August 2008 Rev 2 1/18 18 PD85004 RF power transistor the LdmoST plastic family Features ■ Excellent thermal stability ■ Common source configuration ■ Broadband performances P OUT = 4 W with 17 dB gain @ 870 MHz ■ Plastic package ■ ESD protection ■ Supplied in tape and reel ■ In compliance with the 2002/95/EC european directive Description The PD85004 is a common source N-channel, enhancement-mode lateral field-effect RF power transistor. It is designed for high gain, broad band commercial and industrial applications. It operates at 13.6 V in common source mode at frequencies of up to 1 GHz. PD85004’s superior gain and efficiency makes it an ideal solution for mobile radio. Figure 1. Pin connection SOT-89 Source Gate Source Drain Table 1. Device summary Order code Marking Package Packaging PD85004 8504 SOT-89 Tape and reel www.st.com
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RF power transistor the LdmoST plastic family · August 2008 Rev 2 1/18 18 PD85004 RF power transistor the LdmoST plastic family Features Excellent thermal stability Common source
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August 2008 Rev 2 1/18
18
PD85004RF power transistor
the LdmoST plastic family
Features■ Excellent thermal stability
■ Common source configuration
■ Broadband performances POUT = 4 W with 17 dB gain @ 870 MHz
■ Plastic package
■ ESD protection
■ Supplied in tape and reel
■ In compliance with the 2002/95/EC european directive
DescriptionThe PD85004 is a common source N-channel, enhancement-mode lateral field-effect RF power transistor. It is designed for high gain, broad band commercial and industrial applications. It operates at 13.6 V in common source mode at frequencies of up to 1 GHz.
PD85004’s superior gain and efficiency makes it an ideal solution for mobile radio.
RF in, RF out SMA-CONN 50 Ω 60 mils JOHNSON 142-0701-801
PD85004 LDMOS STMicroelectronics PD85004
Board FR-4 THk = 0.020" 2 OZ Cu both sides
PD85004 Demonstration board photo
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7 Demonstration board photo
Figure 14. Demonstration board photo
Package mechanical data PD85004
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8 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
PD85004 Package mechanical data
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Figure 15. Package dimensions
Table 10. SOT-89 mechanical data
Dim. mm. Inch
Min Typ Max Min Typ Max
A 1.4 1.6 55.1 63.0
B 0.44 0.56 17.3 22.0
B1 0.36 0.48 14.2 18.9
C 0.35 0.44 13.8 17.3
C1 0.35 0.44 13.8 17.3
D 4.4 4.6 173.2 181.1
D1 1.62 1.83 63.8 72.0
E 2.29 2.6 90.2 102.4
e 1.42 1.57 55.9 61.8
e1 2.92 3.07 115.0 120.9
H 3.94 4.25 155.1 167.3
L 0.89 1.2 35.0 47.2
Package mechanical data PD85004
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8.1 Thermal pad and via designThernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device.
The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
Figure 16. Pad layout details
PD85004 Package mechanical data
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8.2 Soldering profileFigure 17 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used.
Figure 17. Recommended solder profile
Figure 18 shows the recommeded solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder.
Figure 18. Recommended solder profile for leaded devices
Package mechanical data PD85004
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Figure 19. Reel information
PD85004 Revision history
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9 Revision history
Table 11. Document revision history
Date Revision Changes
05-Dec-2007 1 Initial release.
22-Aug-2008 2 Updated marking in Table 1 on page 1
PD85004
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