Resume_JonghoonJKim_2015_Final

JONGHOON J. KIM

Terahertz Interconnection and Package Lab.

373-1, Electrical Engineering KAIST

Daejeon, Republic of Korea (ZIP: 305-701)

Tel: +82-10-4664-2494

Fax: +82-42-879-9870

E-mail: [email protected]

RESEARCH EXPERIENCES Design of high-speed connectors and automotive connectors

Development of high-speed socket based on silicone rubber substrate

Design of rubber-based test interposer for LPDDR4 testing

Design of package-level and chip-level magnetically-coupled embedded current probing structures for simultaneous switching current measurement

Contactless wafer-level TSV connectivity testing method using magnetic

coupling

Details of above researches are described from page. 8

EDUCATION Korea Advanced Institute of Science and Technology (Daejeon, Korea)

Ph. D. in Electrical Engineering (Feb. 2013 ~ Present) - Research area

Design of embedded magnetically-coupled current probing structure on chip level

Design of rubber-based test interposer for LPDDR4

Development of high-speed socket based on silicone rubber substrate

Signal integrity and power integrity in hierarchical systems

- Dissertation topic Design and Verification of Magnetic Probing Structure and Rubber-based Test

Interposer for LPDDR4

- Advisor : Prof. Joungho Kim

M. S. in Electrical Engineering (Feb. 2011 ~ Feb. 2013) - Research area

Contactless wafer-level TSV connectivity testing method using magnetic coupling

Design of embedded magnetically-coupled current probing structure on package

level

- Dissertation topic Contactless Wafer-level TSV Connectivity Testing and Embedded Current

Measurement using Magnetic Coupling

- Advisor : Prof. Joungho Kim

B. S. in Electrical Engineering (Sept. 2006 ~ Feb. 2011) - Preferred area : Electromagnetics

RESEARCH PROJECTS Design of Test Methodologies for TSV-based 3D-IC (2011 ~ 2013)

- Sponsor : SK Hynix Semiconductor Inc., Korea

- Research on magnetic coupling mechanism

- Design of structure for contactless wafer-level TSV connectivity testing using magnetic

coupling

- Simulation and measurement in both frequency- and time-domains

Design of Short Circuit Current Sensor (2012 ~ 2013) - Sponsor : Korea Electric Terminal (KET), Korea

- Design of short circuit current sensor targeted for electric vehicles

- Simulation and measurement in time-domain

Design of High-Speed Connectors (2014 ~ Present) - Sponsor : Korea Electric Terminal (KET), Korea

- Design of high-speed connectors: HDMI, MHL, OCM, PCIe, TTA

- Design of paddle PCBs for high speed connectors

- Design of automotive connectors: FAKRA

- Simulation and measurement in frequency- and time-domains

Design of Rubber-Based Test Socket (2014 ~ Present) - Sponsor : Silicone Rubber Contactor (SRC), Korea

- Design of rubber-based test interposer for LPDDR4 testing

- Development of high-speed socket based on silicone rubber substrate

- Simulation and measurement in frequency- and time-domains

WORK EXPERIENCES Silicon image Inc. (Sunnyvale, CA, USA, Jan. 2014 ~ Present)

Consultant

- Characterization and analysis of high-speed connectors using EM simulators

- Measurement-based evaluation of high-speed connectors

Samsung Electronics (Suwon, Korea, Jan. 2013 ~ Present) Lecturer - Fundamental and Advanced Signal Integrity

Transmission line, reflection, impedance matching, crosstalk, inter-symbol

interference, return path, equalization technique

- Fundamental Power Integrity

Decoupling capacitor, mode resonance, reference change, power noise isolation

methods

TECHNICAL SKILL SET Design tools

- Virtuoso(Cadence) for IC-level

- PADS (Mentor) for Package- and PCB-levels

Simulation tools - HFSS, SIwave, Q3D (Ansys) and CST MWS (CST) for EM Simulator

- ADS (Agilent) for Circuit & RF simulators

Programming tools - MATLAB, Java, and C language for computation and programming

Equipment - Vector Network Analyzer, Microprobe, Spectrum Analyzer

- TDR/TDT, Oscilloscope, Signal & Pulse Pattern Generator

INVITED SEMINARS Seminar at Silicon Image Inc. (Sunnyvale, CA, USA, Oct. 26, 2012)

- Invited as a presenter - Title : Embedded Toroidal Magnetic Probe in Multi-Layer PCBs for Current Measurement

Seminar at Silicon Image Inc. (Sunnyvale, CA, USA, Oct. 30, 2014)

- Invited as a presenter

- Title : A Novel Testing Solution for LPDDR4: TERAPOSER Seminar at Intel Inc. (Folsom, CA, USA, Oct. 31, 2014)

- Invited as a presenter

- Title : A Novel Testing Solution for LPDDR4: TERAPOSER

AWARD 2012 IMAPS Best of Session (San Diego, USA, 2012)

Heegon Kim, Jun So Pak, Daniel H. Jung, Jonghoon J. Kim and Joungho Kim,

“Measurement-based Signal Quality Test and Analysis of High-speed TSV Channel,” IMAPS

2012, San Diego, USA, Sep. 2012

2014 EMC Tokyo Excellent Paper Award Winner (Tokyo, Japan, 2014) Sunkyu Kong, Jonghoon Kim, Bumhee Bae, Jonghoon J. Kim, Sukjin Kim and Joungho

Kim, “Electromagnetic Radiated Emissions from a Wireless Power Transfer System using a

Resonant Magnetic Field Coupling,” EMC Tokyo 2014, Tokyo, Japan, Dec. 2013

Samsung 1nside Edge Third Place (Seoul, Korea, 2014) Chiuk Song, Hongseok Kim, Daniel H. Jung, Jonghoon J. Kim, Sunkyu Kong, Jiseong Kim,

Jonghoon Kim and Joungho Kim, “Low EMI and High Efficiency Handheld Resonant

Magnetic Field Charger (HH-RMFC) for Electric Vehicle,” Samsung 1nside Edge, Seoul,

Korea, Nov. 2014

SELECTED PATENTS Jonghoon J. Kim and Joungho Kim, “Through Silicon Via Connectivitys Probing Element,

Test Device including the Same and Connectivity Test Method ” Korea, Registration date :

May. 2013

Jonghoon J. Kim, Changhyun Cho and Joungho Kim, “Embedded Toroidal Coil and Method

manufacturing thereof, and Multilayer Printed Circuit,” Korea, Registration date : Oct. 2013

Changhyun Cho, Jonghoon J. Kim and Joungho Kim, “Embedded Toroid and Method

Manufacturing thereof, and Stack Integral Circuit Device,” Korea, Application date : Dec.

2013

PUBLICATIONS <Journal>

1. Jonghoon J. Kim, Changhyun Cho, Hajin Sung, Bumhee Bae, Sukjin Kim, Sunkyu Kong,

Heegon Kim, Daniel Jung, Jiseong Kim, and Joungho Kim, “Chip Level Simultaneous

Switching Current Measurement in Power Distribution Network using Magnetically-Coupled

Embedded Current Probing Structure,” Components, Packaging and Manufacturing

Technology, IEEE Transactions on , vol.4, no.12, pp.1963,1972, Dec. 2014

2. Kyoungchoul Koo, Myunghoi Kim, Jonghoon J. Kim, Joungho Kim, and Jiseong Kim,

"Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal

Stacked 3-D-IC," Components, Packaging and Manufacturing Technology, IEEE

Transactions on , vol.3, no.3, pp.476,488, March 2013

3. Bumhee Bae, Jonghoon J. Kim, Sukjin Kim, Sunkyu Kong, and Joungho Kim, " Noise

Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power

Transfer System using Chip-PCB Co-modeling and Simulation," Electromagnetic

Compatibility, IEEE Transactions on, vol.PP, no.99, pp.1,10

4. Sukjin Kim, Daniel Jung, Jonghoon J. Kim, Bumhee Bae, Sunkyu Kong, Seungyoung Ahn,

Jonghoon Kim, and Joungho Kim, “High Efficiency PCB and Package Level Wireless Power

Transfer Interconnection Scheme using Magnetic Field Resonance Coupling,” Components,

Packaging and Manufacturing Technology, IEEE Transactions on, Accepted

5. Daniel H. Jung, Heegon Kim, Sukjin Kim, Jonghoon J. Kim, Bumhee Bae, Jonghoon Kim,

Jong-Min Yook, Jun-Chul Kim, and Joungho Kim, “30 Gbps High-Speed Characterization

and Channel Performance of Coaxial Through Silicon Via,” Microwave and Wireless

Components Letters, IEEE , vol.24, no.11, pp.814,816, Nov. 2014 6. Sunkyu Kong, Bumhee Bae, Daniel H. Jung, Jonghoon J. Kim, Sukjin Kim, Chiuk Song,

Jonghoon Kim, and Joungho Kim, “An Investigation of Electromagnetic Radiated Emission

and Interference from Multi-Coil Wireless Power Transfer Systems using Resonant Magnetic

Field Coupling,” Microwave Theory and Techniques, IEEE Transactions on , vol.63, no.3,

pp.833,846, March 2015

<Conference> 1. Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Changhyun Cho, Daniel H. Jung, Joungho Kim,

and Jun So Pak, "Contactless Wafer-Level TSV Connectivity Testing Method using Magnetic

Coupling," EDAPS, 2012 IEEE

2. Jonghoon J. Kim, Heegon Kim, Sunkyu Kong, Daniel H. Jung, Joungho Kim, and Jiseong

Kim, "Embedded Toroidal Magnetic Coupling Probe in Multi-layer PCBs for Current

Measurement," EPEPS, 2012 IEEE

3. Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong,

Junho Lee, Kunwoo Park, and Joungho Kim, ““Non-Contact Wafer-Level TSV Connectivity

Test Methodology using Magnetic Coupling,” 3DIC, 2013 IEEE

4. Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong,

Junho Lee, Kunwoo Park, and Joungho Kim “Design of Contactless Wafer-Level TSV

Connectivity Testing Structure using Capacitive Coupling,” EMC COMPO, 2013 IEEE

5. Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung,

and Joungho Kim, “Magnetically-Coupled Current Probing Structure Consisting of TSVs and

RDLs in 2.5D and 3D ICs,” 3DIC, 2014 IEEE

6. Sunkyu Kong, Jonghoon J. Kim, and Joungho Kim, "Resonance and EMI in Vertical Multi-

coupled Coils for Wireless Power Transfer (WPT) System," IMWS, 2012 IEEE

7. Sunkyu Kong, Jonghoon J. Kim, Laehyuk Park, Unkyoo Park, Jiseong Kim, and Joungho

Kim, "Near-Field Intensity Prediction Model at Maximum Transferred Power Frequency in

Mutual-coupled Rectangular Coils for WPT System," APEMC, 2012 IEEE

8. Sukjin Kim, Myunghoi Kim, Sunkyu Kong, Jonghoon J. Kim, and Joungho Kim, "On-chip

Magnetic Resonant Coupling with Multi-Stacked Inductive Coils for Chip-to-chip Wireless

Power Transfer (WPT)," EMCS, 2012 IEEE

9. Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Joungho Kim, and Jun So

Pak, "Measurement-based Signal Quality Test of High-speed TSV Channel," IMAPS, 2012

10. Daniel H. Jung, Joohee Kim, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Jun So Pak,

Jong-Min Yook, and Jun Chul Kim, “Frequency and Time Domain Measurement of

Through-Silicon Via (TSV) Failure,” EPEPS, 2012 IEEE

11. Changhyun Cho, Jonghyun Cho, Jonghoon J. Kim, Joungho Kim, and Jun So Pak, "Design

and implementation of magnetically coupled current probe for monitoring simultaneous

switching current in package," EPTC, 2012 IEEE

12. Changhyun Cho, Jonghoon J. Kim, Joungho Kim, and Jun So Pak, “Design and

Characterization of Magnetically Coupled On‐Chip Current Probe for Monitoring Switching

Current in Chip I/O PDN,” EDAPS, 2012 IEEE

13. Daniel H. Jung, Joohee Kim, Heegon Kim, Jonghoon J. Kim, Joungho Kim, and Jun So

Pak, "Disconnection Failure Model and Analysis of TSV-based 3D ICs," EDAPS, 2012 IEEE

14. Bumhee Bae, Jonghyun Cho, Sunkyu Kong, Jonghoon J. Kim, Yujeong Shim, and Joungho

Kim, “How to Improve Power Integrity on Analog-to-Digital Converter (ADC) with Chip-PCB

Hierarchical Structure,” DesignCon, 2013

15. Eunseok Song, Hongseok Kim, Jonghoon J. Kim, Jiseong Kim, and Joungho Kim,

“Measurement and analysis of Voltage Transfer Ratio (VTR) of package-level WPT

considering PDN conditions,” APEMC, 2013 IEEE

16. Sukjin Kim, Hongseok Kim, Jonghoon J. Kim, Bumhee Bae, Sunkyu Kong, and Joungho

Kim, "Electromagnetic interference shielding effects in wireless power transfer using

magnetic resonance coupling for board-to-board level interconnection," EMC, 2013 IEEE

17. Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Jong-Min Yook, Jun Chul Kim,

and Joungho Kim, “Fault Isolation in Through Silicon Via (TSV) Structure using Frequency

and Time-domain Measurement and Analysis,” APRASC, 2013

18. Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Hyun-

Cheol Bae, and Kwang-Seong Choi, and Joungho Kim, “Fault Isolation of Short Defect in

Through Silicon Via (TSV) based 3D-IC,” 3DIC, 2013 IEEE

19. Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Junho Lee,

Kunwoo Park, and Joungho Kim, “Eye-diagram Simulation and Analysis of a High-speed

TSV-based Channel,” 3DIC, 2013 IEEE

20. Sukjin Kim, Bumhee Bae, Sunkyu Kong, Daniel H. Jung, Jonghoon J. Kim, and Joungho

Kim, “Design, Implementation and Measurement of Board-to-Board Wireless Power Transfer

(WPT) for Low voltage Applications,” EPEPS, 2013 IEEE

21. Eunseok Song, Hongseok Kim, Chiuk Song, Jonghoon J. Kim, and Jungho Kim “Wireless

Power Distribution Network for 3D Package using Magnetic Field Resonance,” EDAPS, 2013

IEEE

22. Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, and Joungho Kim, “Magnetic

Field Coupling on Analog-to-Digital Converter from Wireless Power Transfer System in

Automotive Environment,” EMC COMPO, 2013 IEEE

23. Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Hyun-Cheol Bae, Kwang-seong Choi, and

Joungho Kim, “Modeling and Analysis of Open Defect in Through Silicon Via (TSV)

Channel,” EMC COMPO, 2013 IEEE

24. Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Junho Lee,

Kunwoo Park, and Joungho Kim, “Design and Measurement of a Compact On-interposer

Passive Equalizer for Chip-to-chip High-speed Differential Signaling,” EMC COMPO, 2013

IEEE

25. Sukjin Kim, Daniel H. Jung, Jonghoon J. Kim, Bumhee Bae, Sunkyu Kong, Chiuk Song,

and Joungho Kim, "Modeling of electromagnetic interference shielding materials in wireless

power transfer for board-to-board level interconnections," WPTC, 2014 IEEE

26. Sunkyu Kong, Bumhee Bae, Jonghoon J. Kim, Sukjin Kim, Daniel H. Jung, and Joungho

Kim, "Electromagnetic radiated emissions from a repeating-coil wireless power transfer

system using a resonant magnetic field coupling," WPTC, 2014 IEEE

27. Eunseok Song, Hongseok Kim, Jonghoon J. Kim, Chiuk Song, Hyunsuk Lee, and Joungho

Kim, "Reductions in power noise and system area burden using wireless power transfer

scheme in 3D package," WPTC, 2014 IEEE

28. Sunkyu Kong, Jonghoon Kim, Bumhee Bae, Jonghoon J. Kim, Sukjin Kim, and Joungho

Kim, “Electromagnetic Radiated Emissions from a Wireless Power Transfer System using a

Resonant Magnetic Field Coupling,” EMC TOKYO, 2014 IEEE

29. Hyunsuk Lee, Heegon Kim, Kiyeong Kim, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi,

Jaemin Lim, Hyungsoo Kim, Kunwoo Park, and Joungho Kim, “Electrical Characterization of

Bump-less High Speed Channel on Silicon, Organic and Glass Interposer,” EMC SI/PI, 2014

IEEE

30. Eunjung Lee, Manho Lee, Jonghoon J. Kim, Mijoo Kim, Jonghoon Kim, Jeoungkun Park,

Younghoon Joo, Yoonhee Bang, Il Kim, Seungki Nam, and Jongho Kim, “Ground Guard

Structure to Reduce the Crosstalk Noise and Electromagnetic Interference (EMI) in a Vertical

Probe Card for Wafer-level Testing,” EMC SI/PI, 2014 IEEE

31. Sukjin Kim, Yeonje Cho, Jonghoon J. Kim, Bumhee Bae, Sunkyu Kong, and Joungho Kim,

“Electroststic Discharge(ESD) Effects on Wireless Power Transfer using Magnetic

Resonance Coupling,” EMC SI/PI, 2014 IEEE

32. Eunjung Lee, Manho Lee, Jonghoon J.Kim, Mijoo Kim, Jonghoon Kim, Jeoungkeun Park,

Jonghyun Park, Yoonhee Bang, Il Kim and Joungho Kim, “High-speed Probe Card Design to

Reduce the Crosstalk Noise for Wafer-level Test,” EPEPS, 2014 IEEE

33. Sumin Choi, Heegon Kim, Kiyeong Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim,

Hyunsuk Lee, Hyungsoo Kim, Yongju Kim, Yunsaing Kim and Joungho Kim, “Crosstalk

Included Eye Diagram Estimation of High-speed and Wide I/O Interposer Channel for 2.5D /

3D IC”, EPEPS, 2014 IEEE

34. Jinwook Song, Sukjin Kim, Bumhee Bae, Hongseok Kim, Jonghoon J. Kim, Dong-Hyun Bill

Kim and Joungho Kim, “Analysis of Wireless Power Transfer System Design on Active

Silicon Interposer for Low Voltage Applications in 3D-IC,” EPEPS, 2014 IEEE

35. Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Hyun-Cheol Bae, Kwang-

Seong Choi, and Joungho Kim, “Fault Detection and Isolation of Multiple Defects in Through

Silicon Via (TSV) Channel,” 3DIC, 2014 IEEE

36. Jinwook Song, Sukjin Kim, Bumhee Bae, Jonghoon J. Kim, Daniel H. Jung, and Joungho

Kim, “Design and Analysis of Magnetically Coupled Coil Structures for PCB-to-Active

Interposer Wireless Power Transfer in 2.5D/3D-IC,” EDAPS, 2014 IEEE

37. Bumhee Bae, Jonghoon J. Kim, Sukjin Kim, Sunkyu Kong, and Joungho Kim,

“Electromagnetic Noise Effects on Semiconductor System in Electric Vehicle,” DesignCon,

2015

38. Heegon Kim, Kiyeong Kim, Jingook Kim, Changwook Yoon, Hyungsoo Kim, Jonghoon J. Kim, and Joungho Kim, “A Fast Statistical Eye-diagram Estimation Method for High-speed

Channel including Non-linear Receiver Circuit,” DesignCon, 2015

RESEARCH DESCRIPTION Design of high-speed connectors: MHL, OCM, HDMI, PCIe, TTA

- Connector 3D Modeling for EM simulation (shown in Fig. 1)

- Design of paddle and test jig PCBs (shown in Fig. 2)

- Development of design guide for connector plug and receptacle considering impedance

matching and crosstalk

- Simulation-based characterization for developed connectors simulators (shown in Fig. 3)

- Measurement-based characterization for developed connectors using TDR and VNA

(shown in Fig. 4)

Fig. 1. Structure of MHL connector for analysis and EM simulation

Fig. 2. Design of paddle and test PCBs; the paddle PCB is used to interconnect the connector to

cable with minimized impedance mismatching.

(a) (b)

Fig. 3. Simulation-based characterization for developed connectors using EM simulator for

evaluating (a) impedance and (b) far-end crosstalk (FEXT)

(a) (b)

Fig. 4. Measurement-based characterization for developed connectors with cables using (a) TDR for

evaluating impedance and (b) VNA for evaluating insertion loss

Design of automotive connectors: FAKRA

- Design of test jig PCBs (shown in Fig. 5)

- Measurement-based characterization for developed connectors using TDR and VNA

(shown in Fig. 6)

Fig. 5. Design of test jig PCB for FAKRA: 1) SMD type and 2) DIP type

(a) (b)

Fig. 6. Measurement-based characterization for FAKRA using (a) TDR for evaluating impedance and

0.00 1.00 2.00 3.00 4.00 5.00 6.00Freq [GHz]

1.00

1.50

2.00

2.50

3.00

3.50

4.00

4.50

5.00

Y1

KET-FAKRA_140127smd_49_50

m1m2

m3m4

Curve InfoVSWR(Port1)

Import3 : FAKRA_49_SMD_VSWRVSWR(Port1)_1

Import8 : FAKRA_49_cutPAD_SMD_VSWRVSWR(Port1)_2

Import9 : FAKRA_49_smPAD_SMD_VSWRVSWR(Port1)_3

Import4 : FAKRA_50_SMD_VSWRVSWR(Port1)_4

Import10 : FAKRA_50_cutPAD_SMD_VSWRVSWR(Port1)_5

Import11 : FAKRA_50_smPAD_SMD_VSWRVSWR(Port1)_6

Import17 : FAKRA_48_cutPAD_SMD_VSWRVSWR(Port1)_7

Import18 : FAKRA_51_cutPAD_SMD_VSWR

Name X Ym1 3.0000 1.1968m2 3.0000 1.2525m3 6.0000 1.8771m4 6.0000 1.9575

(b) VNA for evaluating VSWR

Development of high-speed socket based on silicone rubber substrate

- Modeling of the high-speed socket based on silicone rubber substrate (shown in Fig. 7)

- Experimental verification of the silicone rubber socket in time-domain (shown in Fig. 8)

Fig. 7. Structure and equivalent circuit model of silicone rubber socket, which includes metal

powders with silicone dielectric. The powders, when compressed, forms a vertical interconnection

(a) (b)

Fig. 8. Experimental verification of the rubber-based high-speed socket: (a) modeled eye diagram

using equivalent circuit model and (b) measured eye diagram at the data rate of 9.6 Gbps

Design of rubber-based test interposer for LPDDR4 testing

- Dissertation topic of Ph. D. degree

- Design of rubber-based test interposer for LPDDR4 testing (shown in Fig. 9)

- Development of design guide for test interposers considering stub effects, skew control,

crosstalk, impedance matching, ground via placement, and so forth.

- Eye-diagram simulation of the data to be observed at the receiver, as well as on the

probing pad of the test interposer using transient simulation (shown in Fig. 10)

(a) (b)

Fig. 9. (a) Top view and (b) bottom view of the proposed test interposer and manual socket

(a) (b)

Fig. 10. Simulated eye diagram of DQ at (a) receiver Rx (b) probing pad on the test interposer

Design of package-level and chip-level magnetically-coupled embedded current probing structures for simultaneous switching current measurement - Dissertation topic of M. S. degree and Ph. D. degree

- Design of package-level and chip-level magnetically-coupled embedded current probing

structures for simultaneous switching current measurement (shown in Fig. 11)

Accuracy : Being embedded on package and chip close to the actual PDN, its

accuracy on measuring simultaneous switching current can highly be improved

Tunability : Depending on which design criteria we want to focus on – either

bandwidth or sensitivity – we can simply change the dimensions of the proposed

current probing structures

- Experimental verification of the proposed structures on package-level and chip-level.

(shown in Fig. 12)

Fig. 11. Overview of proposed magnetically-coupled embedded current probing structure for

simultaneous switching current measurement

(a) (b)

Fig. 12. Experimental verification of the proposed structures on (a) package-level with comparison to

conventional active current probe, CT-6 and (b) chip-level with comparison to SPICE simulation

Contactless wafer-level TSV connectivity testing method using magnetic

coupling

- Dissertation topic of M. S. degree

- Design of structure for contactless wafer-level TSV connectivity testing (shown in Fig.

13)

The proposed method detects the change in the capacitance between adjacent

TSVs for disconnection detection without physical contact, and can avoid such

challenges as mechanical stress

Wafer-level structure is verified using EM simulation, as well as equivalent circuit

model of TSV and channels.

- Experimental verification of proposed contactless-level TSV connectivity testing method

by using test vehicle on PCB level (shown in Fig. 14)

Fig. 13. Overview of the proposed contactless wafer-level TSV connectivity testing method

Fig. 14. Experimental verification of proposed method using test vehicle on PCB level