PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE - TI.com · PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2)
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1FEATURES APPLICATIONS
CATHODE
ANODE
*
1
2
3
DCK (SC-70) PACKAGE
(TOP VIEW)
ANODE
NC
CATHODE
NC
NC
1
2
3
5
4
NC – No internal connection
DBZ (SOT-23-3) PACKAGE
(TOP VIEW)
«Pin 3 is attached to Substrate and mustbe connected to ANODE or left open.
DESCRIPTION/ORDERING INFORMATION
TL4050
www.ti.com ........................................................................................................................................................ SLOS486A–JUNE 2007–REVISED AUGUST 2009
PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE
• Data-Acquisition Systems• Fixed Output Voltages of 2.5 V, 4.096 V, 5 V,and 10 V • Power Supplies and Power-Supply Monitors
• Instrumentation and Test Equipment• Tight Output Tolerances and Low TemperatureCoefficient • Process Controls
• Precision Audio– Max 0.1%, 50 ppm/°C – A Grade• Automotive Electronics– Max 0.2%, 50 ppm/°C – B Grade• Energy Management– Max 0.5%, 50 ppm/°C – C Grade• Battery-Powered Equipment• Low Output Noise: 41 µVRMS Typ
• Wide Operating Current Range:60 µA Typ to 15 mA
• Stable With All Capacitive Loads; No OutputCapacitor Required
• Available in Extended Temperature Range:–40°C to 125°C
The TL4050 series of shunt voltage references are versatile easy-to-use references suitable for a wide array ofapplications. The two-terminal fixed-output device requires no external capacitors for operation and is stable withall capacitive loads. Additionally, the reference offers low dynamic impedance, low noise, and low temperaturecoefficient to ensure a stable output voltage over a wide range of operating currents and temperatures.
The TL4050 is offered in three initial tolerances, ranging from 0.1% (max) for the A grade to 0.5% (max) for theC grade. Thus, a great deal of flexibility is offered to designers in choosing the best cost-to-performance ratio fortheir applications. Packaged in the space-saving SOT-23-3 and SC-70 packages and requiring a minimumcurrent of 45 µA (typ), the TL4050 also is ideal for portable applications.
The TL4050xI is characterized for operation over an ambient temperature range of –40°C to 85°C. TheTL4050xQ is characterized for operation over an ambient temperature range of –40°C to 125°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SLOS486A–JUNE 2007–REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
ORDERING INFORMATION (1)
DEVICE ORDERABLE TOP-SIDETA VKA PACKAGE (2)GRADE PART NUMBER MARKING (3)
Reel of 3000 TL4050A25IDBZRSOT-23-3 – DBZ TKE_
Reel of 250 TL4050A25IDBZT2.5 V
Reel of 3000 TL4050A25IDCKRSC-70 – DCK 82_
Reel of 250 TL4050A25IDCKTReel of 3000 TL4050A41IDBZR
SOT-23-3 – DBZ TKL_Reel of 250 TL4050A41IDBZT
4.096 VA grade: Reel of 3000 TL4050A41IDCKR0.1% initial SC-70 – DCK 8E_
Reel of 250 TL4050A41IDCKTaccuracy and50 ppm/°C Reel of 3000 TL4050A50IDBZR
SOT-23-3 – DBZ TKS_temperatureReel of 250 TL4050A50IDBZTcoefficient 5 VReel of 3000 TL4050A50IDCKR
SC-70 – DCK 8L_Reel of 250 TL4050A50IDCKTReel of 3000 TL4050A10IDBZR
SOT-23-3 – DBZ TK2_Reel of 250 TL4050A10IDBZT
10 VReel of 3000 TL4050A10IDCKR
SC-70 – DCK 8Z_Reel of 250 TL4050A10IDCKT
–40°C to 85°CReel of 3000 TL4050B25IDBZR
SOT-23-3 – DBZ TKF_Reel of 250 TL4050B25IDBZT
2.5 VReel of 3000 TL4050B25IDCKR
SC-70 – DCK 83_Reel of 250 TL4050B25IDCKTReel of 3000 TL4050B41IDBZR
Reel of 250 TL4050B41IDCKTaccuracy and50 ppm/°C Reel of 3000 TL4050B50IDBZR
SOT-23-3 – DBZ TKT_temperatureReel of 250 TL4050B50IDBZTcoefficient 5 VReel of 3000 TL4050B50IDCKR
SC-70 – DCK 8M_Reel of 250 TL4050B50IDCKTReel of 3000 TL4050B10IDBZR
SOT-23-3 – DBZ TK3_Reel of 250 TL4050B10IDBZT
10 VReel of 3000 TL4050B10IDCKR
SC-70 – DCK 92_Reel of 250 TL4050B10IDCKT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.(3) The actual top-side marking has one additional character that designates the wafer fab/assembly site.
SLOS486A–JUNE 2007–REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
ORDERING INFORMATION (continued)DEVICE ORDERABLE TOP-SIDETA VKA PACKAGE (2)GRADE PART NUMBER MARKING (3)
Reel of 3000 TL4050B25QDBZRSOT-23-3 – DBZ TKJ_
Reel of 250 TL4050B25QDBZT2.5 V
Reel of 3000 TL4050B25QDCKRSC-70 – DCK 86_
Reel of 250 TL4050B25QDCKTReel of 3000 TL4050B41QDBZR
DCK package 252TJ Operating virtual junction temperature 150 °CTstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambienttemperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
SLOS486A–JUNE 2007–REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
at industrial temperature range, full range TA = –40°C to 85°C (unless otherwise noted)TL4050A25I TL4050B25I TL4050C25I
PARAMETER TEST CONDITIONS TA UNITMIN TYP MAX MIN TYP MAX MIN TYP MAX
ReverseVZ breakdown IZ = 100 µA 25°C 2.5 2.5 2.5 V
IZ = 10 mA 25°C ±20 ±20 ±20Averagetemperature IZ = 1 mA 25°C ±15 ±15 ±15coefficient ofαVZ ppm/°C25°C ±15 ±15 ±15reversebreakdown IZ = 100 µA Full ±50 ±50 ±50voltage range
25°C 0.3 0.8 0.3 0.8 0.3 0.8IZ,min < IZ < 1 mAReverse Full 1.2 1.2 1.2breakdown range
voltage change mV25°C 2.3 6 2.3 6 2.3 6with cathode
IZ = 10 mA 25°C ±20 ±20 ±20Averagetemperature IZ = 1 mA 25°C ±15 ±15 ±15coefficient ofαVZ ppm/°C25°C ±15 ±15 ±15reversebreakdown IZ = 100 µA Full ±50 ±50 ±50voltage range
25°C 0.3 0.8 0.3 0.8 0.3 0.8IZ,min < IZ < 1 mAReverse Full 1.2 1.2 1.2breakdown range
voltage change mV25°C 2.3 6 2.3 6 2.3 6with cathode
SLOS486A–JUNE 2007–REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
at industrial temperature range, full range TA = –40°C to 85°C (unless otherwise noted)TL4050A41I TL4050B41I TL4050C41I
PARAMETER TEST CONDITIONS TA UNITMIN TYP MAX MIN TYP MAX MIN TYP MAX
ReverseVZ breakdown IZ = 100 µA 25°C 4.096 4.096 4.096 V
IZ = 10 mA 25°C ±30 ±30 ±30Averagetemperature IZ = 1 mA 25°C ±20 ±20 ±20coefficient ofαVZ ppm/°C25°C ±20 ±20 ±20reversebreakdown IZ = 100 µA Full ±50 ±50 ±50voltage range
25°C 0.2 0.9 0.2 0.9 0.2 0.9IZ,min < IZ < 1 mAReverse Full 1.2 1.2 1.2breakdown range
voltage change mV25°C 2 7 2 7 2 7with cathode
current change 1 mA < IZ < 15 mA Full 10 10 10range
IZ = 10 mA 25°C ±30 ±30 ±30Averagetemperature IZ = 1 mA 25°C ±20 ±20 ±20coefficient ofαVZ ppm/°C25°C ±20 ±20 ±20reversebreakdown IZ = 100 µA Full ±50 ±50 ±50voltage range
25°C 0.2 0.9 0.2 0.9 0.2 0.9IZ,min < IZ < 1 mAReverse Full 1.2 1.2 1.2breakdown range
voltage change mV25°C 2 7 2 7 2 7with cathode
current change 1 mA < IZ < 15 mA Full 10 10 10range
SLOS486A–JUNE 2007–REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
at industrial temperature range, full range TA = –40°C to 85°C (unless otherwise noted)TL4050A50I TL4050B50I TL4050C50I
PARAMETER TEST CONDITIONS TA UNITMIN TYP MAX MIN TYP MAX MIN TYP MAX
IZ = 10 mA 25°C ±30 ±30 ±30Averagetemperature IZ = 1 mA 25°C ±20 ±20 ±20coefficient ofαVZ ppm/°C25°C ±20 ±20 ±20reversebreakdown IZ = 100 µA Full ±50 ±50 ±50voltage range
25°C 0.2 1 0.2 1 0.2 1IZ,min < IZ < 1 mAReverse Full 1.4 1.4 1.4breakdown range
voltage change mV25°C 2 8 2 8 2 8with cathode
current change 1 mA < IZ < 15 mA Full 12 12 12range
IZ = 10 mA 25°C ±30 ±30 ±30Averagetemperature IZ = 1 mA 25°C ±20 ±20 ±20coefficient ofαVZ ppm/°C25°C ±20 ±20 ±20reversebreakdown IZ = 100 µA Full ±50 ±50 ±50voltage range
25°C 0.2 1 0.2 1 0.2 1IZ,min < IZ < 1 mAReverse Full 1.4 1.4 1.4breakdown range
voltage change mV25°C 2 8 2 8 2 8with cathode
current change 1 mA < IZ < 15 mA Full 12 12 12range
SLOS486A–JUNE 2007–REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
at industrial temperature range, full range TA = –40°C to 85°C (unless otherwise noted)TL4050A10I TL4050B10I TL4050C10I
PARAMETER TEST CONDITIONS TA UNITMIN TYP MAX MIN TYP MAX MIN TYP MAX
IZ = 10 mA 25°C ±40 ±40 ±40Averagetemperature IZ = 1 mA 25°C ±20 ±20 ±20coefficient ofαVZ ppm/°C25°C ±20 ±20 ±20reversebreakdown IZ = 100 µA Full ±50 ±50 ±50voltage range
25°C 0.8 1.5 0.8 1.5 0.8 1.5IZ,min < IZ < 1 mAReverse Full 3.5 3.5 3.5breakdown range
voltage change mV25°C 8 12 8 12 8 12with cathode
current change 1 mA < IZ < 15 mA Full 23 23 23range
IZ = 10 mA 25°C ±40 ±40 ±40Averagetemperature IZ = 1 mA 25°C ±20 ±20 ±20coefficient ofαVZ ppm/°C25°C ±20 ±20 ±20reversebreakdown IZ = 100 µA Full ±50 ±50 ±50voltage range
25°C 0.8 1.5 0.8 1.5 0.8 1.5IZ,min < IZ < 1 mAReverse Full 3.5 3.5 3.5breakdown range
voltage change mV25°C 8 12 8 12 8 12with cathode
current change 1 mA < IZ < 15 mA Full 23 23 23range
SLOS486A–JUNE 2007–REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
SLOS486A–JUNE 2007–REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
Figure 1. Start-Up Test Circuit
The TL4050 does not require an output capacitor across cathode and anode for stability. However, if an outputbypass capacitor is desired, the TL4050 is designed to be stable with all capacitive loads.
There is a parasitic Schottky diode connected between pins 2 and 3 of the SOT-23 packaged device. Thus, pin 3of the SOT-23 package must be left floating or connected to pin 2.
The TL4050x-41 is designed to be a cost-effective voltage reference as required in 12-bit data-acquisitionsystems. For 12-bit systems operating from 5-V supplies, such as the ADS7842 (see Figure 2), the TL4050x-41(4.096 V) permits operation with an LSB of 1 mV.
Figure 2. Data-Acquisition Circuit With TL4050x-41
www.ti.com ........................................................................................................................................................ SLOS486A–JUNE 2007–REVISED AUGUST 2009
In a typical shunt-regulator configuration (see Figure 3), an external resistor, RS, is connected between thesupply and the cathode of the TL4050. RS must be set properly, as it sets the total current available to supply theload (IL) and bias the TL4050 (IZ). In all cases, IZ must stay within a specified range for proper operation of thereference. Taking into consideration one extreme in the variation of the load and supply voltage (maximum IL andminimum VS), RS must be small enough to supply the minimum IZ required for operation of the regulator, asgiven by data-sheet parameters. At the other extreme, maximum VS and minimum IL, RS must be large enoughto limit IZ to less than its maximum-rated value of 15 mA.
TL4050C50QDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 8SU
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
SOT-23 - 1.12 mm max heightDBZ0003ASMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. Reference JEDEC registration TO-236, except minimum foot length.
0.2 C A B
1
3
2
INDEX AREAPIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAXALL AROUND
0.07 MINALL AROUND
3X (1.3)
3X (0.6)
(2.1)
2X (0.95)
(R0.05) TYP
4214838/C 04/2017
SOT-23 - 1.12 mm max heightDBZ0003ASMALL OUTLINE TRANSISTOR
NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLESCALE:15X
PKG
1
3
2
SOLDER MASKOPENINGMETAL UNDER
SOLDER MASK
SOLDER MASKDEFINED
METALSOLDER MASKOPENING
NON SOLDER MASKDEFINED
(PREFERRED)
SOLDER MASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
(2.1)
2X(0.95)
3X (1.3)
3X (0.6)
(R0.05) TYP
SOT-23 - 1.12 mm max heightDBZ0003ASMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLEBASED ON 0.125 THICK STENCIL
SCALE:15X
SYMM
PKG
1
3
2
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