Patent Pending SinkPAD TM Th ll Effi i t PCB T h l f Patent Pending Thermally Efficient PCB Technology for the LED Application Sinkpad Corporation 1 R3 Users of SinkPAD TM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to be accurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makes no warranties as to the applicability, fitness or suitability of SinkPAD TM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.
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Patent Pending
SinkPADTM
Th ll Effi i t PCB T h l f
Patent Pending
Thermally Efficient PCB Technology for the LED Application
Sinkpad Corporation
1
R3Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.
PRESENTATION OUTLINE
Thermal Challenges In The LED Applications
How it is Addressed? Metal Back PCB Technology
Is There a Better Way? SinkPADTM Technologyy gy
What Would I Gain Using SinkPADTM?
Comparisons Of “Metal Back” & “SinkPADTM” Comparisons Of Metal Back & SinkPADTM
Potential Applications
Test Data
Conclusion
2R3
THERMAL CHALLANGES
Increasing Trend For LED Power Increasing Trend For LED Power
Increasing Trend For Higher Brightness
Primary Thermal Path: Conduction Cooling
Higher Thermal Resistance
Power Density Increasing – more LEDs in a small area
Long Life Expectation Long Life Expectation
3R3
How Heat Issues Addressed Historically?
Metal Back PCB TechnologyExample: MCPCB, Aluminum PCB etc…type products
SinkPADTM makes a lot of sense at mid to high power application, for example the new Cree XML can be driven up to 3A. At this power level, It can be a big difference in junction temp
TEST DATA, Cree 1-XPG
SinkPAD v/s Typical Aluminum back PCB thermal data
21R5
TEST DATA, Cree XP-G
SinkPAD v/s Conventional MCPCB thermal data (IR Camera)
MCPCB SinkPAD PCB- Cree XPG 9 LEDs- Current: 1 Amp.- Power: 3W each- PCB ~ 1”x1” To view & download this infoTo view & download this info
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Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.