2. Demonstration of sub-surface 3-Dimaging capabilityWith the recent development of improved 3Dimaging, ARPs terahertz scanner is nowcapable of seeing inside of wafers and otheropaque substrates. A scanning image isgenerated pinpointing location and size ofparticulate, void, and other defects. Inaddition, defect size is quantified by to-the-scale direct measurements. It can alsovisualize the defects on the nanometer scale. 3. Snap shot of patterns on a wafer Scanned surface image of a wafer. Total scan length is ~5 m. 4. 360 inside view of the object360 view of a wafer. Color contrast represents objects of different size and material. 5. Scanner details The terahertz sub-surface scanner from ARPis a user friendly, easy to use machine. All operations are automated via includedsoftware. The machine exhibits an unprecedentedresolution of a few nanometers in 3 axialdirections. Yet scanning is fast 6. Scanner details (contd.) Screen shot of measurement consoleshown in the next slide. All parameters are entered by the front-end interface. Measured data are accessible for furthermanipulations. 7. Measurement ConsoleScreen shot of measurement console. All parameters are enteredvia the front-end. Data are easily accessible. 8. Contact informationFor more information, please contact:Anis Rahman, PhDemail: [email protected]: 717-623-8201
