Vacuum Process Solutions for High Throughput … Lean. Create Value. Vacuum Process Solutions for High Throughput Advanced Media Manufacturing DISKCON ASIA PACIFIC …

Think Lean. Create Value.

Vacuum Process Solutions for High Throughput Advanced

Media ManufacturingDISKCON ASIA PACIFIC 2009

Presented by Michael A. Russak, Ph.D.

Intevac, Inc.3560 Bassett St.

Santa Clara, CA 95054-2704March 13, 2009

Think Lean. Create Value.DISKCON AP 2009 Advanced Technology_Slide 2

Media Technology Roadmap

Source: Semiconductor International, 5/22/2008

10000Current State of the Art

380 Gb/in2 = 500 GB/Platter 3.5 Inch Disk

1000

100

10

12001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

Are

al D

ensi

ty (G

bit/i

n2 )


Extending Continuous Media Capacity

Media Strategy: – Higher Anisotropy (Coercivity) Smaller Grains Higher Storage Density– Higher Anisotropy Alloys Stronger Writer, or Softening Magnetic

Material at Moment of Writing HAMR– Advanced ECC/Spring Media

Material Choices: CoPtand/or FePt-L10

Media Process: 350°C-800°C

Anisotropy

5Tb/in2

1Tb/in2

245Gb/in2

FePt(MLS)

Dieter Weller et. al IEEE Trans. Magn. 36, 10 (2000)


Enabling Technology for Advanced Media

Sources for High Coercivity Media – Multi-Layer Thin Films – Production Multi-Layer Source (MLS) – Triatron Source for alloy development

Sources for Discrete Track Recording (DTR) / Bit Patterned Media (BPM)– Sputter Etch – ICP Source

Integrated DTR / BPM Tool Based on 200 Lean Platform– DTR media manufacturing at >500 disks per hour

AccuLuber – Vacuum Vapor Lubrication

LithoPrime – Surface Adhesion for Nano-Imprint Lithography


Multi-Layer Source (MLS)

The Only Production Compatible Multi-Layer Source

Ultra-Thin Multi-Layer Deposition Source for High Coercivity Media

Operates in “Pass-By” Mode

Deposits up to Three Different Materials in One Chamber

Excellent Uniformity

Source Mounted on 200 Lean System


Granular PMR1. Epitaxy to force orientation in CoPtCr

alloy systems– Epitaxial growth Perpendicular

orientation:(NiP-Al/ CoZrTa/Ru/CoZrTa/ Ta/Ru/CoPtCrO/Co-alloy)

– Grain orientation critical (half angle θ<2.5o)

2. SUL to stabilize perpendicular orientation by reducing surface charge density at bottom of Magnetic Layers

3. Main limitation is vertical anisotropy (Ms: 400emu/cm3 for CoPtCr alloys)

Multi-Layer PMR (Super-Lattices)1. High anisotropy material: FePt, CoPt,

FePd, CoPd; (Ms: 800emu/cm3 ; Ku ~ 7x107 erg/cm3)

2. Crystallization temperature for L10 phase typically at 600-700oC;

3. Super-lattice structure (alternating layers of Fe and Pt, at >2 nm each) reduces crystallization temperature to <150oC;

High Vertical Anisotropy in Multilayers

Seed Layer

Oxide Layer

MagL 1

SUL2

Ru

Ms/Hc

SUL1

Under Layer

Inter Layer

MagL 2MagL 3

Substrate

MagL 1 Fe, CoPt, Pd

Seed Layer

Oxide Layer

Inter Layer

SUL

Under LayerSubstrate

(Fe, Co)/(Pt, Pd) super lattices, each layer ~4 - 5 unit cell, 2 nm

FCCFe/Pt

FCTL10

Fe, CoPt, Pd

e.g. S. Yamamoto et. al, J. Appl. Phys., 95, 7285, (2004)


Rates, Uniformity

Non-mag target rate stays relatively flat through pressure range.

Mag target rate drops linearly with pressure.

Circumferential thickness uniformity is very good for 65mm disks: std. dev.<2%.

y = -0.1094x + 14.352R2 = 0.9992

0

5

10

15

20

0 20 40 60 80 100

pressure (mT)

depo

sitio

n ra

te (A

/pas

s_ Non-magnetic target

Magnetic target

Cell Angle Radius Thickness0.9 188.81.1 188.40.9 190.21.1 188.40.9 187.61.1 188.00.9 188.71.1 189.9

B18A

0

90

180

270


Rate Control: Magnetic Target

Deposition rate is proportional to power density, layer number, and inversely to carrier speed.

0

50

100

150

200

250

300

350

400

450

0 100 200 300 400 500 600

Power (W)

Thic

knes

s (A

)

50mm/s100mm/s200mm/s

0

50

100

150

200

250

300

350

400

450

0 50 100 150 200 250

Speed (mm/s)

Thic

knes

s (A

)

100W300W500W

0

50

100

150

200

250

300

350

0 20 40 60 80

Number of Pass

Thic

knes

s (A

)

100mm/s, 500W


Rate Control: Non-magnetic

Non-magnetic material thickness shows the same dependency of rate on target power, pass-by speed, and number of passes. Generally higher rates than magnetic targets.

0

100

200

300

400

500

600

700

0 100 200 300 400 500 600

Power (W)

Thic

knes

s (A

)

50mm/s100mm/s200mm/s

0

100

200

300

400

500

600

700

0 50 100 150 200 250

Speed (mm/s)

Thic

knes

s (A

)

100W300W500W

0

100

200

300

400

500

600

0 20 40 60 80

Number of Pass

Thic

knes

s (A

)

100mm/s, 500W


Uniformity

Reasonable circumferential uniformity in magnetic properties.

Consistent side-by-side data.

Disc# Side Hc dHc (%) Mrt dMrt (%)4 A 6099 4.3 0.774 3.34 B 6071 2.3 0.744 2

10 A 3303 3 0.586 4.710 B 3273 3.2 0.548 4.618 A 5114 1.1 0.895 3.618 B 5178 2.8 0.887 2.119 A 4804 2.2 0.918 2.219 B 4879 1.6 0.925 2.4


Triatron Source

Effective Magnetic Alloy Research and Development Tool

Development of New Alloys – Optimization of alloy composition– Adding new components in an alloy

Three Independent Concentric Targets

Separate Power Control for ID, MD & OD Target

RF Power for ID Target (MD Target) Available



Patterned Media ManufacturingCleanClean

Intevac 200 Lean® (Deposition)

Magnetic Media DepositionMagnetic Media Deposition

Prime Media SurfacePrime Media Surface

Apply Pattern to MediaApply Pattern to Media

Intevac 200 Lean (Etch)

Etch Pattern into MediaEtch Pattern into Media

Intevac AccuLuber™

Lube DiskLube DiskBurnishBurnish

TestTest

New ManufacturingNew Manufacturing

Intevac LithoPrime™Steps for Steps for

Patterned MediaPatterned Media

Imprint Lithography


DTR / BPM Tool Placement in Media LineDTR / BPM Tool Placement in Media Line

Clean Substrate

Recording Layer

(200 Lean)SeedL

ULIL

Multiple MagLCOC

Lubrication(AccuLuber)Lubrication

Glide Test(BurnishingPass, Glide

Test)

UV Bonding Certification

Cert Test

Shipment

Tape BurnishNano Imprint

Lithography(LithoPrime

Imprio)

QA

Media Pattern(Lean_

DTR/BPM)De-Scum/TrimC-Hard MaskResist Strip

Mag Stack EtchPlanarization

Continuous Media Proc/Eqpt Nano Imprint Lithography Bit Patterned Media


DTR / BPM Process Example

Full Mag-Stack

NILPatterned

Resist

Etch HardMask

Mag-StackEtch

Refill/ Etch-Back/

Planarization

NCTCarbon

SubstrateSUL

MagLayerSeedL: Ru

C-HM

Resist

Sequential Process

Side 1 Side 2

Sequential Process

Side 1 Side 2

Sche

mat

icPr

oces

sC

ritic

alTh

ickn

ess

500-1000Å 500-1000Å 200-500Å <10Å~200Å <10Å


High Throughput DTR Manufacturing System

Integrated Process Overview– De-scum / resist trim – Hard mask etch– Magnetic stack etch– Planarization

200 Lean Gen II Platform

Throughput: >500DPH, Goal is 1000DPH (~3 Sec Process)

System Concept for 2-Sided Disk Process

Station No.200L Front

Module 1 2 3 4 5 6 7 8200L Rear

Module

Process Step DescumSide 1

DescumSide 2

HM EtchSide 1

HM EtchSide 2

Mag EtchSide 1

Mag EtchSide 1

Mag EtchSide 2

Mag EtchSide 2

Station No.Disk Load/

Unload 16 15 14 13 12 11 10 9200L Rear

Module

Process Step Flash Carbon DLC Etch Back

Side 2Etch Back

Side 1 Refil PR StripSide 2

PR StripSide 1


DTR Etch Source

Proprietary Etch Technology

Highest Etch Rate– >10X higher than competitor– Capable of high throughput >500 disks

per hour



AccuLuber

Provides Improved Process Control

Superior Lube Uniformity

High Throughput of 1300 Disks Per Hour in Parallel Operation Mode

Eliminates the Use of Costly and Hazardous Solvents in the Lubrication Process

Tools in Volume Production


Traditional Gravity-Drain Lubrication Process

At the design point of 16A total lubricant thickness, typical non-uniformity causes on a traditionally lubricated disk:

ID mandrel holding point lubricant droplet (~20A)

Top of mandrel breaking lube solution surface causing ripple and subsequently resulting in disk surface ripple mark (~6A)

Bottom of disk at OD retaining lubricant puddle and causing lubricant thickness non-uniformity (~16A)

These non-uniformities are causes for head lube pick up, high fly write, head instability, and head degraded-lube buildup

Disk surface ripple mark

ID mandrel holding mark

OD bottom puddle

Lubricant film

Draining meniscus


AccuLuber

Improved Process Control and Defect Reduction

Eliminates the Use of Costly and Hazardous Solvents in the Lubrication Process

– ~$150K USD savings in solvent usage per luber per year

High Throughput: 1200 Disk Per Hour in Parallel Mode

System Has Shipped to Customer

40mm

-40mm

-40mm

40mm

13.2

13.8

14.0

13.5

13.7

13.8

13.6

13.214.7

15.1

15.1

15.2

15.3

15.3

15.2

14.8 14.314.3

14.4

14.514.5

14.5

14.4

14.3

Uniformity ± 1Å

Zone 1:Evaporator

Zone 2:Wall

Zone 3:Diffuser Plate

Disk to be lifted tovapor zone for deposition


LithoPrime

Nano Imprint Lithography Priming Layer Critical for Substrate Resist Adhesion

Fully Automated Process and Control

Low Defect Disk Handling

Batch Processing

Compact Footprint

Tools Shipped to Development Fabs

23”w x 56h x 56d


LithoPrime Overview

NIL Priming Layer Critical for Substrate Resist Adhesion

Developed In Partnership with A NIL Tool Manufacturer

Batch Loading into Process Chamber (25 Disks)

Single Cassette, 65mm (95, 54 & 48mm Future)

Single Reaction Chamber, Heated, Shielded

Controllable Gas / Liquid Delivery– N2, O2 or O3, ValmatTM (Molecular Imprints Inc.), DI water

Ozone Pre-Clean

Dimensions: 23”w x 56h x 56d


LIthoPrime Performance

Precursor: ValMat, DI Water

Process Pressure: 50mTorr-700Torr

Process Mode: Batch process at cassette level

Throughput:– Optimized to run in parallel with NIL Tool

Bonding Force:– >30Lb (Molecular Imprint De-bonding Test)


Summary

The media industry will undergo a major transition in the next few years from planar, granular media to patterned media

Additionally, while not as radical a transition; the nature of the recording layer may move from tradition multi-elemental CoPtXYalloy based systems to a new class of alloys based on high Ku binary alloy multilayer systems

These transitions will be driven by capital equipment availability and costs. This is a new era for the HDD industry.

High throughput, reliable, cost effective manufacturing solutions will be required to reduce these emerging technology elements topractice.

Vacuum Process Solutions for High Throughput … Lean. Create Value. Vacuum Process Solutions for High Throughput Advanced Media Manufacturing DISKCON ASIA PACIFIC …

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