Versatile Link PLUS - CERN Documents... · 14 Gb/s VCSEL/photodiode from Philips Photonics (ULM) Their optical coupling blocks are different V1 is using US conec’sMechanical Optical

Versatile Link+

Versatile Link PLUS

Francois VaseyEP-ESE-BE

on behalf of the VL+ collaboration

Based on a presentation by C. Soos, TWEPP16

Versatile Link+Outline

1. Versatile Link PLUS project introduction2. VL+ front-end module3. Cables, connectors and integration4. Backend

5. VL + project roadmap

● Note: this is not an exhaustive description of the project status, but a digest focusing on VL+ system development and roadmap. Apologies to those whose work was only superficially covered.

ATLAS Upgrade Week Nov 2016 [email protected] 2

Versatile Link+1. Introduction to Versatile Link PLUS

● The Versatile Link PLUS project (VL+) targets the phase II upgrades of the ATLAS and CMS experiments

● VL+ was officially announced at ACES 2014 and started on 1 Apr 2014. It is subdivided in three phases of 18 months each: ● Phase 1: proof of concept (Apr 2014 – Oct 2015)● Phase 2: feasibility demonstration (Oct 2015 – Apr 2017)● Phase 3: pre-production readiness (Apr 2017 – Oct 2018)

● Collaboration between CERN, FNAL, Oxford, and SMUVersatile Link Versatile Link PLUS

Optical mode Single- and multi-mode Multi-mode

Flavours 1Tx+1Rx, 2Tx Configurable (up to 4Tx)+(1Rx)

Radiation level Up to Calorimeter grade Up to Tracker grade

Form factor SFP+ Custom miniature

Data rate Tx/Rx: 5 Gb/s Tx: 5/10 Gb/s, Rx: 2.5 Gb/s

Table : Key differences between VL and VL+


Versatile Link+Versatile Link PLUS architecture

FPGA

TX

RXVCSEL(array)

LDD(array)

PINTIA

Off-DetectorCommercial Off-The-Shelf (COTS)

Custom Protocol

SERDES

SERDES

SERDES

lpGBTor otherSERDES

On-DetectorCustom Electronics & Packaging

Radiation Hard

Versatile Link PLUS

Ligh

t cou

plin

g un

it

Passives

VTRx+


Versatile Link+2. VL+ front-end module

● Versatile● Up to 4Tx + up to 1 Rx, configurable at build time or by masking channels● 4Tx + 4Tx may become feasible (TBD)

● MM only● 850 nm VCSEL● InGaAs PIN (TBC)

● Miniaturised● Target dimensions 20 x 10 x 2 mm

● Pluggable● Either optical or electrical (or both)

connector● Data-rate:

● Tx: up to 10 Gb/s (nominal 5Gb/s or 10Gb/s)● Rx: up to 5 Gb/s (nominal 2.5Gb/s)

● Environment● Temperature: -35 to + 60 °C● Radiation (based on Tracker requirements)

● Total Dose: 1 MGy qualification (investigations up to 2 MGy)● Total Fluence: 2x1015 n/cm2 and 1x1015 hadrons/cm2

FPG

A

TX RX

VTR

x+

SER

DES

SER

DES

SER

DES

SER

DES

VTRx

VL+


Versatile Link+VL+ front-end module variants

1 TX + 1 RX 3 TX (single channel LDDs) + 1 RX 4 TX (single channel LDDs)

1/3/4 TX (using LDD array) + 1 RX 4/8 TX (using LDD arrays)

Discrete-basedderived from:• Light peak• USB-3• ThunderboltConfigured at buildtime

Array-basedderived from:• QSFP+ engine• Mid-Board engineConfigured at turn on


Versatile Link+Dual approach

A. Modification of existing commercial modules● Working in close collaboration with module manufacturers

●Minimise customisation to retain cost benefit from volume production, and profit from extensive product qualification

● Will result in 4Tx + 1Rx engine, but will violate the 2mm height spec

B. In-house design of full-custom module● Working in close collaboration with suppliers of optical coupling blocks● Working in close collaboration with industrial partners on integration

●CERN-designed PCB●CERN-specified opto-die●CERN-designed ASICs (LDD, TIA-LA)

● Potentially the path to highest level of affordable customisation


Versatile Link+A. Commercial module customization

● Progression from standard component to customized object suitable for CERN project needs● Start with evaluation of standard component and sub-components (Steps 0/1) on a per-

vendor basis


CERN Market Survey MS-4236 CERN Invitation to Tendercustomization of commercial module

Versatile Link+A. Testing candidate commercial modules

● First samples from various module vendors have been functionally tested in the laboratory (Step 0). More samples are coming.

● Modules containing only optical components have been requested for environmental tests (Step 1)

Target size


Versatile Link+B. In-house full custom designs

● In-house design and development of full custom module● First two prototypes are based on same active components

● Single-channel laser driver (commercial) and CERN radiation tolerant TIA (GBTIA)● 14 Gb/s VCSEL/photodiode from Philips Photonics (ULM)

● Their optical coupling blocks are different● V1 is using US conec’s Mechanical Optical Interface (MOI) + Prizm (up to 8 channels)● V2 is using a low-profile optical coupling unit (up to 4 channels)

4.5 mm

2.8 mm

19 mm

V1 V2


Versatile Link+B. V1 and V2 prototype functional tests

5Gb/s 10Gb/s

All prototypes 1 deviceoptical mating/demating

11

4.8Gb/s 10Gb/s

All prototypes 2 prototypesoptical mating/demating

V1 V2

Versatile Link+B. Full-custom VL+ front-end – V3

● First prototype based on custom ASICs and commercial optical components● Quad laser driver (SMU- LDQ10) and TIA

(IN2P3-GBTIA)● 14 Gb/s VCSEL array/photodiode from

Philips Photonics (ULM)● US conec’s MOI● QSFP interface

● 4 Tx + 1 Rx configuration● Assembled by the same industrial partner

as V1 and V2


Versatile Link+V3 prototype functional tests

5Gb/s 10Gb/s

13

4.8Gb/s 10Gb/s

V1 V3

V1, V2:- 1Tx + 1Rx- Commercial laser driver- Rad soft- SFP+ electrical interface

V3:- 4Tx + 1Rx- Custom LDQ10 laser driver- Rad hard- QSFP electrical interface

Versatile Link+VCSEL reliability in non-hermetic package

● 85/85 RH measurements● TOSA● Bare VCSEL● V1 package


Versatile Link+VTRx+ summary

● VTRx+ prototype demonstrated up to 10Gbps(Tx) / 5Gbps(Rx)● In-house full custom design● GBTIA and LDQ10 rad hard ASICs● Validated VCSEL array and Pin● Next step: squeeze to 20 x 10 x 2 mm target● Few samples available for in-detector testing

● Commercial modules identified and under investigation● Procurement framework established● First customization steps launched● Unlikely to fully comply with 20 x 10 x 2 mm target● Would 20 x 10 x 4 mm be OK?


Versatile Link+3. Cabling and Integration


Versatile Link+Fibre Radiation-Induced Attenuation


Cumulated radiation induced attenuation (RIA) along light path Dose-rate dependence of RIA as a function of total dose

Versatile Link+Connectors capacity and insertion loss

● New connectors under investigation● Promise for high density (nx12, n

Versatile Link+Cabling and Integration Summary

● By end of VL+ project phase II (Q1-2017):● Updated VTRx+ footprint● Proposal for patch cords, cables and connectors● Now is the right time to have preliminary discussions


Versatile Link+4. Backend

● Evaluated commercial mid-board optics from 4 suppliers● 10Gbps multi-channel modules will be a commodity by 2020● Nevertheless, compliance with VL+ spec is mandatory● Board designers, please follow VL+ selection guide, once available


Versatile Link+5. VL+ phase II deliverables (Apr 2017)

● Detailed specifications for components and system● Components and Variants shortlist● Front-end Transceiver package definition and prototype

fabrication integrating ASICs and validated optoelectronics● Complete set of functionality test results for all components● Complete set of irradiation test results for front-end and

passive components● Complete set of reliability test results for front-end

components● System demonstrators with validated components● Preliminary evaluation of production costs versus volume


Versatile Link+5. VL+ phase III deliverables (Oct 2018)

● Specification freeze● Formal procurement framework in place for production● Validation of samples supplied for procurement framework

(functionality and radiation hardness)● Manufacturers shortlist● Production cost matrix● Documentation


Versatile Link+Backups


Versatile Link+Commercial roadmap

● Development (until 2018)● CERN Market Survey

●CERN issues Technical Requirement & Questionnaire●Companies return completed Questionnaire●CERN reserves the right to order samples (Steps 0, 1) and/or ASIC drop-

ins to existing parts for evaluation (Steps 2, 3)●CERN qualifies companies having required technology

● CERN Price Enquiry●Qualified companies receive full technical specification for development●Qualified companies bid for development (Step 4)

● Production (2019 onwards)● Companies having successfully completed development (on time, in budget)

will be invited to tender for full production● One or two lowest cost bidder(s) will receive production contract


Versatile Link+Custom module development roadmap

Q3’15 Q4‘15 Q1‘16 Q2’16 Q3’16 Q4’16 Q1’17

2ch TRx v1MOISFP+CERN TIACommercial LDD

2ch variantOpto I/FElectrical I/FRxTx

2ch TRx v2Low-profileSFP+CERN TIACommercial LDD

4ch variantOpto I/FElectrical I/FRxTx

4ch TRx v1MOIQSFPGBTIALDD array

Legend:MOI – Mechanical Optical InterfaceGBTIA – CERN receiver ASICGBLD10+ – CERN single-channel VCSEL driver ASICLDD array – 4-channel Laser Diode Driver array

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Versatile Link PLUS��Francois Vasey�EP-ESE-BE��on behalf of the VL+ collaboration��Based on a presentation by C. Soos, TWEPP16��Outline1. Introduction to Versatile Link PLUSVersatile Link PLUS architecture2. VL+ front-end moduleVL+ front-end module variantsDual approachA. Commercial module customizationA. Testing candidate commercial modules B. In-house full custom designsB. V1 and V2 prototype functional testsB. Full-custom VL+ front-end – V3V3 prototype functional testsVCSEL reliability in non-hermetic packageVTRx+ summary3. Cabling and IntegrationFibre Radiation-Induced AttenuationConnectors capacity and insertion lossCabling and Integration Summary4. Backend5. VL+ phase II deliverables (Apr 2017)5. VL+ phase III deliverables (Oct 2018)BackupsCommercial roadmapCustom module development roadmap