RF LDMOS Wideband Integrated Power Amplifier The AFIC901N is a 2--stage, high gain amplifier designed to provide a high level of flexibility to the amplifier designer. The device is unmatched even at the interstage, allowing performance to be optimized for any frequency in the 1.8 to 1000 MHz range. The high gain, ruggedness and wideband performance of this device make it ideal for use as a pre--driver and driver in a wide range of industrial, medical and communications applications. Typical Narrowband Performance (7.5 Vdc, T A = 25C, CW) Frequency (MHz) G ps (dB) D (%) P out (dBm) 520 (1) 32.2 73.0 31.2 Typical Wideband Performance (7.5 Vdc, T A = 25C, CW) Frequency (MHz) P in (dBm) G ps (dB) D (%) P out (dBm) 136–174 (2,5) 0 30.6 62.1 30.6 350–520 (3,5) 3 27.4 61.5 30.4 760–870 (4,5) 3 27.6 57.0 30.6 Load Mismatch/Ruggedness Frequency (MHz) Signal Type VSWR Pin (W) Test Voltage Result 175 (2) CW > 25:1 at all Phase Angles 3 dB Overdrive from rated power 9 No Device Degradation 520 (3) 1. Measured in 520 MHz narrowband test circuit. 2. Measured in 136–174 MHz VHF broadband reference circuit. 3. Measured in 350–520 MHz UHF broadband reference circuit. 4. Measured in 760–870 MHz broadband reference circuit. 5. The values shown are the center band performance numbers across the indicated frequency range. Features Characterized for Operation from 1.8 to 1000 MHz Unmatched Input, Interstage and Output Allowing Wide Frequency Range Utilization Integrated ESD Protection Same PCB Layout Can be Used for 136--174 MHz, 350--520 MHz and 760–870 MHz Designs. 24--pin, 4 mm QFN Plastic Package Typical Applications Driver for Mobile Radio Power Amplifiers Output Stage for Low Power Handheld Radios Driver for Communications and Industrial Systems Document Number: AFIC901N Rev. 0, 1/2016 Freescale Semiconductor Technical Data 1.8–1000 MHz, 30 dBm, 7.5 V AIRFAST RF LDMOS WIDEBAND INTEGRATED POWER AMPLIFIER AFIC901N QFN 4 4 Figure 1. Pin Connections Note: Exposed backside of the package is the source terminal for the transistors. RF in RF out External Interstage Match Figure 2. Typical Application GND GND 24 23 1 2 3 4 5 6 N.C. N.C. N.C. N.C. N.C. N.C. GND N.C. Drain B GND N.C. Gate B Gate A N.C. N.C. Drain A Drain B Drain B Gate B Gate B 22 21 20 19 7 8 9 10 11 12 18 17 16 15 14 13 Gate A Drain A Stage 1 Stage 2 Stage 2 Stage 1 Freescale Semiconductor, Inc., 2016. All rights reserved.
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AFIC901N
1RF Device DataFreescale Semiconductor, Inc.
RF LDMOS Wideband IntegratedPower AmplifierThe AFIC901N is a 2--stage, high gain amplifier designed to provide a high
level of flexibility to the amplifier designer. The device is unmatched even at theinterstage, allowing performance to be optimized for any frequency in the 1.8 to1000 MHz range. The high gain, ruggedness and wideband performance of thisdevice make it ideal for use as a pre--driver and driver in a wide range ofindustrial, medical and communications applications.
Typical Narrowband Performance (7.5 Vdc, TA = 25C, CW)
Frequency(MHz)
Gps(dB)
D(%)
Pout(dBm)
520 (1) 32.2 73.0 31.2
Typical Wideband Performance (7.5 Vdc, TA = 25C, CW)
Frequency(MHz)
Pin(dBm)
Gps(dB)
D(%)
Pout(dBm)
136–174 (2,5) 0 30.6 62.1 30.6
350–520 (3,5) 3 27.4 61.5 30.4
760–870 (4,5) 3 27.6 57.0 30.6
Load Mismatch/Ruggedness
Frequency(MHz) Signal Type VSWR
Pin(W)
TestVoltage Result
175 (2) CW > 25:1 at allPhase Angles
3 dBOverdrivefrom ratedpower
9 No DeviceDegradation
520 (3)
1. Measured in 520 MHz narrowband test circuit.2. Measured in 136–174 MHz VHF broadband reference circuit.3. Measured in 350–520 MHz UHF broadband reference circuit.4. Measured in 760–870 MHz broadband reference circuit.5. The values shown are the center band performance numbers across the indicated
frequency range.
Features
Characterized for Operation from 1.8 to 1000 MHz Unmatched Input, Interstage and Output Allowing Wide Frequency Range
Utilization Integrated ESD Protection Same PCB Layout Can be Used for 136--174 MHz, 350--520 MHz and
760–870 MHz Designs. 24--pin, 4 mm QFN Plastic Package
Typical Applications
Driver for Mobile Radio Power Amplifiers Output Stage for Low Power Handheld Radios Driver for Communications and Industrial Systems
Note: Exposed backside of the package is thesource terminal for the transistors.
RFin RFout
ExternalInterstage Match
Figure 2. Typical Application
GNDGND
24 23
1
2
3
4
5
6N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
GNDN.C.
Drain B
GND
N.C.
Gate B
GateA
N.C.
N.C.
DrainA
Drain B
Drain B
Gate BGate B
22 21 20 19
7 8 9 10 11 12
18
17
16
15
14
13
GateA
DrainA
Stage 1
Stage 2
Stage 2Stage 1
Freescale Semiconductor, Inc., 2016. All rights reserved.
2RF Device Data
Freescale Semiconductor, Inc.
AFIC901N
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain--Source Voltage VDSS –0.5, +30 Vdc
Gate--Source Voltage VGS –6.0, +12 Vdc
Storage Temperature Range Tstg –65 to +150 C
Case Operating Temperature Range TC –40 to +150 C
Operating Junction Temperature Range (1,2) TJ –40 to +150 C
Table 2. Thermal Characteristics
Characteristic Symbol Value (2,3) Unit
Thermal Resistance, Junction to CaseCase Temperature 78C, 30 dBm CW, 520 MHzStage 1, 7.5 Vdc, IDQ1 = 8 mAStage 2, 7.5 Vdc, IDQ2 = 24 mA
RJC
329.4
C/W
Table 3. ESD Protection Characteristics
Test Methodology Class
Human Body Model (per JESD22--A114) 1A, passes 250 V
Machine Model (per EIA/JESD22--A115) A
Charge Device Model (per JESD22--C101) II, passes 200 V
Table 4. Moisture Sensitivity Level
Test Methodology Rating Package Peak Temperature Unit
Per JESD22--A113, IPC/JEDEC J--STD--020 3 260 C
1. Continuous use at maximum temperature will affect MTTF.2. MTTF calculator available at http://www.nxp.com/RF/calculators.3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.nxp.com/RF and search for AN1955.
Zsource = Test circuit impedance as measured from gate to gate.
Zload = Test circuit impedance as measured from drain to drain.
Figure 16. Narrowband Series Equivalent Source and Load Impedance — 520 MHz
InputMatchingNetwork
Stage 1InterstageMatchingNetwork
Zsource1
5050
Stage 2OutputMatchingNetwork
Zload1 Zsource2 Zload2
AFIC901N
15RF Device DataFreescale Semiconductor, Inc.
2.6 2.6 solder pad with thermalvia structure. All dimensions in mm.
Figure 17. PCB Pad Layout for 24--Lead QFN 4 4
0.50
0.303.00 4.40
Figure 18. Product Marking
A901WLYW
16RF Device Data
Freescale Semiconductor, Inc.
AFIC901N
PACKAGE DIMENSIONS
AFIC901N
17RF Device DataFreescale Semiconductor, Inc.
18RF Device Data
Freescale Semiconductor, Inc.
AFIC901N
AFIC901N
19RF Device DataFreescale Semiconductor, Inc.
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Software
.s2p File
Electromigration MTTF Calculator
RF High Power Model
Development Tools
Printed Circuit Boards
To Download Resources Specific to a Given Part Number:
1. Go to http://www.nxp.com/RF
2. Search by part number
3. Click part number link
4. Choose the desired resource from the drop down menu
REVISION HISTORY
The following table summarizes revisions to this document.
Revision Date Description
0 Jan. 2016 Initial Release of Data Sheet
20RF Device Data
Freescale Semiconductor, Inc.
AFIC901N
Information in this document is provided solely to enable system and softwareimplementers to use Freescale products. There are no express or implied copyrightlicenses granted hereunder to design or fabricate any integrated circuits based on theinformation in this document.
Freescale reserves the right to make changes without further notice to any productsherein. Freescale makes no warranty, representation, or guarantee regarding thesuitability of its products for any particular purpose, nor does Freescale assume anyliability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation consequential or incidentaldamages. “Typical” parameters that may be provided in Freescale data sheets and/orspecifications can and do vary in different applications, and actual performance mayvary over time. All operating parameters, including “typicals,” must be validated foreach customer application by customer’s technical experts. Freescale does not conveyany license under its patent rights nor the rights of others. Freescale sells productspursuant to standard terms and conditions of sale, which can be found at the followingaddress: freescale.com/SalesTermsandConditions.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,Reg. U.S. Pat. & Tm. Off. Airfast is a trademark of Freescale Semiconductor, Inc. Allother product or service names are the property of their respective owners.E 2016 Freescale Semiconductor, Inc.