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www.micross.com
The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions
• Largest global Die Distributor
• Die Express Quick Turn Service
• Turnkey Wafer Processing
• Vendor Managed Inventory (VMI)
• Next-Gen Wafer-Level Packaging
• 2.5/3D Heterogeneous Integration
• Flip Chip / MCM
• Original Qualified Product • Form-Fit-Function Recreation • Program Sustainment Management
• Hermetic, Plastic (CSP/BGA/QFN)
• QML Level Packaging
• Multi-chip SiP
• Precision Die Attach
• Optoelectronic Assembly
• Marking Labelig / Kitting
• PCB Assembly
• Robotic Hot Solder Dip
• BGA Reballing
• Lead Attach / Trim & Form
• Component Harvesting
• IC Programming
• Device Characterization: FPGA, ASIC, RF Test
• PEMs / COTS Upscreening & Qualification
• Adv. Chamberless Burn-in / HTOL / LTOL
• Counterfeit Detection & Test Services
Micross can tailor any facet of the sustainment process to fit customer’s unique requirements or entire program management for broader lifecycle management solutions.
• SMD/5962
• Hi-Rel Memory, Analog & Power
• COTS / Retail+
Bare Die & Wafer Processing
One Source Sustainment Solutions - keeping mission-critical systems & platforms operational
Advanced Interconnect
Packaging & Assembly
Component Modification
Advanced Electrical & Environmental Testing
Hi-Rel Products
Apopka, FloridaWafer Processing, QML Level Packaging, Assembly, Test, Products, and Die Sales
Los Alamitos, California Wafer Processing & test, Die Distribution & Sales
Woburn, Massachusetts Die Distribution & Sales, Passive Components, Same-day Service, & VMI
Portchester, United Kingdom MCM / Hybrid Packaging & Assembly, Test, and Hi-Rel products
Manchester, New HampshireRobotic Hot Solder Dip (RHSD, & Lead Attach / Trim & Form
Milpitas, CaliforniaElectrical and Reliability Test, PEMs Upscreening, & Qualification
Round Rock, TexasBGA Reballing, Components Harvesting & Reconditioning, and Solderability
Raleigh, North CarolinaWafer Level Packaging (WLP), & 3D Heterogeneous Integration
Clearwater, FloridaCounterfeit Detection testing, Upscreening, and IC Programming
Norwich, United KingdomWafer Processing, QML Level Packaging, Assembly, Test, Products, and Die Sales
Crewe, United KingdomRobotic Hot Solder Dip (RHSD), TCE, BGA Reballing, CGA, and Plating
Die, Wafer & Hi-Rel Components
Advanced Microelectronic Solutions
Component Modification Services
Corporate Headquarters
Melville, New YorkMicross Holdings Inc. HQ
Facilities & Locations
Engineering, Applications Support & program Management
Micross Heritage
Micross’ next-gen facilities provide over 400,000 sq. ft. of manufacturing and processing capacity across nine AS9100 & ISO9001 certified facilities worldwide, driven by industry-leading proprietary processes & technical innovation.
Micross’ highly experienced global field sales team, and expert engineering team provide complete application support from program specification to post production sustainment & program management.
Contact us to see how we could help you with your specific requirement www.micross.com/support
With over 40+ years experience, Micross has strengthened its’ capabilities to offer the broadest microelectronic solutions available from One Source.