Production technology Ch34

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Kalpakjian • SchmidManufacturing Engineering and Technology © 2001 Prentice-Hall Page 34-1

CHAPTER 34

Fabrication of Microelectronic Devices*

*By Kent M. Kalpakjian

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Printed Circuit Boards

Figure 34.1 A collection of  printed circuit boards. Source:Phoenix Technologies, Inc.

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FabricationSequence of

and Integrated

Circuit

Figure 34.2General fabricationsequence for integrated circuits.

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MOS Transistor Cross-Sections

Figure 34.3 Cross-sectional views of thefabrication of a MOStransistor. Source: R. C.Jaeger.

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Chemical Vapor Deposition

Figure 34.4 Schematic diagrams of (a) continuous, atmospheric-pressure CVD reactor and (b) low-pressureCVD. Source: S. M. Sze.

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Silicon Dioxide Growth

Figure 34.5 Growth of 

silicon dioxide, showingconsumption of silicon.Source: S. M. Sze.

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Pattern Transfer by Lithography

Figure 34.6 Pattern transfer by lithography. Note that the mask in step three can be a positive or negative imageof the pattern. Source: After W. C. Till and J. T. Luxon.

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Etching and Ion ImplantationFigure 34.7 Etching profiles resulting from (a) isotropic wet etching and (b) anisotropic dryetching. Source: R. C. Jaeger.

Figure 34.8 Apparatus for ionimplantation

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pn Junction Diode

Figure 34.9 (continued)

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pn Junction Diode (cont.)

Figure 34.9

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Two-Level Metal Interconnect

Figure 34.10 (a) Scanning electron microscope photograph of a two-level metal interconnect. Notethe varying surface topography. Source: NationalSemiconductor Corporation. (b) Schematic drawingof a two-level metal interconnect structure. Source: R.C. Jaeger.

(a) (b)

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Bonding and Packaging

(a) (b) (c)

Figure 34.11 (a) SEM photograph of wire bonds connecting package leads (left-hand side) to die bonding pads. (b) and (c) Detailed views of (a). Source: Courtesy of Micron Technology, Inc.

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Integrated Circuit Packages

Figure 34.12 Schematic illustrations of different IC packages: (a) dual-in-line (DIP), and (b) ceramic flat pack,and (c) common surface mount configuration. Sources: R. C. Jaeger and A. B. Glaser; G. E. Subak-Sharpe.