PRISM: ERC-LIFE, Feb 25, 2007 PRISM: ERC-LIFE, Feb 25, 2007 Overview of Flexible Electronics for LIFE James C. Sturm and Sigurd Wagner Department of Electrical Engineering Director, Princeton Institute for the Science and Technology of Materials (PRISM) Princeton University, Princeton, NJ 08540 USA sturm: 609-258-5610, [email protected]wagner: [email protected]If you really need to reach me, my administrative ass’t. is Ms. Sheila Gunning, [email protected], 609- 258-1575
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PRISM: ERC-LIFE, Feb 25, 2007 Overview of Flexible Electronics for LIFE James C. Sturm and Sigurd Wagner Department of Electrical Engineering Director,
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PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
Overview of Flexible Electronics for LIFE
James C. Sturmand Sigurd Wagner
Department of Electrical EngineeringDirector, Princeton Institute for the Science and
If you really need to reach me, my administrative ass’t. is Ms. Sheila Gunning, [email protected], 609-258-1575
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
Outline
• Conventional Microelectronics
• Large Area and Flexible Microelectronics
• Applications
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
Finished Silicon Wafer after fabrication
• Each square (cm x cm about) is its own circuit, with millions (billions) of connected transistors. 100’s of chips on wafer, typically.
• Also, miles and miles of wires (printed metal stripes) on them • The process of making them is known as “Very Large Scale
Integrated” technology (VLSI)• Typical features sizes today = 0.1 micron = 100 nanometer = 10-5 cm
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
One chip
• After it has been “diced” from the wafer.• Also known as a “die”• 0.5 – 2 cm on an edge, typically
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
• Each metal leg of the package is connected to a mini-wire which is connected to the chip.
Wire connection “pads”
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
The chip is put into a black plastic/ceramic package for use in applications
• Each metal leg of the package is connected to a mini-wire which is connected to the chip.
• These are ususally soldered into green “printed circuit boards” (e.g. 6” x 6”) that you see in electronic products
• Small, hard, and rigid,
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
Integrated Circuit Business Model
1. Make the transistors and wires on the chip smaller (nanotechnology)
2. chips are smaller and more chips fit on a wafer 3. The cost per chip is lower (or more on a chip for same
cost): costs per function DROP over time (108 x in 35 years)
4. Increase sales through more applications enabled by low cost
5. The business problem: it is getting harder to make things smaller and still have the transistors work and be cheaper. So what do you do? (“End of Moore’s Law”)
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
Outline
• Conventional Microelectronics
• Large Area and Flexible Microelectronics
• Applications
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
Flat panel TV Princeton Macroelectronics Group
Samsung Apple Computer
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
Real time image processing in PC
Picture archiving and communications system (PACS)High
performance display
Flat panel
detector
High speed
network
Digital X-ray imager Princeton Macroelectronics Group
Richard Weisfield, dpiX
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Solar electric module Princeton Macroelectronics Group
Akihiro Takano, Fuji Electric Advanced Technology
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a pixellated surface
switch, amplifier
sensor actuator
cell (pixel)
interconnects
Architecture of an electronic surface
rigid, flexible, or deformable, or elastomeric substrate
Steel foil, thin glass, rollable or stretchable plastic, ...
Princeton Macroelectronics Group
“Backplane”: Electronics
“Front plane”: End function
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
A liquid-crystal display Princeton Macroelectronics Group
Frontplane
PRISM: ERC-LIFE, Feb 25, 2007PRISM: ERC-LIFE, Feb 25, 2007
Was LCD readout (‘70s), laptop display (’80s), desktop monitor (90’s)
Is flat screen TV, X-ray imager, thin-film solar cell (’00s)
What will be next??? (’10s)
Much of large-area electronics was invented at the RCA Labs in Princeton:
- Paul Weimer … thin-film transistor in the ’60s
- George Heilmeier *62 … liquid-crystal display in the ‘60s
- David Carlson and Chris Wronski … amorphous-silicon thin-film solar cell in the ‘70s
A brief history of large-area electronics
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Bend: Small deformation, elastic, one-time or repeated
Conformally shape: Large deformation, plastic, one-time
Stretch: Large deformation, elastic, repeated
3 degrees of shaping a “flexible” electronic surface
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Application 2:(E-problem: file corrupted)
• Front plane: “electret sensor” S. Bauer, U. Linz, Austria• Converts pressure to electricity
Array of pressure detectors – covering large area Array of microphones over some array
• Converts electricity into motion Can make thin film “breathe” in and out, local control
Will send rest of file later
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END
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Moore’s Law
• Not fundamental, just an observation• Has continued despite many predictions of demise• Billions of T’s on a single chip!!!!! (in DRAM memory, one bit
requires one transistor)
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How do they get all that stuff on the chip: It’s a Small World!!
10-1
100
101
102
103
104
105
1960 1970 1980 1990 2000 2010 20201E-4
1E-3
0.01
0.1
1
10
100
Siz
e (N
anom
eter
s)
size of atoms
human hairTransistor Gate Length
Year
Siz
e (M
icro
ns)
Feature Sizes on Integrated Circuits(m
illi
onth
s of
met
ers,
thou
sand
ths
of m
illi
met
ers)
(bil
lion
ths
of m
eter
s,m
illi
onth
s of
mil
lim
eter
s)
Gate length is key number: often the smallest size of the width of a layer on a chip