( TA10 / TA17 / TA21)
142
254
(TA1
0)
329,
9 (T
A13)
431,
8 (T
A17)
791,
5 (T
A21)
533,
4 (T
A21)
513,
5 (T
A10)
588,
5 (T
A13)
533,4 (S21)609,6 (S24)
75
731,5 (S28)
406,4 (S16)
Ø 278,2 (S16)Ø 342 (S21)
Ø 380 (S24)Ø 441 (S28)Ø
259
,1 (Ø
313,
7)3x
M6
670,
5 (B
A10)
745,
5 (B
A13)
847
(BA1
7)
127
330,
2 (B
A13)
431,
8 (B
A17)
533,
4 (B
A21)
948,
5 (B
A21)
254
(BA1
0)
Ø 235
185
225
175195
406,4 (S16)533,4 (S21)
609,6 (S24)731,5 (S28)
75
Ø 278,2 (S16)Ø 342 (S21)Ø 380 (S24)
Ø 441 (S28)
4xM6
Ø 67
25
Ø 50,8 (4x M4)
Ø 35,3 (4x M3)
IWH TA __ S __ F-1 IWH BA __ S __ F-1
DIMENSIONS
14
IWH TA13S24HDP F-3
WAFER HANDLING ROBOT | IWH WITH 2-LINK HDPLUS ARM AND BODY SERIES 3
CHARACTERISTICS• excellent structural rigidity and precision• maximum reliability • top mounted (TA) or bottom mounted (BA) versions available• customized solutions• absolute or incremental encoder• seamless integration with prealigner, linear track
and other peripheral components• including „STANDARD“ or „ADVANCED“
controller and software• MTBF: >70,000 operating hours
SPECIFICATIONS
Repeatability
T ±0.02° / ±0.03°
R ±0.02 mm
Z ±0.02 mm
Working range
Z 7", 10", 13", 15", 17", 21"
radial 16", 24"
theta 450°
Payload up to 5 kg*
Maximum speed
T 180°/s / 360°/s
R 800 mm/s
Z 425 mm/s
Power supply
115 – 230 VAC 50 – 60 Hz500 VA (STANDARD)550 VA (ADVANCED)
Main interface RS-232 [DB9],Ethernet [RJ-45]
Weight approx. 25 – 40 kg
* depending on arm configuration
15
7“ [3
72,5
mm
]10
“ [4
49m
m]
13“
[525
mm
]17
“ [5
76m
m]
21“[
677,
6mm
]DIMENSIONS
mou
ntin
g sc
rew
s
turning radius min. Ø 700 mm
16
WAFER HANDLING ROBOT | IWH WITH 2-LINK DUAL ARM AND BODY SERIES 3
CHARACTERISTICS• excellent structural rigidity• wafer handling up to 300mm• maximum reliability and precision• seamless integration with prealigner, linear track
and other peripheral components• very smooth running• backlash free Harmonic Drive® gears• absolute or incremental encoder• integrated 2-channel vacuum display
(STANDARD controller)• fully integrated software adjustable vacuum
sensors (ADVANCED controller)• including „STANDARD“ or „ADVANCED“
controller and software• ISO 1 clean-room environment compatible• MTBF: >70,000 operating hours• option: 2 flip modules iFM-300-3
SPECIFICATIONS
Repeatability
T ±0.02°
R ±0.02 mm
Z ±0.02 mm
Working range
Z 7", 10", 13", 15", 17", 21"
radial 10", 14"
theta 500°
Payload up to 1.25 kg (per arm)*
Maximum speed
T 360°/s
R 1,100 mm/s
Z 425 mm/s
Power supply
115 – 230 VAC 50 – 60 Hz500 VA (STANDARD)550 VA (ADVANCED)
Main interface RS-232 [DB9],Ethernet [RJ-45]
Weight approx. 25 – 40 kg
*depending on arm configuration
IWH F-3 dual arm robot
Vaccum displays with STANDARD controller
17
Ø330 (TA)
7"
[387
,5m
m]
10"
[464
mm
]13
" [5
40m
m]
17"
[591
mm
]21
" [6
92,6
mm
]
11,18284
10,98Ø279
7"
[177
,8m
m]
10" [
254m
m]
13" [
330m
m]
17" [
431,
8mm
]21
" [53
3,4m
m]
[0,3
9]10
2x5,25" / 7,2"
110,5
210
4xM
8
166,
2 Ø
200
Waf
er21
6,5
Ø30
0 W
afer
455 (10" Arm Ø200 Wafer)555 (14" Arm Ø300 Wafer)
530 (10" Arm Ø200 Wafer)696 (14" Arm Ø300 Wafer)
Ø30
0 3x
M6
DIMENSIONS
18
WAFER HANDLING ROBOT | IWH WITH SHD SUPER HEAVY DUTY DUAL ARM AND SHD BODY
CHARACTERISTICS• excellent structural rigidity• wafer handling of up to 450 mm• maximum reliability and precision• seamless integration with prealigner, linear track
and other peripheral components• very smooth running• backlash free Harmonic Drive® gears• absolute or incremental encoder• fully integrated software adjustable vacuum sensors
(ADVANCED controller)• including „ADVANCED“ controller and software• ISO 1 clean-room environment compatible• MTBF: >70,000 operating hours• option: 2 flip modules iFM-300-3
SPECIFICATIONSSPECIFICATIONS
Repeatability
T ±0.02°
R ±0.02 mm
Z ±0.02 mm
Working range
Z 13", 15"
radial 14"
theta 500°
Payload up to 3 kg (per arm)*
Maximum speed
T 180°/s
R 800 mm/s
Z 300 mm/s
Power supply115 – 230 VAC 50 – 60 Hz800 VA
Main interface RS-232 [DB9],Ethernet [RJ-45]
Weight approx. 60 kg
*depending on arm configuration
IWH F-3 SHD dual arm robot (example of application, endeffectors see page 24)
19
420 (TA)
350
13" [
542m
m]
15" [
614m
m]
10
13" [
330m
m]
15" [
400m
m]
156
,5
7,2" [182,9mm]
120
260
4x M
8
217
,5
300
23,54" [598 mm]
24,80
27,8" [705,8mm]
3903xM6
DIMENSIONS
mou
ntin
g sc
rew
s
turning radius min. Ø 630 mm
20
CONTROLLER & SOFTWARE | „ADVANCED“
The ADVANCED controller is based on a continuous path control with integrated safety PLC which incorporates state-of-the-art technology. The innovative path control guaranties a constant and maximum speed on the TCP which ensures additional safety during handling substrates. The controller runs internally with the Powerlink real time bus system which improves performance even further.
CHARACTERISTICS• innovative user interface• powerful control electronics „State of the Art“• integrated safety control according
to DIN EN ISO 10218-1• resolver or EnDat-2.2 encoder• 19" rack 4HE or desk version• interface: Ethernet, RS232 • dimensions: 392 x 169 x 415 mm• weight: 10 kg• option: teach pendant• third party certified by TÜV for
- ISO 10218-1 (Robot safety) - USA compliance - Korea compliance
ADVANCED controller front
ADVANCED controller back
21
ACCESSORYTEACH PENDANT for ADVANCED controller• optimal support when setting up an isel wafer handler
with ADVANCED controller• GUI on a 6,5" VGA colour display• ergonomic multi-grip for fatigue-free work• hand wheel for jogging operation• enable switch and stop button for safe
manual operation (complies with EN ISO 13850)
The supported high voltage technology offers very dynamic behavior when using an additional linear motor axis. isel ADVANCED controllers complies with current international standards for industrial robots. The operating interface integrated into the controller can be visualized on any PC with a VNC viewer. It provides an innovative and intuitive GUI for setting up and managing the ADVANCED robot system. The ADVANCED robot controller is made by isel.
SOFTWARE
22
CONTROLLER & SOFTWARE | „STANDARD“
The controller is completely integrated into wafer handler body. It is in widespread use for over 15 years and proved in the semiconductor industry.
Because there is no separate external controller the handling system requires only very little space. It is also well suited for replacing other robot systems (emulations are available on request).
CHARACTERISTICS• less wiring• large range of functions• alignment on the fly function (OTF)• integrated electronic (all in one design)• 15 years field experience• interface: RS232, Ethernet• option: hand terminal
isel STANDARD robot controllerAll-in-one-design
23
RCC software
ACCESSORYHAND TERMINAL for STANDARD controller• optimal support while teaching
an isel wafer handler • keyboard layout optimized
for isel wafer handlers• terminal function• teach function
SOFTWAREThe Windows-based RCC software supplies support for setting up and management of the robot system and its extensive functions. The "STANDARD" hardware and software provides a huge range of pre-installed macro programmes.
24
END EFFECTORS | IEE SERIES
CHARACTERISTICS• for wafer sizes up to 18" (450 mm)• high rigidity• good cost/performance ratio• PTFE SafeCoat (Standard) for each of our robots• TAP to EE 30 mm (Standard bracket)
OPTIONS• different wafer mapping sensors• several surface coatings• special designs: pocket - friction wafer -
edge grip - exclusion zone vacuum
Paddle with mapping sensor
Horse shoe without mapping sensor
Double with through beam mapping
Exclusion zone vacuum with mapping sensor
Customized Filmring
Our end effectors are designed for wafer handling between the different stations. iselROBOTIK end effectors are available for wafer sizes from 2“ (50mm) up to 18“ (450mm). Each of our end effector fits each of our robots.
25
OPTIONS• different wafer mapping sensors• several surface coatings• special designs: pocket - friction wafer -
edge grip - exclusion zone vacuum
ACCESSORYVACUUM CONTROL• fast response• free programmable• resolution of 0.001 bar• integrated in endeffector• bicoloured display• useable for all vacuum
end effectors
Extended version
Ceramic
Edge grip
Vacuum exclusion zone
The end effectors are optionally available with many different contact materials such as PTFE (SafeCoat), PEEK, VITON, KALREZ. In addition to this we also offer many special designs for your special wafers and substrates. For your individual end effector requirements we will find the solution.
26
IMS-MDW1
Separate through beam unit
PD45
Through beam sensor
WAFER MAPPING SENSORS
IMS-MDW1• LED light source• measuring distance 45 mm (1.75")• PNP / NPN switchable
PD45• laser (class 2) light source• measuring distance 200 mm or 300 mm• small laser dot and housing
THROUGH BEAM SENSOR• optional to reflective Sensor• integrated in endeffector• or as separate unit • more suitable for thin wafer mapping
FLIP MODULE IFM-300-3• precise wafer flipping by adjustable
mechanical stops• universal endeffector adapter• adjustable hard stop damping• adjustable flip speed• option: lateral mapping sensor• TAP to EE 100 mm
ACCESSORIES
27
YAW AXIS• 4th axis upgrade for a three-axis system
(yaw angle in the R axis)• in-line handling of rectangular substrates • in-line handling without a linear track• upgrade for existing isel HD arm wafer
handling robots
ALIGNMENT ON THE FLY• wafer centering without prealigner• offset centering during PUT movement• no alignment station necessary• time efficient wafer centering
END EFFECTOR CHANGER(ADVANCED controller only)
• full automatically endeffector changing system
• software endeffector management • for all endeffector types
= laser sensors
28
CHARACTERISTICS• speed up to 4,5m/s• acceleration up to 10 m/s²• total length up to 32 m• repeatability +/- 0.01 mm• option: top or side mounting• fully integrated into the robot system• direct drive motor• low-maintenance• MTBF: >70,000 operating hours
SPECIFICATIONSRepeatability ±0.01 mm
Motor direct drive
Maximum speed 4.5 m/s
Maximum length 32 m
Maximum acceleration 10 m/s²
In order to increase the robot's radius of action, the handling system can simply be expanded by adding a further axis that is fully integrated into the system. Depending on the application, it can be mounted below the wafer handler or with the wafer handler mounted on the side. Due to the use of linear motors, the linear axes are very dynamic, low-maintenance and smooth-running. They achieve high acceleration values and speeds, approach positions very precisely and work practically wear-free due to the omission of mechanical connecting links. Due to the segment design, lengths of up to 32 meters with absolute encoders can be realized.
top mounted
side mounted
LINEAR TRACK | ILD SERIES
29
111
50
14.58.1
12 7
37.5
150
A
211
Length
260
50150
235
~ 26
50
190 148
Accessories: assemble set
111
50
14.58.1
12 737.5
150
A
211
Length
260
50150
235
~ 26
50
190 148
Accessories: assemble set
DIMENSIONS
ACCESSORY
ASSEMBLE SET for aligning the axes (consisting of two adapter plates, four nuts, two leveling bolts and mounting material)
30
PREALIGNERS | LPA SERIES
FEATURES
THREE-AXIS PREALIGNERS• innovative all-in-one design• alignment times < 3.5 seconds• repeatability: linear 0.025 mm,
circular 0.02°• contactless measurement using LED
and CCD sensor• integrated scanning electronics• standalone capability• chuck or pin load and change to another
wafer size without rebuild• transparent, semi-transparent, holed and
opaque wafers can be aligned• SEMI, flat and notch wafer specifications• for wafer sizes from 2" to 18"• connection fields available from the side
and from below• option: external (notch sensor) • option: dual layer for bonded wafer
SINGLE AXIS PREALIGNER• alignment times < 2.5 seconds• contactless measurement using LED
and CCD sensor• integrated scanning electronics• chuck load• change to another wafer size without rebuild• transparent, semi-transparent, holed and
opaque wafers can be aligned• All, flat and notch wafer specifications• for wafer sizes from 3" to 12"• connection panel available at the side
and from below
The LPA series prealigners are an innovative, high-precision, class 1 clean room solution with integrated scan electronics. These prealigners make it possible to align objects from 45 mm to 480 mm, regardless of their degree of transparency. They centre wafers, masks and other substrates, detect notches, flats or other marks and align the object exactly and independently. The prealigners are developed and produced by Logosol Inc. USA. isel Germany AG is the exclusive authorised distributor for Europe.
Three-axis prealigner LPA series with lateral connectors and
PEEK-pin/chuck
Three-axis edge handling prealigner with lateral connectors
Single-axis prealigner LPA series
with bottom connectors configuration
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CHARACTERISTICS
26-3 38-3 58-3 312-3 812-3 1218-3 25-1E 38-1E 58-1E 312-1E 812-1E 1218-1E
N/A N/A
10mm 9mm
W
L 404mm 328mm
H
More than 70000 hours
267mm 317mm
Specifications Standalone Embedded
450mm
Square Substrates
Wafer Diameter
MTBF
Host Interface
Flat/Notch Compatibility
Wafer Opacity
Cleanliness
RS 232, Ethernet
Semi Standards Compliant
Edge Handling
PREALIGNER MODEL
150mm
200mm
300mm
100mm
3“
2“
125mm
Type
4EH, 45EH
5EH, 45EH, 56EH
6EH, 56EH
8EH, 8ET
173mm
1.7mm to 2.0mm10mm
0.06º
0.04º
50um
Edge Handling
190mm to 206mm
267mm or 317mm
95mm
266mm
191mm
12ET
N/A
Centering Accuracy
Facilities Required
12mm
0.04º
173mm
190mm
Weight
Servo Axes
Handling
0.02º
0.04º
0.02º
25um 25um
5.3kg to 6.0kg
Transparent, Semi-Transparent
Class 1
10000 CPREncoder
24000 CPREncoder
Angular Accuracy (3 Sigma)
(3 Sigma)
BodyDimensions
Max Initial Offset
3.4kg to 3.8kg
One
5.0kg to 5.7kg
Three Three
Vacuum Chuck and Pins Vacuum Chuck
100-240VAC, 50/60Hz; 48VA or 24 DC/2A, Vacuum 12“ Hg for vacuum retention
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HSEB
INNOLASInnovative
Lasertechnologie
HSEB
INNOLASInnovative
Lasertechnologie
REFERENCESSubsequently you'll find a selection of companies that participated in a successful co-operation with us and that successfully use our products:
QUALITY ASSURANCEThe quality assurance system for our products includes all areas which contribute to the attainment of quality objectives. It is based on statutory requirements, customer require- ments and the internal quality requirements of isel Germany AG.
The quality assurance system ensures that the production processes are controllable and that only products that meet the respective specifi-cations are forwarded to the next working stage. We hold DIN ISO 9001:2015 certification.
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isel Germany AG was founded in 1972 and is the core company of the global isel Group. The company develops, manufactures, markets, sells and services systems and components used for automation, automation control systems, robots and related handling systems. The company supports the global market needs of the Semiconductor Equipment and related industries, its activities are centered on the company‘s expertise in automation and inter-related technologies and include a broad array of customer applications using the isel product line as the foundation to address those needs. isel Germany AG is located in Eichenzell (Hesse) and Dermbach (Thuringia), Germany.
Plant Dermbach
Plant Eichenzell
Plant Eiterfeld
Plant Berlin
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ELECTRONICS SOFTWARE SYSTEMSMECHANICS
WWW.ISELROBOTIK.COM
Tech
nica
l spe
cifica
tions
sub
ject
s to
cha
nge.
2020
0626
_TK_
Robo
tik
As at: october 2019
Robotic Department Bürgermeister-Ebert-Straße 40 36124 Eichenzell / Germany Phone: +49 (0) 66 59 / 981-0 E-Mail: [email protected]
development, production and sales of components and systems in the sectors mechanics, electronics, software and systems
PROGRAM OF THE -GROUP