Simulations of ‘Bottom-up’ Fill Simulations of ‘Bottom-up’ Fill in Via Plating of Semiconductor in Via Plating of Semiconductor Interconnects Interconnects Uziel Landau Uziel Landau 1 , Rohan Akolkar , Rohan Akolkar 1 , , Eugene Malyshev Eugene Malyshev 2 , and Sergey , and Sergey Chivilikhin Chivilikhin 2 1 Department of Chemical Engineering Case Western Reserve University Cleveland, OH 44106 and 2 L-Chem, Inc Beachwood, OH 44122
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Simulations of ‘Bottom-up’ Fill in Via Plating of Semiconductor Interconnects Uziel Landau 1, Rohan Akolkar 1, Eugene Malyshev 2, and Sergey Chivilikhin.
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Simulations of ‘Bottom-up’ Fill in Simulations of ‘Bottom-up’ Fill in Via Plating of Semiconductor Via Plating of Semiconductor
InterconnectsInterconnectsUziel LandauUziel Landau11, Rohan Akolkar, Rohan Akolkar11, , Eugene MalyshevEugene Malyshev22, and Sergey , and Sergey
ChivilikhinChivilikhin22
1Department of Chemical EngineeringCase Western Reserve University
Cleveland, OH 44106 and
2L-Chem, IncBeachwood, OH 44122
OutlineOutline• Significance and ObjectivesSignificance and Objectives• Parameters Controlling the Bottom-Parameters Controlling the Bottom-Up FillUp Fill• Simulation MethodSimulation Method• Sample SimulationsSample Simulations• ConclusionsConclusions
Prior WorkPrior Work•Andricacos, Uzoh, Dukovic, Horkans and Deligianni, IBM J. R&D 1998:
Simulation is based on, and implements Simulation is based on, and implements ‘variable‘ kinetics = f(time, position)‘variable‘ kinetics = f(time, position)
A commercial CAD program that accomodates A commercial CAD program that accomodates moving boundaries and variable kinetics was moving boundaries and variable kinetics was usedused
Different process parameters have been Different process parameters have been explored: explored:
Transport and adsorption kinetics of inhibiting Transport and adsorption kinetics of inhibiting and depolarizing additives must match processand depolarizing additives must match process
Operating conditions (i, V) must be within Operating conditions (i, V) must be within
rangerange
AcknowledgementAcknowledgementss
• Yezdi Dordi – Yezdi Dordi – Applied materialsApplied materials• Peter Hey – Peter Hey – Applied MaterialsApplied Materials• Andrew Lipin – Andrew Lipin – L-ChemL-Chem