YTEC Profile Presentation for Credit suisse 20090112-Final

YoungTek Electronics Corp.


YTEC Company Profile


Welcome

Welcome

Welcome Welcome

Welcome

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Stock No: 6261

Bri

ef I

ntr

od

uct

ion

Bri

ef I

ntr

od

uct

ion

Date

Date ：：：：：：：：

12 January,

12 January, 2010

2010



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��Brief Introduction

Brief Introduction

��Factory Overview

Factory Overview

��Company Milestone

Company Milestone

��Organization Chart

Organization Chart

��Company Management Concept

Company Management Concept

��OEM Services

OEM Services

��R&D Roadmap and Own Product Development

R&D Roadmap and Own Product Development

��Revenue Growth

Revenue Growth

��Company Mission

Company MissionContents

Contents

Contents



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YoungTek Electronics Corp.Brief Introduction

Brief Introduction

Brief Introduction

Found Time

Found Time：：：：：：：：1991/July

Chairman

Chairman：：：：：：：：BilyWang

President of Service Group

President of Service Group：：：：：：：：Jeff Chang

President of Own Product Group

President of Own Product Group：：：：：：：：Glen Chen

Employees

Employees：：：：：：：：821

Capital

Capital ：：：：：：：：

NTD 940 million (USD 29 million)

Address

Address：：：：：：：：Plant 1

Plant 1(( 1F~5F

1F~5F)) ：：

Special & substrate sawing

Special & substrate sawing

An Ping Plant

An Ping Plant( 3F3F) ：：

LED sorting

LED sorting

Li Li Hsin

HsinPlant

Plant(2F~3F3F) ：：

LED back

LED back-- end turn

end turn-- key

key service,AOI

service,AOI

King Sun Plant

King Sun Plant(( 7F7F)) ：：

Wafer grinding

Wafer grinding, sawing & die

sawing & die-- sorting

sorting

SBIP Plant

SBIP Plant(( 1~4F

1~4F、、、、、、、、7F7F)) ：：

IC testing (CP & FT)

IC testing (CP & FT),ATE&GPS

ATE&GPS

Business Items

Business Items：：：：：：：：

1.Semiconductor and LED OEMs: Wafer sawing, grinding, sorting and IC testing, LED testing,

laser scribing, sorting and substrate sawing.

2.Design, manufacture and sales of semiconductor equipments: CIS/CCM equipments,

AOI system, full-function IC tester, logic IC tester, analog IC tester,LEDtester, prober and

sorter.

Tainan

Tainan

An Ping

An Ping

Hsinchu

Hsinchu



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YoungTek Electronics Corp.Factory Overview

Factory Overview

Factory Overview

YTEC Group

YTEC Group

1F

4F

7F

SBIP Plant

King-Sun Plant

7F

3F

An-Ping Plant

1F

5F

Plant #1

3F

Li-Hsin Plant

2F



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1991/July.

YTEC was founded and the capital is NTD $5million.

1998/Oct.

Developed logic tester (Goblin) with 5 MHz/40 pins.

2000/Mar.

Achieved ISO 9001certification.

2000/July.

Full-function IC tester was verified by industry

agency with predominant product development project.

2002/Aug.

SEC (Securities and Exchange Commission)approved

YTEC to public stock.

2003/Nov.

LED OEM service was established.

2003/Dec.

Obtain OTC certification.

2004/Mar.

Got approval to establish a branch in HsinchuSBIP.

2004/Mar.

Listed on Taiwan stock exchange. (Stock No.: 6261)

2006/Apr.

Developed King Sun plant for wafer grinding & sawing.

2006/Dec.

Achieved ISO 14001 certification & OHSAS 18001.

2007/Jul.

Developed Tainan An Ping plant for LED sorting.

2007/Nov.

Build up AOI key technologies and business.

2008/May

Develop Li Hsinplant for LED test & sorting.

2008/Otc.

Achieved the certification of ISO/TS 16949.

2009/Jun. Solar silicon substrate inspection system was verified by

Science Park Administration with development project.

Company Milestone

Company Milestone

Company Milestone



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Organization Chart

Organization Chart

Organization Chart



Audit Office

General President

General President

Chairman

Chairman

OEM ServiceBU

OEM ServiceBU

Finance Div.

Finance Dept.

Administration Div.

PurchasingDept.

AdministrationDept.

Die-Saw Div.

MIS Dept.

Opt Electronics

Prod. Div.

Substrate-Saw Div.

Facility Dept.

Opt electronicsEng. II

Opt electronicsEng.I

Opt electronics Sales Dept.

Opt electronics Production

Opt electronics Logistic

Die-SawProduction

Die-SawSales Dept.

Die-SawEng.

QA Div.

IC Quality Control I

RDQuality Control

Quality System

LED Quality Control

IC Quality Control II

Substrate-saw Dept.

Board Of Directors

Board Of Directors

Testing Eng. Div.

Testing Prod. Div.

Testing Production

TestingSales Div.

Testing Sales Dept.

Testing Logistic

Software Eng. I

Hardware Eng.

Software Eng. II

Testing Prod. Center

SBIP & Own Product BU

SBIP & Own Product BU

ATE R&D Div.

System Design Dept.

Marketing

AOI Div.

Marketing & Sales

Div.

S/W Develop. I

H/W Develop. II

S/W Develop. II

H/W Develop. I

Application Dept.

Production Tech.

AOE Div.

Image R&D II

Electrical Control

Image R&D I

Application Service

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經營理念

經營理念

經營理念

經營理念

：(Management Concept)

主人翁經營理念




；；；；下工程即是客戶

下工程即是客戶



。。。。

Treat YTEC as your own company. (Host concept)

Treat all post projects and processes as our customers.

工作態度

工作態度

工作態度

工作態度

：(Working Attitude)

成功者找方法

成功者找方法

成功者找方法

成功者找方法

；；；；失敗者找藉口

失敗者找藉口

失敗者找藉口

失敗者找藉口

。。。。

A successful person will find the way to overcome a challenge

A successful person will find the way to overcome a challenge

Loser finds excuses.

Loser finds excuses.



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YoungTek Electronics Corp.IC OEM Services

IC OEM Services

IC OEM Services

下游

下游下游

下游

下游

下游下游

下游

Back-end

上游

上游上游

上游

上游

上游上游

上游

Front-end

設計

IC Design

矽晶圓

Bare W

afer

光罩

Mask

晶圓製造

Foundry

晶圓測試

CP Test

晶圓測試

CP Test

封裝

Assembly

成品測試

FT Test

成品測試

FT Test

Drop

Shipment

Drop

Shipment

測試設備

ATE System

測試設備

ATE System

晶圓研磨

Grinding

晶圓研磨

Grinding

晶圓切割

Wafer Saw

晶圓切割

Wafer Saw

晶粒挑檢

Die Sorting

晶粒挑檢

Die Sorting

YTEC

Services

YTEC

Services



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專業測試代工服務(IC Testing OEM)

專業測試代工服務(IC Testing OEM)

�4”~8”Wafer testing( CP

CP)、

Test program and test kit development(Probe-card design

and manufacture).

�IC packaging testing( FTFT)，

Package type：DIPs、T/SOPs 、

L/QFPs、QFN 、

L/BGA…

�PC peripheral product、、、、

Logic、、、、Analog、、、、Mixed-signal、

No-volatile memory 、

MCU

MCU、、

LCD driver IC

LCD driver IC、

High speed/ High pin count (Scud-1A 512C) testing.

CIS

CIS(CMOS Image Sensor)、RF、SoC product testing.

�Others：Laser trimming、Lead scanning、Test program and test kit development technical

support, Turn

Turn-- key service

key service(For example: PKG assembly、Tape-reel、

Drop–shipment…

).



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研磨

研磨研磨

研磨、、、、切割及挑檢代工服務

切割及挑檢代工服務



(Grinding, Sawing, P&P Service)

研磨

研磨研磨





研磨

研磨研磨







��Service Items

Service Items::

Wafer

Waferback

back-- side grinding

side grinding, sawing

sawing, chip pick & place

chip pick & placeservices for Consumer and gold

bump products.

�4”~12”Wafer Pick &

Place

�Map and Ink Pick &

Place Solution

�Chip Back-side AOI

Inspection System

�4”~12”Wafer Sawing

�Dual Cutting Function

�High-pressure & Atomizing

Cleaning System (二流體清洗裝置

二流體清洗裝置

二流體清洗裝置

二流體清洗裝置)

�Dust Collecting System

�4”~12”Wafer Back-side

Grinding

�8”~12”Wafer Polish

Solution

�Wafer TTV≦ ≦≦≦5μ μμμm

�Chip TTV≦ ≦≦≦2μ μμμm

Capability

Capability

Class 100

Class 1K

Class 1K

Environment

Environment

Pick & Place

Pick & Place

Sawing

Sawing

Back

Back-- side Grinding

side Grinding

Process

Process



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YoungTek Electronics Corp.LED OEM Services

LED OEM Services

LED OEM Services

Front

-end

Mid

-end

Back

-end

Material

Wafer

Epi-Wafer

Laser Scribing

Die Bonding

Wire Bonding

Assembly

��Front

Front --end Product

end Product：

Wafer、

Epi-Wafer，

For

example GaAs 、

GaAsP、AlGaAs 、

AlGaInP

��Mid

Mid-- end Product

end Product：

Laser Scribing、Wafer

Testing and Pick & Place Die-sorting

��Back

Back-- end Product

end Product ：

Lamp、Display、SMD、

IR transmissionmodule、Optical Communication

product 、Substrate Saw

Front-end

Epi

Mid-end

Chip

Back-end

Assembly

Application

Epistar、

Hugaopto、、、、

Forepi 、

Vpec、Arima、

Tekcore、Nan Ya

Epistar、

Opto Tech、

Hugaopto

、Arima、

TynTek、Forepi、

Liteon

Harvatek、Unitpoto、

KingBright、

Bright LED 、

LEDTech、Taiwanoasis、

Everlight、

Liteon、

Para Light

Wafer Testing

FT Testing

Die Sorting

Substrate Saw

LED Module

Metal Process



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Un

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久元電子公司簡報

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(100)

100

300

500

700

900

1,100

1,300

1,500

-100.0%

-50.0%

0.0%

50.0%

100.0%

150.0%

200.0%

250.0%

300.0%

2008

862

822

1,10

1 1,

190

1,16

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1,13

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1,15

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Jan

Feb

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Ap

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Sep

Oct

No

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R&D Roadmap and Own Product

Development



Development

Development



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��Scud

Scud-- 1A 512C full

1A 512C full-- function IC Tester

function IC Tester

��CIS(CMOS Image Sensor System)

CIS(CMOS Image Sensor System)

CMOS

CMOS影像感測系統

影像感測系統

影像感測系統

影像感測系統

影像感測系統

影像感測系統

影像感測系統

影像感測系統

��HV LED Tester

HV LED Tester

��CCM (

CCM (CMOS/Compact

CMOS/Compact Camera Module)

Camera Module)

影像感測模組測試設備








��AOI (Auto optical Inspection )

AOI (Auto optical Inspection )

自動光學檢測系統








Own Product Development

Own Product Development



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Scud-1A technology features(技術特點

技術特點

技術特點

技術特點):

�H

igh

-sp

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sig

nal

pro

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ab

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�H

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fun

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�D

evel

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or

test

ing

eas

e o

f o

per

atio

n.

Scud-1A development history(發

展原因

發展原因

發展原因

發展原因):

For increased sales of consumer electronic

and computer products,

push

ing c

hip

sets

forw

ard t

o h

igh f

requen

cy, lo

ts o

f p

ins,

mult

i-

funct

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sig

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testing equipment has increased

substantially.

Scud-1A development advantage(發展優勢

發展優勢

發展優勢

發展優勢):

�T

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pri

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rYTEC Company Profile


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CIS(CMOS

CIS(CMOSImage Sensor)

Image Sensor) ICIC

Tester

Tester

Tester

Tester

Tester

Tester

Tester

Tester

DU

T A

nal

og P

ow

er

DU

T D

igit

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V/I

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e/M

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Illuminator

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Imag

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rab

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rab

ber

Imag

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Imag

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rab

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Imag

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rab

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Imag

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rab

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Concurrent Image Grabber &

Processor

Quad

Sites

Scud IC

Test System

Host

Computer

Light Source

Con

trol

Boar

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YoungTek YoungTek

Scud Scud--CIS CIS

Test System Test System

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GH

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pee

d A

WG

CIS Chip



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�YTSD01

YTSD01

YTSD01

YTSD01 - ---> YTSD02

> YTSD02

> YTSD02

> YTSD02 - ---> YTEC 8000 HV LED Tester

> YTEC 8000 HV LED Tester



HV LED Tester

HV LED Tester



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CCM

CCM

(CM

OS

/Com

pac

t C

amer

a M

odule

(CM

OS

/Com

pac

t C

amer

a M

odule

)YTEC Company Profile


Fully Auto CCM Test System YT3300

Fully Auto CCM Test System YT3300

CCM Test SystemYT3100

CCM Test SystemYT3100

Page:19

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CIS IC /CCM Application

CIS IC /CCM Application

Consumer

Consumer

Consumer

Consumer - ---, communication

, communication

, communication

, communication

- ---, security management

, security management

, security management

, security management - ---, QA

, QA

, QA

, QA - ---, Automotive

, Automotive

, Automotive

, Automotive - ---, and

, and

, and

, and

Personal management tools



Personal management tools…

etc are using the CIS IC in our daily lives.






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Auto Optical Inspection (







Auto Optical Inspection (自動

光學檢測

系統

自動

光學檢測

系統

自動

光學檢測

系統

自動

光學檢測

系統

自動

光學檢測

系統

自動

光學檢測

系統

自動

光學檢測

系統

自動

光學檢測

系統

) )))) )))

Polarity inverse

package

Mixed

package

Tilt

Over turn

Empty

YT 2200 REEL TYPE COMPONENTS

AOI system



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Reel type taped

products:

••Resistor

Resistor

••Capacitor

Capacitor

••Inductor

Inductor

••LED

LED

••ICIC

••Relay

Relay

••Connector

Connector

••Fuse

Fuse

Auto Optical Inspection

Auto Optical Inspection Application

Application

Application

Application

Application

Application

Application

Application

TPI-200 platform



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YoungTek Electronics Corp.P

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SEMICON®®in Taiwan/China/Germany/USA 2001~2009

in Taiwan/China/Germany/USA 2001~2009

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Page:24

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Page:24



20

07

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8 M

on

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Rev

enu

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7&

20

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Mo

nth

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20

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Rev

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NT

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NT

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註：

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(e)

(e) 表示預估值

表示預估值

(est

imat

e)(e

stim

ate)。。

Jan.

Feb

Mar

Apr

May

Jun.

Jul.

Aug.

Sep.

Oct.

Nov.

Dec.

Total

比重

%

2007

48,0

79

40,9

51

56,0

36

56,1

31

55,7

49

55,6

32

69,4

0377,4

43

76,8

03

83,4

43

76,1

02

73,6

37

769,4

09

41.66%

2008

69,0

26

62,1

66

81,8

72

78,0

21

80,6

42

77,5

75

83,7

6983,5

20

83,7

67

86,2

26

62,3

23

34,533

883,4

40

43.00%

YoY

43.5

7%

51.8

1%

46.1

1%

39.0

0%

44.6

5%

39.4

4%

20.7

0%7.8

5%

9.0

7%

3.3

4%

-18.1

1%-53.10%

14.82%

--

MoM

-6.2

6%

-9.9

4%

31.7

0%

-4.7

0%

3.3

6%

-3.8

0%

7.9

8%

-0.3

0%

0.3

0%

2.9

4%

-27.7

2%-44.59%

----

2007

68,9

55

42,3

45

63,8

00

62,0

94

72,7

58

67,4

99

83,9

3092,5

22

85,3

19

98,7

74

79,3

63

68,8

74

886,2

33

47.98%

2008

72,1

93

73,2

11

88,1

59

94,4

82

95,2

37

92,3

31

96,2

8090,3

78

90,4

17

83,9

46

54,7

39

35,238

966,6

11

47.05%

YoY

4.7

0%

72.8

9%

38.1

8%

52.1

6%

30.9

0%

36.7

9%

14.7

1%-2

.32%

5.9

8%

-15.0

1%

-31.0

3%-48.84%

9.07%

--

MoM

4.8

2%

1.4

1%

20.4

2%

7.1

7%

0.8

0%

-3.0

5%

4.2

8%

-6.1

3%

0.0

4%

-7.1

6%

-34.7

9%-35.63%

----

2007

7,8

48

23,4

19

10,9

47

7,8

67

7,3

29

7,8

45

4,7

86

10,1

20

11,5

35

12,6

64

52,4

42

34,6

33

191,4

35

10.36%

2008

8,5

62

4,1

87

9,4

16

24,0

83

59,5

51

8,6

07

8,9

99

20,8

39

33,3

32

8,5

47

5,7

40

12,699

204,5

62

9.96%

YoY

9.1

0%

-82.1

2%

-13.9

9%

206.

13%

712.5

4%

9.7

1%

88.0

3%105.9

2%

188.9

6%

-32.5

1%

-89.0

5%-63.33%

6.86%

--

MoM

-75.2

8%

-51.1

0%

124.

89%

155.

77%

147.2

7%

-85.5

5%

4.5

5%

131.5

7%

59.9

5%

-74.3

6%

-32.8

4%121.24%

----

2007

124,8

82

106,7

15

130,7

83

126,0

92

135,8

36

130,9

76

158,1

19

180,0

85

173,6

57

194,8

81

207,9

07

177,1

44

1,8

47,0

77

100.0

%

2008

149,7

81

139,5

64

179,4

47

196,5

86

235,4

30

178,5

13

189,0

48

194,7

37

207,5

16

178,7

19

122,8

02

82,470

2,0

54,6

13

100.0%

YoY

19.9

4%

30.7

8%

37.2

1%

55.9

1%

73.3

2%

36.2

9%

19.5

6%8.1

4%

19.5

0%

-8.2

9%

-40.9

3%-53.44%

11.24%

--

MoM

-15.4

5%

-6.8

2%

28.5

8%

9.5

5%

19.7

6%

-24.1

8%

5.9

0%

3.0

1%

6.5

6%

-13.8

8%

-31.2

9%-32.84%

----

2007

124,8

82

231,5

97

362,3

80

488,4

72

624,3

08

755,2

84

913,4

03

1,0

93,4

88

1,2

67,1

45

1,4

62,0

26

1,66

9,93

31,8

47,0

77

----

2008

149,7

81

289,3

45

468,7

92

665,3

78

900,8

08

1,07

9,32

11,

268,

369

1,4

63,1

06

1,6

70,6

22

1,8

49,3

41

1,97

2,14

32,054,613

----

YoY

19.9

4%

24.9

3%

29.3

6%

36.2

2%

44.2

9%

42.9

0%

38.8

6%33.8

0%

31.8

4%

26.4

9%

18.1

0%

11.24%

----

2007

117,0

34

83,2

96

119,8

36

118,2

25

128,5

07

123,1

31

153,3

33

169,9

65

162,1

22

182,2

17

155,4

65

142,5

11

1,6

55,6

42

--

2008

141,2

19

135,3

77

170,0

31

172,5

03

175,8

79

169,9

06

180,0

49

173,8

98

174,1

84

170,1

72

117,0

62

69,771

1,8

50,0

51

--

YoY

20.6

6%

62.5

3%

41.8

9%

45.9

1%

36.8

6%

37.9

9%

17.4

2%2.3

1%

7.4

4%

-6.6

1%

-24.7

0%-51.04%

11.74%

--

MoM

-0.9

1%

-4.1

4%

25.6

0%

1.4

5%

1.9

6%

-3.4

0%

5.9

7%

-3.4

2%

0.1

6%

-2.3

0%

-31.2

1%-40.40%

----

總計代工成長

OE

M G

row

th (

Tota

l)

Business Item/Month

切割挑檢代工

Saw

ing

& S

ort

ing

OE

M

測試代工

Tes

ting

OE

M

機器組裝等產品銷

售 Ow

n P

roduc

t S

ales

營業收入淨額

(Uni

t:K

)

Sal

es R

even

ue (

Net

)

營業收入淨額

(累計

)

Sal

es R

even

ue

(Tota

l)



Page:25

Page:25

Page:25



20

08

&2

00

9 M

on

thly

Rev

enu

e2

00

8&

20

09

Mo

nth

ly R

even

ue

20

08

&2

00

9 M

on

thly

Rev

enu

e

NT

$(T

ho

usa

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NT

$(T

ho

usa

nd)

註：

註：

(e)

(e) 表示預估值

表示預估值

(est

imat

e)(e

stim

ate)。。



Jan.

Feb

Mar

Apr

May

Jun.

Jul.

Aug.

Sep.

Oct.

Nov.

Dec.

Total

Share(%)

2008

69,

026

62

,166

81,8

7278

,02

18

0,6

42

77,

575

83,

769

83

,52

08

3,7

678

6,2

26

62,

323

34,

53

388

3,4

40

43.00%

2009

25,

665

40

,289

54,3

7661

,14

07

1,4

68

77,

964

86,

175

92

,17

99

2,2

778

9,2

20

84,

948

93,082

868

,78

343.76%

YoY

-62.

82%

-35.

19%

-33.

58%

-21.

64%

-11

.38

%0

.50%

2.8

7%

10

.37

%1

0.1

6%

3.4

7%

36.

30

%169.55%

-1.66%

MoM

-25.

68%

56.9

8%34

.96

%12

.44

%1

6.8

9%

9.0

9%1

0.5

3%

6.9

7%

0.1

1%

-3.3

1%

-4.7

9%

9.58%

2008

72,

193

73

,211

88,1

5994

,48

29

5,2

37

92,

331

96,

280

90

,37

89

0,4

178

3,9

46

54,

739

35,

23

896

6,6

11

47.05%

2009

27,

681

33

,471

51,8

3962

,96

07

3,9

07

82,

856

87,

349

82

,37

69

5,3

838

8,8

14

82,

815

84,392

853

,84

343.01%

YoY

-61.

66%

-54.

28%

-41.

20%

-33.

36%

-22

.40

%-1

0.2

6%-9

.28

%-8

.85

%5.

49

%5

.80

%5

1.2

9%139.49%

-11.67%

MoM

-21.

45%

20.9

2%54

.88

%21

.45

%1

7.3

9%

12

.11

%5.

42

%-5

.69

%1

5.7

9%

-6.8

9%

-6.7

5%

1.90%

2008

8,5

62

4,1

87

9,4

1624

,08

35

9,5

51

8,6

078,

999

20

,83

93

3,3

328

,54

75,

740

12,

69

920

4,5

62

9.96%

2009

2,6

66

5,4

96

9,5

297

,812

7,5

05

27,

554

5,8

428

,57

88

6,4

347

1,3

20

6,5

5423,240

262

,53

013.22%

YoY

-68.

86%

31.2

6%1

.20%

-67.

56%

-87

.40

%22

0.13

%-3

5.0

8%

-58

.84

%1

59.

31

%73

4.4

4%

14.

18

%83.01%

28.34%

MoM

-79.

01%

106

.15

%73

.38

%-1

8.02

%-3

.93

%26

7.14

%-7

8.8

0%

46

.83

%9

07.

62

%-1

7.4

9%

-90.

81

%254.59%

2008

149

,78

11

39,5

64

17

9,44

71

96,

586

235,

430

178,

513

189

,04

81

94

,73

72

07,

516

178

,71

91

22,

802

82,

47

02

,05

4,6

13

100.0%

2009

56,

012

79

,256

11

5,74

41

31,

912

152,

880

188,

374

179

,36

61

83

,13

32

74,

094

249

,35

41

74,

317

200,714

1,9

85

,15

6100.0%

YoY

-62.

60%

-43.

21%

-35.

50%

-32.

90%

-35

.06

%5

.52%

-5.1

2%

-5.9

6%

32.

08

%3

9.5

2%

41.

95

%143.38%

-3.38%

MoM

-32.

08%

41.5

0%46

.04

%13

.97

%1

5.9

0%

23

.22

%-4

.78

%2

.10

%4

9.6

7%

-9.0

3%

-30.

09

%15.14%

2008

149

,78

12

89,3

45

46

8,79

26

65,

378

900,

808

1,0

79,

321

1,2

68,

36

91,

463,

106

1,67

0,62

21,

849

,34

11

,972

,143

2,05

4,61

3--

--

2009

56,

012

135

,26

82

51,

012

38

2,9

2453

5,8

0472

4,17

89

03,5

44

1,08

6,67

71,

360,

771

1,61

0,1

25

1,7

84,4

421,985,156

YoY

-62.

60%

-53.

25%

-46.

46%

-42.

45%

-40

.52

%-3

2.9

0%-2

8.7

6%

-25

.73

%-1

8.5

5%

-12

.94

%-9

.52

%-3.38%

2008

141

,21

91

35,3

77

17

0,03

11

72,

503

175,

879

169,

906

180

,04

91

73

,89

81

74,

184

170

,17

21

17,

062

69,

77

11

,85

0,0

51

--

2009

53,

346

73

,760

10

6,21

51

24,

100

145,

375

160,

820

173

,52

41

74

,55

51

87,

660

178

,03

41

67,

763

177,474

1,7

22

,62

6

YoY

-62.

22%

-45.

52%

-37.

53%

-28.

06%

-17

.34

%-5

.35

%-3

.62

%0

.38

%7.

74

%4

.62

%4

3.3

1%154.37%

-6.89%

MoM

-23.

54%

38.2

7%44

.00

%16

.84

%1

7.1

4%

10

.62

%7.

90

%0

.59

%7.

51

%-5

.13

%-5

.77

%5.79%

總計代工成長

OE

M G

row

th (

To

tal)

Business Item/Month

切割挑檢代工

Saw

ing

& S

ort

ing

OE

M

測試代工

Tes

tin

g O

EM

機器組裝等產品銷

售 Ow

n P

rodu

ct S

ales

營業收入淨額

(Un

it:K

)

Sal

es R

even

ue

(Net

)

營業收入淨額

(累計

)

Sal

es R

even

ue

(To

tal)

Page:26

Page:26

Page:26



2008/2009 Revenue Growth


2008/2009 Revenue Growth YT

EC Company Profile


(50,0

00)

450,0

00

950,0

00

1,4

50,0

00

1,9

50,0

00

2,4

50,0

00

NT$ Thousand

-20.0

0%

0.0

0%

20.0

0%

40.0

0%

60.0

0%

80.0

0%

100.0

0%

Total

312,581

576,728

855,466

1,091,432

1,090,875

1,637,594

1,847,077

2,054,613

YoY

-7.97%

84.51%

48.33%

27.58%

-0.05%

50.12%

12.79%

11.24%

2001

2002

2003

2004

2005

2006

2007

2008

1,847,077

1,637,594

1,090,875

1,091,432

855,426

576,728

312,581

2,054,613

Page:27

Page:27

Page:27





2008/2009 Revenue Growth YT

EC Company Profile


56,012

79,256

115,744131,912152,880

179,366

249,354 174,317200,714

274,094

183,133

188,374

0

50,0

00

100,0

00

150,0

00

200,0

00

250,0

00

300,0

00

NT$ Thousand

-70.0

0%

-20.0

0%

30.0

0%

80.0

0%

130.0

0%

180.0

0%

2008

149,781 139,564 179,447 196,586 235,430 178,513 189,048 194,737 207,516 178,719 122,802

82,470

2009

56,012

79,256 115,744 131,912 152,880 188,374 179,366 183,133 274,094 249,354 174,317 200,714

YoY

-62.60%

-43.21%

-35.50%

-32.90%

-35.06%

5.52%

-5.12%

-5.96%

32.08%

39.52%

41.95%

143.38%

MoM

-32.08%

41.50%

46.04%

13.97%

15.90%

23.22%

-4.78%

2.10%

49.67%

-9.03%

-30.09%

15.14%

Jan.

Feb

Mar

Apr

May

Jun.

Jul.

Aug.

Sep.

Oct.

Nov.

Dec.

Page:28

Page:28

Page:28



20

01

~20

09

Op

erat

ing

In

com

e2

00

1~

20

09

Op

erat

ing

In

com

e2

00

1~

20

09

Op

erat

ing

In

com

eYTEC Company Profile


註：

註：

(e)

(e) 表示預估值

表示預估值

(est

imat

e)(e

stim

ate)。。

24.86%

19.21%

31.54%32.32%35.29%36.25%

40.33% 35.66%

29.09%

0

100,000

200,000

300,000

400,000

500,000

600,000

700,000

NT$(Thousand)

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

50%

Operating Income

60,042

181,844

276,457

385,137

395,432 660,483

658,642

597,776

338,255

Operating Income Rate

19.21%

31.54%

32.32%

35.29%

36.25%

40.33%

35.66%

29.09%

24.86%

2001

2002

2003

2004

2005

2006

2007

2008

2009(Q3)

Page:29

Page:29

Page:29



20

08/2

00

9 G

ross

Pro

fit

20

08/2

00

9 G

ross

Pro

fit

20

08/2

00

9 G

ross

Pro

fit



註：

註：

(e)

(e) 表示預估值

表示預估值

(est

imat

e)(e

stim

ate)。。

34,980

286,941

166,312

38.82%

44.48%

46.45%

43.80%

45.45%

51.22%

44.80%43.68%

42.18%

31.05%

45.10%

35.15%

-30,000

20,000

70,000

120,000

170,000

220,000

270,000

320,000

370,000

420,000

470,000

520,000

570,000

620,000

670,000

720,000

770,000

820,000

870,000

920,000

NT$(Thousand)

20%

25%

30%

35%

40%

45%

50%

55%

60%

2007 Gross Profit

162,362

152,535

227,656

297,015

839,568

2008 Gross Profit

204,787

283,617

259,020

119,215

866,639

2009 Gross Profit

34,980

166,312

286,941

2007 Gross Margin

44.80%

38.82%

44.48%

51.22%

45.45%

2008 Gross Margin

43.68%

46.45%

43.80%

31.05%

42.18%

2009 Gross Margin

13.93%

35.15%

45.10%

Q1

Q2

Q3

Q4(e)

Sum(e)

Page:30

Page:30

Page:30



Yea

rly

Net

In

com

e &

EP

SY

earl

y N

et I

nco

me

& E

PS

Yea

rly

Net

In

com

e &

EP

S YTEC Company Profile


8.61

5.56

8.24

7.28

6.36

7.41

6.09

2.83

050,000

100,000

150,000

200,000

250,000

300,000

350,000

400,000

450,000

500,000

550,000

600,000

650,000

700,000

750,000

NT$(Thousand)

0123456789101112

NT$

Net Income182,512

262,765

372,543

314,466

585,634

616,610

560,287

263,989

EPS

6.36

7.28

8.24

5.56

8.61

7.41

6.09

2.83

2002

2003

2004

2005

2006

2007

2008

2009(Q3)

Page:31

Page:31

Page:31



Share payout composition and history





九十二年

九十二年

九十二年

九十二年

(2003)

(2003)

(2003)

(2003)

九十三年

九十三年

九十三年

九十三年

(2004)

(2004)

(2004)

(2004)

九十四年

九十四年

九十四年

九十四年

(2005)

(2005)

(2005)

(2005)

九十五年

九十五年

九十五年

九十五年

(2006)

(2006)

(2006)

(2006)

九十六年

九十六年

九十六年

九十六年

(2007 )

(2007 )

(2007 )

(2007 )

九十七年

九十七年

九十七年

九十七年

(2008 )

(2008 )

(2008 )

(2008 )

九十八年

九十八年

九十八年

九十八年

(2009 )

(2009 )

(2009 )

(2009 )

分配九十一年

分配九十一年

分配九十一年

分配九十一年

Profit(2002)

Profit(2002)

Profit(2002)

Profit(2002)

分配九十二年

分配九十二年

分配九十二年

分配九十二年

Profit(2003)

Profit(2003)

Profit(2003)

Profit(2003)

分配九十三年

分配九十三年

分配九十三年

分配九十三年

Profit(2004)

Profit(2004)

Profit(2004)

Profit(2004)

分配九十四年

分配九十四年

分配九十四年

分配九十四年

Profit(2005)

Profit(2005)

Profit(2005)

Profit(2005)

分配九十五年

分配九十五年

分配九十五年

分配九十五年

Profit(2006)

Profit(2006)

Profit(2006)

Profit(2006)

分配九十六年

分配九十六年

分配九十六年

分配九十六年

Profit(2007)

Profit(2007)

Profit(2007)

Profit(2007)

分配九十七年

分配九十七年

分配九十七年

分配九十七年

Profit(2008)

Profit(2008)

Profit(2008)

Profit(2008)

2.00

2.00

2.00

2.00

3.00

3.00

3.00

3.00

3.00

3.00

3.00

3.00

2.61

2.61

2.61

2.61

3.99

3.99

3.99

3.99

4.00

4.00

4.00

4.00

3.00

3.00

3.00

3.00

Free

Free

Free

Free

Pair stock of

Pair stock of

Pair stock of

Pair stock of

profit

profit

profit

profit

2.00

2.00

2.00

2.00

2.00

2.00

2.00

2.00

2.00

2.00

2.00

2.00

0.87

0.87

0.87

0.87

1.00

1.00

1.00

1.00

0.50

0.50

0.50

0.50

0.10

0.10

0.10

0.10

stock

stock

stock

stock

Capital reserve

Capital reserve

Capital reserve

Capital reserve

fund

fund

fund

fund

-- -------- ------

-- -------- ------

-- -------- ------

-- ------

6.36

6.36

6.36

6.36

7.28

7.28

7.28

7.28

8.24

8.24

8.24

8.24

5.56

5.56

5.56

5.56

8.61

8.61

8.61

8.61

7.41

7.41

7.41

7.41

6.09

6.09

6.09

6.09





Year

Year

Year

Year

Cash(NTD)

Cash(NTD)

Cash(NTD)

Cash(NTD)

EPS(NTD)

EPS(NTD)

EPS(NTD)

EPS(NTD)

Page:32

Page:32

Page:32



Company competitive advantages



��Service without material stock

Service without material stock

(( 只代工不代料

只代工不代料

只代工不代料

只代工不代料

只代工不代料

只代工不代料

只代工不代料

只代工不代料))

�Absence of Stock shortage

problems

�Volume Price control

�NO influence of material price

YTEC

YTEC

YTEC

��Self

Self --made equipment

made equipment

technology(

technology( 自

製設備技術

自製設備技術

自製設備技術

自製設備技術

自製設備技術

自製設備技術

自製設備技術

自製設備技術))

�Core technology of design

�High conformity and high

flexibility of designs

�Low cost

��Multiple

Multiple-- angle management

angle management

(( 多角化經營

多角化經營

多角化經營

多角化經營

多角化經營

多角化經營

多角化經營

多角化經營))

Integrating and improving the

existing technology and

resources :

�Semiconductor

�Optoelectronic

�GPS and wireless

��Supplementary and balanced product

Supplementary and balanced product

lines(

lines( 互

補及平橫的產品線

互補及平橫的產品線






互補及平橫的產品線))

�A diverse product line leads to

consistent sales and continuous

growth in revenue

�Services and Own product sales will

increase revenues

��Deep and broad client

Deep and broad client

base(

base( 深

廣的客戶群

深廣的客戶群

深廣的客戶群

深廣的客戶群

深廣的客戶群

深廣的客戶群

深廣的客戶群

深廣的客戶群))

�Strict confidence level with

clients

�Assisting customers to

Assisting customers to



reduce costs, achieving




a win

a win

a win

a win- ---win outcome.

win outcome.

win outcome.

win outcome.

�Cooperating with clients to

meet international market

standards

��The demand for

The demand for LEDs

LEDs &

&

Semiconductors is still increasing

Semiconductors is still increasing

( IC&LED

( IC&LED仍

呈正成長趨勢

仍呈正成長趨勢






仍呈正成長趨勢))



Page:33

Page:33

Page:33



著眼於國內外市場的開拓，讓久元成為立足台灣的整合

著眼於國內外市場的開拓，讓久元成為立足台灣的整合

性後段

性後段ICIC代工服務廠，並朝放眼世界的自有產品、自有

代工服務廠，並朝放眼世界的自有產品、自有

品牌邁進。

品牌邁進。公司願景

Co

mp

any

Mis

sio

n公

司願景

公司願景

Co

mp

any

Mis

sio

nC

om

pan

y M

issi

on

Based on the domestic and international

marketing development, YTEC has gotten a

foothold as an integrated back-end IC OEM

factory. YTEC m

oves forward, with it’s own

products, and Own Bench M

arks.



Page:34

Page:34

Page:34



Q & A

Q & A

Q & A



Page:35

Page:35

Page:35

YTEC Profile Presentation for Credit suisse 20090112-Final

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