SMART STEEL PRINTED ELECTRONIC DEVICES ON METAL Dr. GUAINO Philippe Senior Project Leader – Specialist
SMART STEEL
PRINTED ELECTRONIC DEVICES ON METAL
Dr. GUAINO PhilippeSenior Project Leader – Specialist
- CRM group presentation
- Printed electronic on steel
- Tools and equipement facilities
- Next generation of steel -> smartsteel
CRM Group
CRM Group is a research centre in metallurgy founded in 1948
Global budget (2013) >30 Mio €
CRM Group integrates the talents and the assets of 230 researchers,PHD’s,
technicians & employees
Enhanced capability to compete through innovation in the world economy
CRM Group – Locations
Gent4
Sart-Tilman
Sart-Tilman
Sart-Tilman
Ivoz-Ramet
Gent Liège
EcoTechnoPôle
5 Operational units
OPERATIONAL ORGANISATION CRM Group
16 Technical activities
Metal Production & Recycling
• Raw material processing• Melting & Refining• Recycling & Valorisation
Metal Processing
• Casting, solidification• Process technology• Product metallurgy
Metal Surface & Coatings
• Metallic Coating• Organic Coating• Surface functionalisation
Metal Applications & Construction solutions
• Building & Structure• Civil engineering• Metal Working & Assembly• Solutions & In use properties
Industrial solutions
• Engineering & Thermal technologies• Pilot facilities & Technologies for CCL• Industrial process control &
measurement
CRM Group CRM Group’s Key R&D Pilot Facilities
Continuous hot rolling lineOrganic coating line
Industrial Members
Printed electronic on metal benefit
Markets & applications
-> Automotive
-> Building & construction
-> Aeronautics (anti-icing)
-> General lighting
-> Public lighting and signage
-> Flexible lighting
Metal Glass Plastic
Flexibility/ formability ()
Moisture Barrier properties
Heat dissipation !
Robustness !
Extreme condition (heat
resistance, pressure, high
temperature …) !
()
Electrical conductivity
Scalable
Roll to roll
Recycling
8
Humidity / Gas / Organic compounds
Sensors
OLED – LED sourcesintegration
Lighting
RFID printedantennas
for Wireless communication
Steel Printed circuit board
(metal core PCB)
Heater foils
by printedresistor
Energy conversion by printed piezoelectric
thermoelectric
Energy harvesting
Applications with Printed electronics on metal ?
Coating / patterningby printing technologies in R2R
Active devices on metal foils for large/Medium surface
applications
Advanced metal foils
- printed circuit board
- Interconnection
Active layer stack
Encapsulation (and light extraction - OLED)
- Rigid/flexible/shapeable/Outcoupling
- CC and Viewing angle (OLED)
- protective functional top coat
(Transparent) top electrode
30 µm 100 nm
Anode and cathode sandwich separated by
a thin sensitive stack :
- 100 nm -> OLED / OPV
- 2 µm -> thin film (PV, heater )
- 30 µm -> DBD, interconnection …
Challenges
- Large surface area
- Rough surface
- Dust / contaminations
- Leakage current
- Interfaces permeability (Material diffusion)
- Process ntegration: R2R , Temperature
Cathode
Anode
Advanced metallic substrates(smooth dielectric, conductive electrode, large surface, Back/front side interconnection)
Rigid or flexible substrates stainless steel, thin plated steel, cupper foils…
Substrate cleaning combination of chemical, plasma and vacuum treatment
Dielectric film & Yield Leakage current and short, pinholes free, thermal
managment, working and process temperature
Planarization and optical mirror film reflectivity, cavity, defects free
Anode (or cathode) High conductive electrode
Patterning /Printable (ML) system design, layout => Electronic circuit
Interconnection (back <-> front ) Flexible PCB on steel
Mechanical alteration and failures Cracks, moduli ratio (soft/hard layer), optoelectronic
function alterity (lifetime)
requirements
Steel foils
Electrodes for devices
Back sides Connectors Protective layer
Interconnectiondielectric layer
dielectric and planarisarion layer
SURFACE COATING METHODS
(background for PE)
Low
pressure
Atmospheric
pressure
Plasma assisted
Dip/ spin coating
Bar / Roll coaters
Slot Die coaters
Spray
…
(PE)CVD
PVD
DBD IBAD Chemical
solution
Depostion
Electrochemical
depostion
Sol gel
Gaseous state Solution state Molten or semi molten
state
Laser
Thermal
spray
Lab scale to industrial line
(background for PE in R2R)
Industrial
line
Pilot
Line
Lab
Metals: Al, Mg, Cu, Ti, Zn, …
Inorg. Compounds: TiO2, ZnO, SnO2, TiN, CrN, Al203
Org. Compounds: SiOxCyHz, DLC/a-CHx,
Metal & oxide solvent solution: silver conductive ink
Hybrids: metal-inorganic, inorganic-organic, …
Printed electronic process on steel (lab scale) Screen printing Inkjet
Viscosity µ > 5 Pa.S (paste)
Resolution / Size feature
20 - 60 µm 40 – 100 µm
Jetlab II precision
200 X 200 mm²
µ < 0,05 Pa.S (water)
Semi automatic
CMS XANA 100/140
Flexography/gravure
> 60 µm
Test solution Coatema
(Flexo / Doctor blade / Slot die)
0,1< µ < 5 Pa.S (oil/ peint)
Modular vacuum pilot line for steel foils in ISO 7 clean room
250 mm width
t < 0.4 mm
L = 1000 m for 0.1 mm
Forward / Reverse mode
2 mm/min to 5 m/min
Managed with supervision system
Cleaning
Cooling
Heating - 25°C – 650°C
PECVD
3 Rotative
magnetrons Ion beam
preparationCooling
Stage
Cooling
Stage
Modular R2R wet pilot line for steel foils in ISO
7 clean room
Winding
• Guiding unwind-rewind
• 50 µm –0.4 mm : Tension 2500N
• Speed 0.5-20m/min
Heating - cooling
• Oven with own filtered air system
• Web Temperature 20 – 300°C
• 5 m length : 3 sections regulated
• Cooling top roll
3 rolls
Slot die
Drilling, Laser ablation & interconnection Laser source (within partnerships) :
Laser nano (𝝀 532nm) femtoseconde (fs) (𝝀 1030nm) 20W IR F-Thêta lens 100mm Scanner head 3D
Laser drilling => interconnection
« selective » laser ablation => Layer patterning
Ex: Al layer on advanced stainlesssteel
Cupper / Stainless
and low carbon steel
Drilling laser ablation
=> integration in R2R wet process
500 µm
300 µm
width
10 µm
width
Interconnection
Option for Dielectric based steel substrate at CRM
- Combination of multilayer system : inorganic thin film / organic coating
(Porosity (PVD) Vs Dielectric, current leakage )
- Dielectric formulation
Adherence/ T°C stability/ viscosity for process deposition…
Dielectric properties
r~ 2-4 r~ 3-5 r~ 10 – 100
VB ~5-30kV/mm - ~ 1014 - 1016 Ohm.cm
– Roughness coverage <>
process deposition
good good Medium
Mechanical constraint /
Moduli ratio (E1/E2)
E~ 2- 5 GPa E~ 2- 5 GPa E~60 – 400 Gpa
Cracks / alterity
Cost + +++ +
« Printable » Yes (easy) Yes (high viscosity) Yes (particles)
Epoxy based
T stability for working and process
Polyimide based
<350°C<170°C > 650°C
Ceramic based
Organic (particles)
Inorganic (PVD)
Al2O3, TiO2…
Understand the key parameter to enhanced life time of nanometric thin films on polymer
High elastic moduli mismatch (10 <E1/E2 <100)
strain and stress mechanical transfer between each layer
Visco-elasto-plastic effect
Competition between failure mode
Normal or/and
sliding contact
Polymer
PQ
Steel substrate
Contact mechanics approach
Failure can be induced during local solicitation?
Contact mode can induce: cracks, interface
weakness, debonding, matter removal,…
C.H. Sacre et al,
Bending3 - 4 points bending
Tensile stress
Functionnal integrity
- Dielectric alteration
- Electrode (conductivity) alteration
J.Lewis, Materials Today 6 (2006) 38
Bending solicitation
Cracks and debonding induced
Mechanical for electronic tools: integrity of devices properties
Delamination
Cracks
Adherence
…
2 μm polyimide
2 μm
4,5 μm polyimide
2 μm
9 μm polyimide
2 μm
Decreasing intensity of fragmentation at same load
Increasing thickness of polymer interlayer increases durability of ML systems
film
polymer
substrate
Example : Thicker polymer interlayer delays film fragmentation
0 20 40 60 80 100-2,5
-2,0
-1,5
-1,0
-0,5
0,0
9 µm
4,5 µm
Scratch depth during scratch [µm]
Scratch distance [µm]
scratch start
2 µm Thin soft layer
Matter confinement
High Pile-upHy
po
thes
is
Polymer
Strain field in the ML
(FEM - Abaqus)
C.H. Sacre et al,
20
Humidity / Gas / Organic compounds
Sensors
OLED – LED sourcesintegration
Lighting
RFID printedantennas
for Wireless communication
Steel Printed circuit board
Heater foils
by printedresistor
Energy conversion by printed piezoelectric
thermoelectric
Energy harvesting
Applications with Printed electronics on metal ?
Coating / patterningby printing technologies in R2R
Steel Printed circuit board
Use advanced steel substrate as a reliable flexible support for circuit board, especially in extreme environment (high pressure condition, heat dissipation … )
- Heat dissipation- flexible/rigid/Sheapable - Extreme environment (Pressure , temperature…) - Robust & Smart- SMD components integration- Steel as a support : Free surface available- Continus Process & Cost
Steel foils
Electrode for devices
Back sides Connectors Protective layer
Interconnectiondielectric layer
dielectric and planarisarion layer
LED steel foils and seel surface Lighting LED
Concept
- Lighting LED steel foils
- Light guiding
-> through screen printed light extraction dots surface
-> Advanced (roofing) steel -> as a SMD electronics components (LED,
sensors, resistors …)
-> Inkjet/screen printer -> circuit board integration on advanced steel. Surface Lighting
Light extractions through light
diffusing dots
Edge lighting
Circuit board steel bend and
formed - Roofing steel
Printed heater foils
Printed resistors
Printed DBD devices(Dielectric Barrier Discharge)
Plasma Conductive
tracksProtective film
steel foils
Dielectric (ceramic based)
Paschen’s law
Steel foils
Protective layer
Dielectric layer (high T)
resistors
~ 270°C
10x10cm²
heater foil
T°C mapping
(IR camera)
of working heater foil10x10cm²
Printed DBD foil
Working
BDB discharge
(400V@300mBar)
OLED on steel : Global Context
Lighting Display Signage
Kido
Osram
Samsung Galaxy
Curved screen
Automotive
Blackbody
New Samsung OLED TV
OLED applications
p- HTL n-ETLEMLEBL HBLAnode Cathode
é
O
é éé
h
OO
O
é
O
e >>
e <<
EF
EF
OLED device operation on metal foils
- Advanced metal foils
- p-i-n OLED
- EML phosphorescent doped layer
- PLED (PEDOT:PSS)
- Hybrid : Polymer/small molecules
-Transparent & conductive top electrode
- Outcoupling and rigid/flexible encapsulation
Metal foils
Emissive layer
Transparent top ‘cathode’
HBL
EBL
P doped HTL
n doped ETL
Capping layer
Encapsulation
h
- Inverted / non inverted devices
- Monochromatic and white colors
0 nm
400 nm
0 nm
50 nm
Ra 110 nm
Z range: 1645 nm
Ra 3.3 nm
Z range: 25 nm
Bared foil
Advanced
steel
substrates
0
20
40
60
80
100
120
0 500 1000 1500 2000 2500Longueur d'ondes (nm)
Refl
ecti
vit
y (
%)
Rt
Rd
Rs
Rt > 95% in visible range
150mm
M.I.M. junction
Electrical short free
µA (dc)@10VoltsLeakage Current
Example of advanced metallic substrates with stainless steel
60 x 60 cm ² panel
First Prototype large area lighting sources on
stainless steel – Achievements 2011
2006
proof of
principle
From
monochromatic
to white OLED
2011
3.5V; 16Cd/A
3.5V; 73Cd/A
>25 Cd/A / 22-26 Lm/W
Sheapable OLED on Cupper and stainless steel
Pole Mecatech project (wallonia region): 2013 -2016
With : AGC, CE+T , CSL , CRM Group, CE+T, LASEA, MateriaNova, TAIPRO, UCL,UNAMUR, SOLVAY
Concept
- Curved p-i-n OLED devices on cupper foil.
- Circuit board integration on advanced steel.
- Light extraction Improvement: encapsulation covers and substrate texturation.
Curved devices assembly
OLED on Cu foils OLED on SS
Substrate texturation
Low cost Efficient Oleds for lighting
H2020 – ICT 29 (2015 – 2018)
Context : Develop a low cost & efficient OLED on low carbon steel foil (highly challenging)
GOALS OF LEO PROJECTLarge area devices
(new SoA)
&
Large Demonstrators
SoA
LEO
Structure A:
Structure WA:
Structure WAW:
Enhanced light
extraction cathode
&
Photo-patternable
sol-gel hard-coat
Cheaper, greener and
more efficient OLED
Dry Technology
Integrated back side
OLED connections
on LCS substrate
Integration of
Cu-based EmitterNumerous news
technological
components
Surface LCS preparation
(Polyimide – epoxy)
&
PVD anode integration
Wet anode integration
on LCS substrate
Dry/Wet hybrid Technology
Advanced metallic substrates with low carbon steel
Rms (sq)= 0.39 nm
Epoxy /LCS
Rms (sq)= 0.33 nm
Polyimide /LCS
I leakage < 50 pA /cm²
Dielectric coating solution
Anode (PVD – bilayer ) solution
SEM
Up to
Yield
Of
100 %
Steel (140 µm)
Anode (bilayer)
Dielectric
Current
(mA)
(Ohm/sq)
Anode on glass 10 4.76 10-1
Anode on Diel/LCS 10 4.74 10-1
Substrate : Low Carbon steel / epoxy with PVD Ag anodes
glass
LCS
Same operating voltage
But still High leakage current
And pinholes
Curr
ent
den
sity
(m
A/c
m2)
Voltage (V)
STATUS ON THE TECHNOLOGICAL BUILDING BLOCKS
glass
LCS
CNR-ISMN
Polymide
based
dielectric
Epoxy
based
dielectric
Dry process Dry & wet process Large OLED lighting
on steel has started
But life time is still an issue
From dry to Vacuum/wet hybrid technoSize
(First proof of concept in bottom
emitting OLEDs at lab scale).Green OLED: 38 Cd/A@ 2000 Cd/m²
180 mm
Front Back
Example of layout Interconnection layout
Back side interconnection with printing circuit board on low carbon steel
Front side Back side
Devices Interconnected devices substrate
Partners
DEM 1’white RGB, dry, >500cm² plain
rectangular
TRL5
DEM 2’’full colours RGB, hybrid, 25cm²,
macropixel
TRL5
DEM 1white RGB, dry, 25cm²
DEM 2full colours RGB, hybrid, 1*1cm²
DEM 1’’warm / cold white, dry, >500cm²,
macropixel
TRL 5
M21
M30
M36
M24
20cm10cm0 20cm10cm0
DEM 2’White RGB, hybrid, >40cm²
Dry – tandem Hybrid – single
R&D line
Pilot line
DEM 1’white RGB, dry, >500cm² plain
rectangular
TRL5
DEM 2’’full colours RGB, hybrid, 25cm²,
macropixel
TRL5
DEM 1white RGB, dry, 25cm²
DEM 2full colours RGB, hybrid, 1*1cm²
DEM 1’’warm / cold white, dry, >500cm²,
macropixel
TRL 5
M21
M30
M36
M24
20cm10cm0 20cm10cm0
DEM 2’White RGB, hybrid, >40cm²
Dry – tandem Hybrid – single
R&D line
Pilot line
Conformable substrate
with advanced anode and back-
side integrated connecting
Rare Earth free RGB
materials for hybrid
processing
Indium free transparent cathode
Hard thin film encapsulation
Top emitted tailored outcoupling
Top emission tandem stacks on metal foil
White & Full colours OLEDs
Bu
ild
ing
blo
ck
s
Homogeneous large-area lighting panel on metal foil
& 2-Colour Large Area Lighting panel on metal foil
Lower cost top emission on metal foils
Full colours OLEDs
DEM 1’
(TRL 5) Beyond LEO
Reduced cost at
OLED system level
Hybrid
ProcessingDry
Processing
De
vic
e
inte
gra
tio
n
Sys
tem
de
mo
ns
tra
tio
n
Scaling-up
Lif
e C
ycl
e A
nal
ysi
s
DEM 1 DEM 2
DEM 1’’
(TRL 5)
High efficiency &
improved lifetime
High Energy Efficacy
High materials utilization
Large area processing
Reduced CAPEX
End-users
DEM 2’’
(Feasibility, TRL 5)
DEM2’
Conformable substrate
with advanced anode and back-
side integrated connecting
Rare Earth free RGB
materials for hybrid
processing
Indium free transparent cathode
Hard thin film encapsulation
Top emitted tailored outcoupling
Top emission tandem stacks on metal foil
White & Full colours OLEDs
Bu
ild
ing
blo
ck
s
Homogeneous large-area lighting panel on metal foil
& 2-Colour Large Area Lighting panel on metal foil
Lower cost top emission on metal foils
Full colours OLEDs
DEM 1’
(TRL 5) Beyond LEO
Reduced cost at
OLED system level
Hybrid
ProcessingDry
Processing
De
vic
e
inte
gra
tio
n
Sys
te
m
de
mo
ns
tra
tio
n
Scaling-up
Lif
e C
yc
le A
na
lys
is
DEM 1 DEM 2
DEM 1’’
(TRL 5)
High efficiency &
improved lifetime
High Energy Efficacy
High materials utilization
Large area processing
Reduced CAPEX
End-users
DEM 2’’
(Feasibility, TRL 5)
DEM2’
Conformable substrate
with advanced anode and back-
side integrated connecting
Rare Earth free RGB
materials for hybrid
processing
Indium free transparent cathode
Hard thin film encapsulation
Top emitted tailored outcoupling
Top emission tandem stacks on metal foil
White & Full colours OLEDs
Bu
ild
ing
blo
ck
s
Homogeneous large-area lighting panel on metal foil
& 2-Colour Large Area Lighting panel on metal foil
Lower cost top emission on metal foils
Full colours OLEDs
DEM 1’
(TRL 5) Beyond LEO
Reduced cost at
OLED system level
Hybrid
ProcessingDry
Processing
De
vic
e
inte
gra
tio
n
Sys
te
m
de
mo
ns
tra
tio
n
Scaling-up
Lif
e C
ycle
An
aly
sis
DEM 1 DEM 2
DEM 1’’
(TRL 5)
High efficiency &
improved lifetime
High Energy Efficacy
High materials utilization
Large area processing
Reduced CAPEX
End-users
DEM 2’’
(Feasibility, TRL 5)
DEM2’
THANK YOU FOR YOUR ATTENTION