THESIS - Emerson Network Power (3).docx

7/23/2019 THESIS - Emerson Network Power (3).docx

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CHAPTER I

1.1 INTRODUCTION

The company of Emerson Network Power, Cavite, is a division of

Emerson Electric Company, a global technology company that specializes

primarily to engage in the manufacture of electronic power conversion

products. lso in the development and manufacture of power backup

systems, power supplies, embedded computing solutions, precision cooling,

racks!enclosures, infrastructure management, and connectivity technologies

for original e"uipment manufacturers, and telecommunications service

providers.

The company is composed of di#erent production area consisting of a

number of production lines, which produces speci$c electronic products in

each line. %rom that, the company allowed us to conduct our study at the

&P Production speci$cally at 'P( 'ine in which there is an application of

)otion * Time &tudy +)T&, which really suited for the ob-ective of our study.

uring our line tour at 'P( 'ine, we observed each process conducting

a )otion * Time &tudy to gathered data for us to see where the bottleneck

occurred. %rom that we found out that the consumed time at /CT &tation

e0ceeded the design cycle time that is why among all operations it is themain source of bottleneck causing production delay.

&imilar organizations will bene$t from the study, serving as a reference

for future use.

1.2 COMPANY PROFILE:

Company Name!ddress1 stec Power Philippines, /nc.)ain ve. Corner 2d. 3,

Cavite Economic 4one,

2osario, Cavite, Philippines

Company Telephone!%a0 Nos.1 567 896 :;< =888 !


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567 896 :;< =)ounting @ulk Power ?nits

=


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1.3 BACKGROUND OF THE STUDY

'C)>688 is an advanced type of circuit board that Emerson Network

Power recently developed. @ased on the data gathered, the bottleneck of the

production line process is in the /CT &tation. The target output is :,98A

pieces but the produced output was only :,8=9 which is :B.:= of the


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&PEC/%/C D@3ECT/FEo To improve e0isting process of the production line

o To reduce idle time of the operators waiting due to the delay of

the production

o To achieve the highest possible productivity of 'C)>688

1.6 SIGNIFICANCE OF THE STUDY

The assessment pro-ect was developed for further analyzation of the

sought problem and it will provide bene$ts to the following1

1. Company

This study can help the company to realize the problems that ac"uire

additional cost in the production and to come out with a solution to the said

problem.

2. Employee of the Company

This study could motivate and challenge the employees to $nd ways

that will surely help the production in achieving the highest productivity.

3. Customer of Company

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This study will make them be more cognizant and aware of how the

company produced their products.

4. Future Researchers

This study can serve as a reference guide to the future researchers to

improve their related research allowing them to have further ideas for the

development of their studies.

5. Researcher

2esearchers may $nd the $ndings useful by providing some insightsand information on how they come up with the study.

1. SCOPE AND LIMITATIONS

The study was conducted to determine the factors a#ecting for not

meeting the target output of the production and the study will focus on the

production line of Emerson Network Power particularly in the /CT &tation

producing 'C)>688 from the month of Dctober =8


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Interview

The researchers conducted an interview to the sta#, team leaders,

supervisors and manager of the company in order to gather enough

information and to be familiar on the processes involve in the production

line. Engineering epartment e0plained the Gow of operations and guided

the researchers in their line tour describing each processes the product

undergoes.

Oservation

The proponent involved himself to permit the researchers to wander

inside the manufacturing location and allow them to e0amine the operations.

Dbservation to the operation provides the researcher further understanding

to the whole process and every detail and skills needed for the production.

Research an! "ata #atherin#

The data is gathered with the help of Dperations )anager. He permits

the researchers to make a company visit to see the input and output recordsand gives some information of the coming and goings of the production

department. The %inancing )anager also provided some data to the

researchers. Iith the following data collected the researchers were able to

formulate solutions to the problem of the production.

6


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1." DEFINITION OF TERMS

CT > Cycle time is the total time from the beginning to the end of process

T > downtime time when you are not working or busy, time during which a

computer or machine is not working.

Janban sign > The term kanban refers to a visual replenishment signal such

as a card or an empty bin for an item

D& > operational se"uence analysis, is a predetermined motion time system

that is used primarily in industrial settings to set the standard time

DT > overtime is the amount of time someone works beyond normal working

hours.

( > (uality assurance +( is a way of preventing mistakes or defects inmanufactured products and avoiding problems when delivering services to

customers.

(uota > a speci$c amount or number that is e0pected to be achieved

;


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CHAPTER IIREVIE# OF RELATED LITERATURE

printed circuit board, or PC@, is a self>contained module of

interconnected electronic components found in devices ranging fromcommon $%%&%'()or pagers, and radios to sophisticated radar and

computer systems. The circuits are formed by a thin layer of conducting

material deposited, or Kprinted,K on the surface of an insulating board known

as the substrate. /ndividual electronic components are placed on the surface

of the substrate and soldered to the interconnecting circuits. Contact $ngers

along one or more edges of the substrate act as connectors to other PC@s or

to e0ternal electrical devices such as on>o# switches. printed circuit board

may have circuits that perform a single function, such as a signal ampli$er,

or multiple functions.

There are three ma-or types of printed circuit board construction1

single>sided, double>sided, and multi>layered. &ingle>sided boards have the

components on one side of the substrate. Ihen the number of components

becomes too much for a single>sided board, a double>sided board may be

used. Electrical connections between the circuits on each side are made by

drilling holes through the substrate in appropriate locations and plating the

inside of the holes with a conducting material. The third type, a multi>layered

board, has a substrate made up of layers of printed circuits separated by

layers of insulation. The components on the surface connect through plated

A


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holes drilled down to the appropriate circuit layer. This greatly simpli$es the

circuit pattern.

Components on a printed circuit board are electrically connected to the

circuits by two di#erent methods1 the older Kthrough hole technologyK and

the newer Ksurface mount technology.K Iith through hole technology, each

component has thin wires, or leads, which are pushed through small holes in

the substrate and soldered to connection pads in the circuits on the opposite

side. ravity and friction between the leads and the sides of the holes keeps

the components in place until they are soldered. Iith surface mount

technology, stubby 3>shaped or '>shaped legs on each component contact

the printed circuits directly. solder paste consisting of glue, Gu0, and solder

are applied at the point of contact to hold the components in place until the

solder is melted, or KreGowed,K in an oven to make the $nal connection.

lthough surface mount technology re"uires greater care in the placement of

the components, it eliminates the time>consuming drilling process and the

space>consuming connection pads inherent with through hole technology.@oth technologies are used today.

Two other types of circuit assemblies are related to the printed circuit

board. n *+,%-',%/ 0*'0*,)sometimes called an /C or microchip,

performs similar functions to a printed circuit board e0cept the /C contains

many more circuits and components that are electrochemically KgrownK in

place on the surface of a very small chip of silicon. hybrid circuit, as the

name implies, looks like a printed circuit board, but contains some

components that are grown onto the surface of the substrate rather than

being placed on the surface and soldered.

History

:


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Printed circuit boards evolved from electrical connection systems that

were developed in the


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esign

There is no such thing as a standard printed circuit board. Each board

has a uni"ue function for a particular product and must be designed to

perform that function in the space allotted. @oard designers use computer>

aided design systems with special software to layout the circuit pattern on

the board. The spaces between electrical conducting paths are often 8.89

inches +


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lead to prevent o0idation. Contact $ngers are plated with tin>lead, then

nickel, and $nally gold for e0cellent conductivity.

Purchased components include resistors, capacitors, transistors, diodes,

integrated circuit chips, and others.

The )anufacturing

Process

Printed circuit board processing and assembly are done in an

e0tremely clean environment where the air and components can be kept free

of contamination. )ost electronic manufacturers have their own proprietary

processes, but the following steps might typically be used to make a two>

sided printed circuit board.

Ioven glass $ber is unwound from a roll and fed through a process

station


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F*-'% 2 M*+- ,7% ($(,',% shows an enlarged section of a

PC@.

where it is impregnated with epo0y resin either by dipping or spraying.

The impregnated glass $ber then passes through rollers which roll the

material to the desired thick>ness for the $nished substrate and also

remove any e0cess resin.

The substrate material passes through an oven where it is semicured.

fter the oven, the material is cut into large panels.

The panels are stacked in layers, alternating with layers of adhesive>

backed copper foil. The stacks are placed in a press where they are


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sub-ected to temperatures of about 798M% +


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F*-'% 2$ D'**+- +/ &,*+- ,7% 78%( shows the drilling and

plating the holes after the individual boards are cut from the larger

panel.

Creatin# the printe! circuit pattern on the sustrate

The printed circuit pattern may be created by an KadditiveK process or a

KsubtractiveK process. /n the additive process, copper is plated, or added,

onto the surface of the substrate in the desired pattern, leaving the rest of

the surface unplated. /n the subtractive process, the entire surface of the

substrate is $rst plated, and then the areas that are not part of the desired

pattern are etched away, or subtracted. Ie shall describe the additive

process.

The foil surface of the substrate is degreased. The panels pass through

a vacuum chamber where a layer of positive photoresist material is


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pressed $rmly onto the entire surface of the foil. positive photoresist

material is a polymer that has the property of becoming more solublewhen e0posed to ultraviolet light. The vacuum ensures that no air

bubbles are trapped between the foil and the photoresist. The printed

circuit pattern mask is laid on top of the photoresist and the panels are

e0posed to an intense ultraviolet light. @ecause the mask is clear in the

areas of the printed circuit pattern, the photoresist in those areas is

irradiated and becomes very soluble.

The mask is removed, and the surface of the panels is sprayed with an

alkaline developer that dissolves the irradiated photoresist in the areas

of the printed circuit pattern, leaving the copper foil e0posed on the

surface of the substrate.

The panels are then electroplated with copper. The foil on the surface

of the substrate acts as the cathode in this process, and the copper is

plated in the e0posed foil areas to a thickness of about 8.888.88=inches +8.8=B>8.8B8 mm. The areas still covered with photoresist

cannot act as a cathode and are not plated. Tin>lead or another

protective coating is plated on top of the copper plating to prevent the

copper from o0idizing and as a resist for the ne0t manufacturing step.

The photoresist is stripped from the boards with a solvent to e0pose

the substrateLs copper foil between the plated printed circuit pattern.

The boards are sprayed with an acid solution which eats away the

copper foil. The copper plating on the printed circuit pattern is

protected by the tin>lead coating and is una#ected by the acid.


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$ttachin# the contact %n#ers

The contact $ngers are attached to the edge of the substrate to

connect with the printed circuit. The contact $ngers are masked o#

from the rest of the board and then plated. Plating is done with three

metals1 $rst tin>lead, ne0t nickel, then gold.

Fusin# the tin&lea! coatin#

The tin>lead coating on the surface of the copper printed circuit pattern

is very porous and is easily o0idized. To protect it, the panels are

passed through a KreGowK oven or hot oil bath which causes the tin>

lead to melt, or reGow, into a shiny surface.

'ealin#( stencilin#( an! cuttin# the panels

Each panel is sealed with epo0y to protect the circuits from being

damaged while components are being attached. /nstructions and other

markings are stenciled onto the boards.

The panels are then cut into individual boards and the edges are

smoothed.

)ountin# the components

/ndividual boards pass through several machines which place the

electronic components in their proper location in the circuit. /f surface

mount technology is going to be used to mount the components, the

boards $rst pass through an automatic solder paster, which places a

dab of solder paste at each component contact point. Fery small

components may be placed by a Kchip shooterK which rapidly places, or


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shoots, the components onto the board. 'arger components may be

robotically placed. &ome components may be too large or odd>sized forrobotic placement and must be manually placed and soldered later.

The components are then soldered to the circuits. Iith surface mount

technology, the soldering is done by passing the boards through

another reGow process, which causes the solder paste to melt and

make the connection.

The Gu0 residue from the solder is cleaned with water or solvents

depending on the type of solder used.

*ac+a#in#

?nless the printed circuit boards are going to be used immediately,

they are individually packaged in protective plastic bags for storage or

shipping.

(uality Control

Fisual and electrical inspections are made throughout the manufacturing

process to detect Gaws. &ome of these Gaws are generated by the

automated machines. %or e0ample, components are sometimes misplaced on

the board or shifted before $nal soldering. Dther Gaws are caused by the

application of too much solder paste, which can cause e0cess solder to Gow,

or bridge, across two ad-acent printed circuit paths. Heating the solder too

"uickly in the $nal reGow process can cause a KtombstoneK e#ect where one

end of a component lifts up o# the board and doesnLt make contact.

Completed boards are also tested for functional performance to ensure their

output is within the desired limits. &ome boards are sub-ected to


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environmental tests to determine their performance under e0tremes of heat,

humidity, vibration, and impact.

To0ic )aterials and

&afety Considerations

The solder used to make electrical connections on a PC@

contains %/)which is considered a to0ic material. The fumes from the

solder are considered a health hazard, and the soldering operations must be

carried out in a closed environment. The fumes must be given appropriatee0traction and cleaning before being discharged to the atmosphere.

)any electronic products containing PC@s are becoming obsolete

within of>the>art electronics. Dther electronics are disassembled and

the computer parts are salvaged for resale and reuse in other products.

/n many countries in Europe, legislation re"uires manufacturers to buy

back their used products and render them safe for the environment before

disposal. %or manufacturers of electronics, this means they must remove and

reclaim the to0ic solder from their PC@s. This is an e0pensive process and

has spurred research into the development of non>to0ic means of making

electrical connections. Dne promising approach involves the use of water>

soluble, electrically conductive molded plastics to replace the wires and

solder.

The %uture


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The miniaturization of electronic products continues to drive printed

circuit board manufacturing towards smaller and more densely packedboards with increased electronic capabilities. dvancements beyond the

boards described here include three>dimensional molded plastic boards and

the increased use of integrated circuit chips. These and other advancements

will keep the manufacture of printed circuit boards a dynamic $eld for many

years.

CHAPTER IIIPRESENTATION OF GATHERED DATA

3.1 M8,*8+ 9T*% S,/; F8'

=8


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F*-'% 3.1 M8,*8+ 9 T*% S,/; F8' shows our gathered data from 7>cycle time for each process. Iith this, we were able to detect the process

consuming much time, highlighted with red marks. F*-'% 3.1$ G'&7*0 A+;(*( shows the graph, which revealed the

source of bottleneck in the operation. s presented, T< and T9 e0ceeded the

design cycle time.

=


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3.2 M8+,7; O,&, T$%(

T$% 3.2&hows the breakdown of the weekly output data produced by the

company for the month of Dctober =8


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&%' +*,

TARGET

OUTPUT

+*,(=/

;

TARGET

OUTPUT

+*,(=>%

%

ACTUAL

OUTPUT

? LOSS COST

COMPUTATIO

NSP7&

#EEK 44 :A BAA B66 7.;9 6


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#EEK 5< :A BAA B;8 7.86 B8==8

#EEK 51 :A BAA B66 7.;9 6


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AVERAGE :A BAA BAB 9.9=

3.3 S'; 8@ M8+,7; O,&, D,

T$% 3.3&hows the overall detailed breakdown of summary of the

monthly output data produced by the company for the month of Dctober

=8


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SUPPORTING COMPUTATIONS

T2ET D?TP?T T2ET D?TP?T!dayO:6 ID2J/N &

:AO:6 "4

CT?' D?TP?T QCT?' D?TP?T!month==B65=A=95==BA5


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C(%(

C8'%

P'8$%

E%0,(

F*-'% 4.1 P'8$% T'%% S,'0,'% shows the reasons that caused why

e0isting core problem occurred and the e#ects it contributed to the whole

production line.

4.2 P'8$% T'%% A+;(*(

CAUSES

*oor ,ayout

'ayout of the company is very essential, with the set up of the

machines and the path needed in the transportation, and it can determine

the optimal productivity of a certain process. %rom the current layout, its

hard for the operator of the /CT &tation to get the circuit boards because

there is no conveyor belt on that production line to support the transferring

of the units on that station that is why he needs to travel "uite a distance

=;

Emerson Network Power is experiencing 4.08% opportunity loss in ICT Sttion

pro!ucing "C#-$00 circuit or!s &rom t'e mont' o& (ctoer )0*+ to ,nury

)0*4 mounting to *0*+$0 pesos.

'ow

Productivity

Dpportunity

'oss

&low

Production


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about 78>98 seconds -ust to reach the units and go back again to the station.

Dn the other hand, the arrangement of the testing machines is not in linewith each other so it takes time and too much motion for the operator to

handle the machines. These causes traSc and congestion to the production

line.

)anpower "e%ciency

/n production process, manpower is of very important because they are

the one in charge for operating the machines and keeping the production

process ongoing. Iith our gathered data, there is a target output of :,98A

pieces of circuit boards but the produced output was only :8=9 pieces. This

is 9.8A opportunity loss e0perienced by the company due particularly in

the /CT &tation which composed of T< and T9, each of which consists of 7

machines. Iith regards to the distribution of load, there is < sta# who

operates in the /CT &tation and < sta# only who operates to both T< and T9.

/f there will be an additional manpower that would operate T< and T9

separately, we can minimize the time it consumes thus, opportunity loss will

be minimize.

Out&!ate! *arts $ccessories for *ro!uction

The companys parts accessories though can be considered as enough

in number but still it cant fully support the production line due to its

functionality problem which une0pectedly takes place during the production

process causing delays on the production line resulting for its functional

ability to be not that consistent and accurate.

=A


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EFFECTS

'low *ro!uction

Problems in parts accessories can result to the speed loss causing

delays of transferring the items from one operation to another process. The

production will become ine#ective and will come up for not meeting their

"uota which may lead to opportunity loss.

,ow *ro!uctivity

/n the production process system of the company, distance travel done

by the operator is one of the ma-or impacts why delay on the production line

occurs. The transportation of the items consumes time leading to bottle neck

instances which in turn causes idle time for the ne0t operation. /n the case of

the /CT station, low productivity happens because of unnecessary motions,

manpower de$ciency due as well to the outdated parts accessories.

Opportunity ,oss

The company is facing a pro$t loss for not meeting the target output of

the production. They must be able to $nish the re"uired number of circuit

boards because their ma-or products rely on such components, so for them

to sustain the needs of such products they should meet the "uota and once

the "uota is not met, the company will have to e0tend the working hours

producing additional e0penses to the manpower, machines and other

operational e0penses.

=:


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4.3 O$%0,*% T'%%

MEANS

OBJECTIVE

ENDS

F*-'% 4.3 shows the means to accomplish the ob-ective and the end of

each mean.

4.4 O$%0,*% T'%% A+;(*(

MEANS

$rran#e ,ayout E-ectively an! Eciently

rranging the production layout and the facilities design, placing them

on proper location, the production line will Gow e#ectively and eSciently. /t

will bene$t and provide ade"uate system that will allow more e#ective and

eScient workers. The machines should be in line ne0t to each other and near

to the ne0t process of operation to minimize the travel time it takes.

78

/nstall @elt

Conveyor

&ustain

Enough

)anpower

rrange

'ayout

E#ectively *

To minimi/e 4.08% opportunity loss in t'e ICT sttion o& t'e

pro!uction process.

%ast

Production

High

Productivity

Pro$t

Dpportunity


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'ustain Enou#h )anpower

)anpower is a key essential part of the manufacturing process. They

are the one who make the ob-ective of the company to met. )anpower

should be sustained enough and directly distributed as well as e"ually

balanced to the need of the production. &ince there is a bottleneck that is

e0periencing in the /CT &tation, the researcher is looking forward to the

development of the distribution of manpower the process is needed.

.

Install Conveyor /elt

/nstalling conveyor belt in the /CT &tation will result to smooth Gow of

operation which may take place. /t will also lessen the handling of the items

which are unnecessary and will minimize the causes of opportunity loss. lso

the conveyor belt is the cheapest and more productive type of conveyor that

is appropriate in the production environment. Iith the use of conveyor belt,

the items will smoothly run throughout the whole production phase

especially in the /CT &tation where the items are sought to be in critical

receiving of items.

E0"'

$!!itional *ro%t Opportunity

Ihen the improvement done in the /CT &tation of the company, the

operators can now ma0imize their -ob and save time and energy that can do

their -ob more e#ectively. /t will eliminate delay which can be happened to

7


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the production line of the company. Iith this improvement, it will increase

their productivity that can now meet the "uota.

i#h *ro!uctivity

s the improvement of the Gow pattern is being implemented, the

production will become e#ective and productive to the e0tent that the Gow of

the production is e0pected to be smooth Gowing. The operators can

ma0imize their time, and energy e#ectively. There is no reason for delays,and traSc -ams. The process will Gow e#ective and furthermore the

production will meet its "uota. The machine will run only when needed and

the whole production will move e#ectively.

ain *ro%t

chieving these goals and ob-ectives, the company can reduce the

opportunity loss and in return, the pro$t will e"ualize with the production

output of the company thus, it is gaining.

CHAPTER V

ALTERNATIVE COURSES OF ACTION

7=


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5.1 ACA1 ARRANGE LAYOUT

The proposed layout of the researchers is to arrange the production

line into single Gow formation. The machines for the station of /CT &tation >

T< and T9 are aligned in single row for better access of the operators. The

&ony @ond and Coating stations are combined into one line as well as the

%F/, %CC, (, 'abelling and Packing. Iith this arrangement the Gow of

production will be smooth and fast.

T$% 5.1shows the advantages and disadvantages of rearranging

the layout

COST COMPUTATION OF:

I+(,,*8+ 8@ V%+,*,*8+ T$% F+

CD&T manpower+labor!hour O 2ate!Hour ONo of workers

CD&T 788 O A O 9

CD&T :,688.88 Php

77

A/+,-%( D*(/+,-%(

&mooth Gow of production dditional cost

Eliminate traSc

Eliminate un$nished works

%ast and e#ective

production


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Price @ased on Payroll DSce and H2 oSce

V%+,*,*8+ T$% F+

CD&T ?nit Price O Piece

CD&T RB8O9BO=

CD&T 9,B88.88Php

Price @ased on http1!!www.alibaba.com!product>gs!


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T$% 5.2shows the advantages and disadvantages of adding man power

to the production line

COST COMPUTATION

#-% C8&,,*8+

C(ST 2 No. mnpower 7 te 7 9ysC(ST 2 :*7+60;7$COST = 2,100 Php / Salary per week

Price


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TOTAL = 2,340.00Php

While in Overtie!

C(ST 2 (T te per =our 7 sic slry rte 7 no. o& mn powerC(ST 2 6 7 +60 7 )*COST = 41",#$0.00Php per h%&r

Price


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9imension *6.$@ ?i!t'PriceA 600 P'p

C(ST2 Price 7 PieceC(ST2 600 7 4T(T"A 30,000.00PhpPrice incline>conveyors.php

T$% 5.3 shows the advantages and disadvantages of replacing parts

accessories for production

A*+ATA- *SA*+ATA-

>st n! Smoot' >low o& Process

Smll or !elicte prt 'n!ling

Ses time

"ess error

!!itionl Cost

7;


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T'oroug' inspection o& pro!ucts

T8, C8(, 8@ ACA3

Total 'C monitors 5 conveyor belt 5 @arcode scanner

Total 78,888 5 ;;,988 5 ;,B88

Total 114)"st n! e&&ectiepro!uction

7A


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ACA73!Instll Coneyor 688 circuit boards from the month of

Dctober =8


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delays caused by the malfunction of those parts can be eliminated by

replacing them with new ones. Though it involves money matters but still, in

return of their investments, it will greatly bene$t the company. %rom these

three alternative courses of action, it can help to resolve the problem of

opportunity loss.

REFERENCES

@raithwaite, Nicholas and raham Ieaver, eds. Electronic

Materials. @utterworths,


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&ris &a$ette

THESIS - Emerson Network Power (3).docx

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