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Developing for the Connected Car
Nilesh Parekh, Director Product Management, Qualcomm Technologies, Inc. Shyam Sundar, Principal Engineer/Manager, Qualcomm Innovation Center, Inc. Andrew Poliak, Director Global Business Development, QNX Software Systems
Qualcomm® Snapdragon™ Automotive Solutions
Nilesh Parekh, Director Product Management, Qualcomm Technologies
Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.
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Source: ABI, 2013, Gartner, Jan. ‘14
Changing Transportation
shipped in 2017 will be connected through mobile technology.
~60% New cars
By 2018, one in five new cars on the road will be ‘self aware’
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More than 10 million vehicles deployed globally across 15+
auto OEMS
Qualcomm Technologies’ Connected Car Leadership
In 2014, Qualcomm Technologies has 35+ connected car programs
from 13 OEMs in production
Majority of the world’s Tier 1 and Tier 2 connected car program
Majority of the world automakers connected car programs.
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Technologies developed for the smartphone industry will enable the next generation of automotive infotainment
Voice
Email/Calendar
News/ Entertainment
Apps Video
Movies Photography
Internet access
Maps
Text
Social networking Shopping
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HD Quality Graphics
3D Maps
Instrumentation
Navigation
Multimedia streaming
Bluetooth Wi-Fi hotspot
This use case is a hypothetical depiction of potential applications for Gobi and Snapdragon product offerings – not actual connected car and infotainment product. All screen images are simulated.
Rear seat entertainment
Content sharing
Mobile device integration
Driver assistance
Snapdragon automotive solution for smart, connected infotainment
Qualcomm Technologies’ integrated automotive solutions are
designed to speed up change in the in-car experience
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Safety
Head unit connectivity
Vehicle diagnostics
Wi-Fi hotspot
Navigation services
Vehicle to vehicle communication (DSRC)
Enhanced security features Object detection
Security
Drivers for connectivity: Moving to LTE From telematics to enabled cloud services
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Introducing Snapdragon Automotive Solutions Announced at CES 2014: Bringing connected infotainment with Snapdragon 602A
Qualcomm Gobi is a product of Qualcomm Technologies, Inc. Qualcomm VIVE and Qualcomm Izat are products of Qualcomm Atheros, Inc.
Snapdragon Automotive Solution
Qualcomm® Gobi™ 4G LTE Advanced modem (9x15, 9x30)
First Snapdragon 602A automotive grade processor
First 2-stream Wi-Fi and Bluetooth for automotive
Qualcomm® Izat™ GNSS (GPS, Glonass, DR)
Support for Android, Linux and QNX HLOS with automotive optimizations for critical services fast boot
HW and SW tightly optimized and integrated for infotainment systems
Snapdragon Automotive Development Platform (ADP) to enable ecosystem to take advantage of integrated offering and rapidly build and test solutions
Integrated and Optimized Solution
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Chipsets based on Snapdragon for automotive integrate: 1.5 GHz Quad Core Qualcomm® Krait™ CPU 400 MHz Qualcomm® Adreno™ 320 GPU 500 MHz Qualcomm® Hexagon™ DSP Wi-Fi and Bluetooth connectivity GNSS receiver and dead reckoning Power Management ICs Camera and video engines with compression, decompression and
image processing Multi-display support (Center Stack, Rear Seat, Instrument Cluster) Audio cores Security cores Multi-mode modem technology (3G, 4G-LTE)
HLOS support: QNX, Android, Linux Targeting high and mid tier infotainment platforms
Meets automotive temperature, quality and reliability requirements AEC-Q100 Temp range (Ta = -40C to +85C) Failure rates
Qualcomm Technologies’ Infotainment SoC Snapdragon 602A is Qualcomm Technologies first automotive grade SoC
Qualcomm Krait, Qualcomm Adreno and Qualcomm Hexagon are products of Qualcomm Technologies, Inc.
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Snapdragon ADP: Overview The Snapdragon ADP enables the development of a comprehensive and broad range of LTE connected infotainment systems
• Snapdragon ADP provides a fully-featured application development environment for rapid development of high performance and power efficient connected infotainment offerings
• The integrated system approach can help lower development cost, reduce risk, and speed time to market.
Main Board
Network Board
Radio Board
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Snapdragon ADP: Hardware Specifications Summary Chipset
– S602A 23x23, PMM8920, QCA6574, RGR7640
Memory
– 4GB (3GB accessible)/2GB DDR3L-1066
– 64 GB eMMC
– 64MB SPI NOR Flash
– One SD card slot
Three Display Outputs
– LVDS to FPDLINK III
– HDMI
– DSI to HDMI
– Touch screen on FDPLINK III display
– Additional touch screen on USB interface
Cameras Inputs
– FPD-LINK II Input
– CVBS video input
Sensors
– Accelerometer, Compass
Main board connectors
– 12V DC jack
– USB2.0: One micro OTG, three host type-A;
– One SD card slot
– One SIM card slot
– One SATA connector
– JTAG, USB to UART debug connector
– Display: FDPLINK III x1, HDMI x2 (1080p x1, 720p x1)
– Camera: FPDLINK II x1, CVBS in x 3 (2 concurrent)
– Antenna: 2 WAN, 2 WLAN/BT, 1 GPS
– RCM connector
Radio board connectors
– Speaker amp DC power input
– Speaker output x4, Line output x2
– Microphone input x4
– Aux audio input jack
– Radio antenna connectors
– JTAG
Network board connectors
– Ethernet socket x1
– CAN connector x2, LIN connector x1
Audio
– NXP Dirana3 car audio and radio system
– 6-ch audio output (speaker x4, line out x2)
– 4 microphone input
– MDM modem audio support
– Early sound play with analog audio from the network processor
Wireless Connectivity
‒ WLAN: 802.11ac, 2.5GHz/5GHz,
‒ BT 4.0
‒ GPS
WWAN
– MDM9x15 LTE module
Wired Connectivity
– Atmel SAM4E/SAMV71 Network processor
– Ethernet AVB support (limited function with SAM4E)
– CAN interface x2, LIN interface x1
Hard Keys
– Four SW definable buttons
– Power and reset buttons
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Snapdragon ADP Ordering Process Intrinsyc distributes and supports Snapdragon ADP
• Place an order on the Intrinsyc website (intrinsyc.com/adp)
− Specify HDCP licensee or non-licensee
− Add to your cart and select quantities
− Review and accept the click-through EULA at the bottom of the page
− Enter payment and shipping information
• Once approved, Intrinsyc will ship the ADP units directly to the address indicated in the order
− Android BSP will be shipped with all units from Intrinsyc
− QNX BSP coming at a later date at Intrinsyc
• Intrinsyc provides Tier-1 and Tier-2 support
− Included Technical support (via email and phone)
− Additional support on a time and material basis
− SW updates and RMA support
Android for Snapdragon Automotive Development Platform (ADP)
Shyam Sundar Linux/Android Project Engineer, Snapdragon Automotive, Qualcomm Innovation Center, Inc.
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ADP Ecosystem Receives:
- ADP Platform. - Binary Component Package. - Build & Debugging Tools. - Documentation.
- Linux Kernel 3.4. - Android Open Source Project (Kitkat).
ADP Software Build
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Automotive Android Solution
UART BSP
OpenCL 1.0 OMX IL Video Codecs
Adreno 320 Driver Video Driver & Firmware ADSP Driver & Firmware
OpenGL ES 2.0
Location API
Feature Interfaces
OMX IL Audio Codecs Modem Interface WiFi Driver & Firmware
Stagefright
Libraries & Middleware Audio HAL Video HAL Audio Policy Audio & Video Codecs
SurfaceFlinger
Vehicle Networks Interface
WiFi & Soft AP BlueDroid
DR Plugin Engine
Kernel & Boot
Linux Kernel 3.4
Proprietary Bootloaders & Little Kernel (LK)
HSUSB SD/eMMC SDIO 3.0 PCIe 2.0 SATA I2C I2S Keypad Touch Display ALSA
Clock PMIC ADV7282 GSS WLAN KGSL V4L2
SensorOne Interface
Audio Flinger Radio Interface Layer Location Provider
Sensors HAL
Framework Video Audio Camera Display Telephony & Data Location Connectivity Vehicle Networks Graphics
Authored by QuIC, Inc.
Minor Modifications/Extensions
Applications
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Automotive Android Solution – Areas of Impact & Changes
Multiple Displays Description: Driver-level support for 3 simultaneous displays over LVDS, DSI and HDMI. Developer API Impact: None
Audio Description: Multi-stream Multi-device concurrencies over an Automotive Audio/Radio interface. Developer API Impact: New API Extensions Added.
Quick Boot Description: Optimizations to Bootloader, LK, Kernel and Android Startup sequence to meet Automotive Boot Times. Developer API Impact: None
Camera Description: Android Camera API is currently NOP due to Safety-Domain Camera architecture. Non-safety-domain Camera applications are planned, but not currently supported. DeveloperAPI Impact: Camera Applications will not be functional.
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Automotive Android Solution – Areas of Impact & Changes
Vehicle Networks Description: New API and Events Interface to propagate Vehicle Events from sources such as the CAN bus. Serves Vehicle Events to Android Applications as well as internal components. Developer API Impact: New API Extensions Added.
Bluetooth
Description: Automotive Profiles (HFP Sink, A2DP Sink, etc.) Developer API Impact: New API Extensions Added.
Telephony & WWAN Data Description: Integration to an Automotive-grade external modem module over HSUSB. Integrated Telephony and Data functionality over Android Telephony API and RIL. Developer API Impact: None
GPS with DR Plugin Engine Description: GPS solution with DR Plugin Interface that allows plugging in any 3rd party DR solution. DeveloperAPI Impact: None
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Qualcomm Automotive Android Solution
Other APIs Supported
• OpenMAX IL • OpenGL ES • OpenCL • ALSA • Qualcomm® Hexagon™ SDK
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Opportunities for Ecosystem
Virtualization/Hypervisor
Audio/Video Codecs
OpenDSP Extensions
Voice Recognition
OTA Updates
iAP/iAP2/CarPlay
GAL
Ethernet AVB
MultiDisplay/MultiWindow
HMI & Applications
Authored by QuIC, Inc.
QNX for Snapdragon Automotive Development Platform
Andrew Poliak Director of Business Development, QNX Software Systems
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Overview of QNX in the automotive industry
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QNX in the Automotive Market
QNX software is deployed by over 40 OEMs (Original Equipment Manufacturers) in tens of millions of vehicles throughout North America, Europe, and Asia
Tier ones
OEMs
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QNX supports today’s broadest cross-platform mobile development environments
QNX CAR Platform supports HMI and app environments using Qt, HTML5, .apk, and OpenGL ES combined in numerous ways
Plus Elektrobit GUIDE and Crank Storyboard UX tools
Best Application Platform
Mobile development environment
Supported platforms
Qt iOS, Android, BlackBerry 10
HTML5 iOS, Android, BlackBerry 10, Win8
C++/OpenGl ES iOS, Android, BlackBerry 10
Java (.apk) Android, BlackBerry 10
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QNX CAR Platform Design Principles
Speed customer’s time-to-market
Leverage industry-standard HTML5, Android, and Qt mobile app development
Integrate best of breed automotive technologies − Voice recognition, navigation, and connectivity
Solve development and integration issues − Code reuse, boot times, and memory footprint
Provide customer with flexibility
Support multiple simultaneous HMI frameworks − Cleanly separated UI and service layers
Fully abstracted component subsystems − Substitute for preferences or regional needs
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Key features of QNX CAR Platform
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QNX CAR Platform Demo
Demo of QNX CAR Platform is focused on stability and concurrence of core automotive features
Dashboard summarizes current system activity and basic settings: − Navigation
− Weather
− Music playing
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Navigation
QNX platform can be configured for multiple navigation engines: − Elektrobit street director
− Nokia HERE
− Other
Snapdragon graphics chipset with QNX platform has the required performance quality to support advanced graphics − 3-D accelerated graphics in navigation
Smooth rendering performance
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Media Framework
Displays controls for discovering and playing audio and video files on different sources: Play Radio, Play Music, Play Video, and Search
Smooth scrolling animations
Compositing windowing system integrates multiple graphics and user interface (UI) technologies into a single display
Supports multiple graphics technologies: − Video
− Open GL ES
− HTML5
− Qt 5
Can have multiple displays and multiple cameras
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Connectivity
The QNX OS provides support for the latest in wired and wireless networking, and connectivity options out of the box − LTE cellular
− Bluetooth
− Wifi
− USB 3.0, USB On-The-Go, USB device
Allows messages and media to display in the head unit from a mobile device
Have mastered the difficult task of providing concurrency, stability, and performance
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Key Performance Points
Fastboot − Flexibility to optimize the order of the boot process and stage the boot process
− Instant Device Activation (IDA) loads drivers during boot process, giving access to critical resources 50ms after power-on-reset
Power Management − Tickless mode, tolerant timers, lazy interrupts
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For more information on Qualcomm, visit us at: www.qualcomm.com & www.qualcomm.com/blog
©2013-2014 Qualcomm Technologies, Inc. and/or its affiliated companies. All Rights Reserved. Qualcomm, Snapdragon, Gobi, Adreno, VIVE and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. IZat and Krait are trademarks of Qualcomm Incorporated. All Qualcomm Incorporated trademarks are used with permission. Other products and brand names may be trademarks or registered trademarks of their respective owners. References in this presentation to “Qualcomm” may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiaries or business units within the Qualcomm corporate structure, as applicable. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially all of its product and services businesses, including its semiconductor business, QCT.
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