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HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra- High Capacity Flex OTN Presented @ 4 th Symposium on Optical Interconnect for Data Centers © Huawei Technologies All Rights reserved 2016 Le Binh, European Research Institute, GRC Huawei Technologies PIC = Photonic Integraed Circuit = Photonic InterConnection
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PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Apr 28, 2018

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Page 1: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

HUAWEI TECHNOLOGIES CO., LTD.

PIC Technologies for Intra- and Inter-

Distributed DC and Cloud-Access Ultra-

High Capacity Flex OTN

Presented @ 4th Symposium on Optical Interconnect for Data Centers

© Huawei Technologies – All Rights reserved 2016

Le Binh, European Research Institute, GRC

Huawei Technologies

PIC = Photonic Integraed Circuit

= Photonic InterConnection

Page 2: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

HUAWEI TECHNOLOGIES CO., LTD.

Evolutionary Networks: Flattening Telcom Cloud Nets and DC Centric

Nets

Ultra-fast

Giga fiber/copper/co-ax/Wifi

E2E IP + Optical 400G/2T

Metro Core (coherent)

Backbone core

(Coherent)

Data Centers

(distributed/concentric)

Simplified

•No Congestion, Lower

Concentration Ratio

•Legacy Consolidation ,

Flattened Hierarchy

Agile

•SDN / NFV Enabled

•Telco OS

Cloud CO Cloud Edge

APP/Service

Core DC

Edge DC CO DC

Access

(DD/Coherent)

MIMO antenna

5G

Where and What PIC Technologies ????

APP

APP

Page 3: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 3

Transmission capacity/fiber and demands

10/11/2016

1980 1990 2000 2010 2020 2030 2040

106

109

1012

1015

1018

SSMF

WDM

WDM: EDFASSMF+DCFED

FA +Noises OA noises

Non-DCF Co-ORx DSP

SE –M-QAM

Flex Co-ORx DSP

Ext C- L-band Data Center Nets

Clouds – CRAN

Intra-Interconnection

4K Video

5G

IoT

Data Center Nets Flattened Telcom Nets

Inter DC-Telcom Net Inter-connections

100G-400G DWDM Deployment

Flex OTN (100G – 2-3Tbps) DC Networking

Nets-Interconnections

Multiple-fibers

Page 4: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 4

25-30Gbps Electrical 56Gbps Electrical? 50-56Gbps

Backplane Rate

SerDes Approach NRZ + FEC (Optional) SE-HoM? + FEC

Analog Tx / Digital Rx

10-13 pJ/bit (16nm)

Analog Tx / Analog Rx

7-10 pJ/bit (16nm)

Digital Tx / Digital Rx

>15 pJ/bit (16nm)

56-112Gbps Optical

PAM + FEC Optical Solution

28nm/16nm 7nm Photonics/simple photonics

CEI 56G-USR: ~2 pJ/bit

Optical I/O: ~5 pJ/bit

Optical I/O vs. Electrical I/O

Save Energy, Longer Reach

Optical

CEI 56G-LR: 10-13 pJ/bit (16nm)

Optical I/O About 7 pJ/bit

Electrical I/O About 10-13 pJ/bit (16nm)

Page 5: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 5

Optical switching using PIC micro-rings

Massive capacity Optical Interconnect Flex Rates/BW Channels

Page 6: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 6

Basic micro-ring net for 4-way switching (4W-MRSw)

Modulated channels

Multi-lamdas

vSW1 vSW2

Port 2 (out)

Port 3 (out)

Port 4 (out)

vSW1 & vSW2: voltage controlled

Switch signals

R1,R2, R3: micro-ring resonators

(driven by dual electrodes in push pull

Mode wideband filtering/passband

CSw = coupling switch

Switching principles

To switch lamda1 to port 2 (out) : Use R3

to resonate the required wavelength

Channel to R# and then switching out by

using the CSw3 coupler.

Similar for switching to Port 3 and 4 –

use rings R!, R2 or R3

Flex R1

Flex R3

Flex R2

CSw3

CSw2

CSw1

vSW2

Modulated channels

Multi-lamdas

Page 7: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 7

Hybrid PIC : Multi-Tbps super-channel optical transmitter

Page 7

Wideband Comb Gen

Narrow linewidth

Bank of

Cascade

Micro-ring pn Mod

Data-channels

Modulated channel

To be launched to SSMF

Page 8: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 8

Large-size small form-factor Switching matrix using 4-way micro-ring switches: applications Photonic switching in photonic kernal Data Centers

Multi-lamda selective

switched output port 3

Multi-lamda selective

switched output ports 4 Multi-lamda selective

switched output port 2

Modulated channels

Multi-lamdas

Modulated channels

Multi-lamdas

Modulated channels

Multi-lamdas

Micro-ring 4-way switch

(4W-MRSw previous slide)

Multi-bank elect.

switching signals

Micro-rings

SOI waveguides

Page 9: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 9

Large-size small form-factor Switching matrix using 4-way micro-ring switches: Apps Photonic switching/ distribution of ref. channels in photonic kernel (core) Data Centers

Multi-lamda selective

switched output port 3

Multi-lamda selective

switched output ports 4

Multi-lamda selective

switched output port 2

QD Comb Laser 1

Micro-ring 4-way switch

(4W-MRSw previous slide)

Multi-bank elect.

Switching/modulation signals

QD Comb Laser ith

QD Comb Laser N

Modulated channels

Multi-lamdas

Modulated channels

Multi-lamdas

Modulated channels

Multi-lamdas

Page 10: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 10

Flex Optical Filters by Cascade & Parallel Ring and MZDI

GND

ck

IN

OUT

dk dk

PS 1

(b) All-pole stage

(Resonant)

(tuning – piezo-elect)

PS 2

TC

m-Ring delay T

V1+

V2 +

OUT 1

OUT 2

(b) All-zero stage

(Interferometric)

Tuning piezo-electric

PassBands: 50, 75, 275, 375 GHz

V+

GND

GND

V+

1 2

1 1 2

ˆ ˆ ˆ ˆ( ) ( ) ( ) ( )ˆ ˆˆ ( ) .......ˆ ˆ ˆ ˆ( ) ( ) ( ) ( )

Mk M

k k M

z z z z z z z zH z A A

z p z p z p z p

- - - -

- - - -

OPTICAL FILTER BANDPASS FILTER Z-DOMAIN TRANSFER FUNCTION

Cascade - Sampling time = optical delay line (propagation)

Formed by Common Standard z-transfer form

1540 1542 1544 1546 1548 1550 1552 1554 1556 1558 15600

0.2

0.4

0.6

0.8

1

1.2

Magnitude Response of Butterworth Bandpass Optical Filter

Wave Length (nm)

Mag

nitu

de

Filter Order = 8

Passband Ripple = 0.5 dB

Stopband Ripple = -20 dB

1540 1542 1544 1546 1548 1550 1552 1554 1556 1558 15600

0.2

0.4

0.6

0.8

1

1.2

Magnitude Response of Chebyshev Bandpass Optical Filter

Wave Length (nm)

Magnitude

Filter Order = 6

Passband Ripple =0.5 dB

Stopband Ripple = -20 dB

1540 1545 1550 1555 15600

0.2

0.4

0.6

0.8

1

1.2

Magnitude Response

Wave Length (nm)

Mag

nitu

de

Page 11: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Photonic Switching Kernel + Er:OWA + High Res. OSA+ MCU

Page 11

Si-integrated Tunable

OXC Matrices

Er:

O

WA

Er:

OW

A

Planar Er: OWA

Er: OWA

optical fibers transporting

flex channels (North/South/East/West

Cloud DC

High Res. AWG/ PD Bank

PD Bank

High Res. AWG/ PD Bank

PD Bank

High Res. AWG/ PD Bank

PD Bank

High Res. AWG/ PD Bank

PD Bank

CONTROL

DSP

CONTROL

DSP

CONTROL

DSP

CONTROL

DSP

PD Bank

Fiber flex

channels

Fiber flex

channels

Fiber flex

channels

Fiber flex channels

CLOUD

F/RAN

CLOUD

Fiber/RAN

CLOUD

F/RAN

CLOUD RAN

Page 12: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Planar integrated Er:Al2O3 : gain and absorption

Page 12 Gain /cm factor versus % Er:conc. pumped by 80mW 980nm

Waveguide section EDWA Spiral structure section

Photonic Section

EDWA

980nm PL

Page 13: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Integrated Photonic Components

› Optical channels of Flex BW/Rates be

detected to feed MCU to control switching

at variable BW

› Setting routing path and path BW via ring

&MZ filtering net

› Si PIC play the major part in the

convergence of wireless and optical

technologies for economic.

› Planar Optical Amps to compensate losses

Page 13

Page 14: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

HUAWEI TECHNOLOGIES CO., LTD. HUAWEI Confidential Page 14

84 Channels Edge Coupling Prototype: Loopback Testing

3.5mm

84 Channel

Ceramic substrate

SiPh chip 12 x MCF

input

output

Each 7-core MCF could fanout to 7 SMFs

Fan-out 1 x 7-core MCF

7 x SMF

Page 15: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

HUAWEI TECHNOLOGIES CO., LTD. HUAWEI Confidential Page 15

84 Channels Surface Coupling Prototype

› 84-ch are coupled in area of 6mm x 2mm, density is 7-ch/mm2

› One-pass loss of 84-ch range from 4.1dB to 6.9dB

SiPh

Loopback

Circuit with

GCs3D

Interposer

10mm

9mm

6mm2mm

MCF Array

3D Interposer

900um

1270um

Channel Number

On

e-p

as

s In

se

rtio

n L

oss

Page 16: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

HUAWEI TECHNOLOGIES CO., LTD. HUAWEI Confidential Page 16

Acknowledgement

› The author thanks to Dr. Song Xiaolu of Huawei HQ Shenzhen for the use of the two

slides on out coupling and multi-core or few-mode fibers to further increase the

routing capacity.

Page 16

Page 17: PIC Technologies for Intra- and Inter- Distributed DC and ... · HUAWEI TECHNOLOGIES CO., LTD. PIC Technologies for Intra- and Inter- Distributed DC and Cloud-Access Ultra-High Capacity

Page 17

Together, the top Optical Interconnect

Technologies