[email protected]FEE-2011, Bergamo University 1 Novel packaging methods for ultra-thin monolithic sensors ladders construction Wojciech Dulinski Wojciech Dulinski 1 1 on behalf of on behalf of PLUME PLUME , , SERVIETTE SERVIETTE and and PLUMETTE PLUMETTE Collaboration Collaboration 1 IPHC/IN2P3 Strasbourg, France IPHC/IN2P3 Strasbourg, France 5 University of Bristol, UK University of Bristol, UK 6 DESY, Hamburg, Germany DESY, Hamburg, Germany 7 University of Oxford, UK University of Oxford, UK 2 IMEC, Leuven, Belgium IMEC, Leuven, Belgium 3 CMST, University of Gent, Belgium CMST, University of Gent, Belgium 4 IFK, Goethe University, Frankfurt/M, Germany IFK, Goethe University, Frankfurt/M, Germany 8 CERN, Geneva CERN, Geneva Outline Short status of MAPS development at IPHC PLUME: the lightweight ladder based on standard flex PCB Embedding in plastics projects (two different process approach) Conclusions and prospects
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[email protected] FEE-2011, Bergamo University 1 Novel packaging methods for ultra-thin monolithic sensors ladders construction Wojciech.
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Novel packaging methods for ultra-thin monolithic sensors ladders construction
Wojciech DulinskiWojciech Dulinski11
on behalf of on behalf of PLUMEPLUME, , SERVIETTESERVIETTE and and PLUMETTEPLUMETTE Collaboration Collaboration
11IPHC/IN2P3 Strasbourg, FranceIPHC/IN2P3 Strasbourg, France55University of Bristol, UKUniversity of Bristol, UK
66DESY, Hamburg, GermanyDESY, Hamburg, Germany77University of Oxford, UKUniversity of Oxford, UK22IMEC, Leuven, BelgiumIMEC, Leuven, Belgium
33CMST, University of Gent, BelgiumCMST, University of Gent, Belgium44IFK, Goethe University, Frankfurt/M, GermanyIFK, Goethe University, Frankfurt/M, Germany
88CERN, GenevaCERN, Geneva
Outline Short status of MAPS development at IPHC PLUME: the lightweight ladder based on standard flex PCB Embedding in plastics projects (two different process approach) Conclusions and prospects
- Total 730 mW (1/3 for pixel, discri and digital)- 250 mW/cm2 (160 mW/cm2 for STAR Ultimate)- 1.1 µW/pixel (5-10 µW/pixel for time continuous shaping ~1 µs)
- Power dissipation distributed unevenly: hot spots!
PLUMETTE: details of 1st, “redistribution” metal layer
If too difficult for PCB-standard lithography (too small feature size), this post-processing step can be provided by CMOS foundry (discussion with AMS, 5th metal in 0.35 µm process)