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P2020 Ardentec Probe Site Qualification
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12 April 2011
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M82Y Qualification at Ardentec Probe
Goal• Objective is to qualify Ardentec Singapore as joint probe site for probing
all flavors of M82Y (0M82Y, 1M82Y).
• Local probe site will eliminate need to ship wafers to Austin and reduce overall product cycle time.
Considerations• Test platform and probe card is identical to that used in OHT.
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• Test platform and probe card is identical to that used in OHT.
• Test program and test limits used in Ardentec-Singapore is identical to that used in OHT.
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M82Y Qualification PlanPre-correlation
Pre-Correlation items• Install and verified Prober setup files
• Install Probe Program and checked for loading errors.
• Validate Probe Card with local PCR and complete inspections on probe card locally.
Considerations• Test platform and probe card is identical to that used in OHT.
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• Test platform and probe card is identical to that used in OHT.
• Test program and test limits used in Ardentec-Singapore is identical to that used in OHT.
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M82Y Qualification Plan
Correlation items• Perform Kappa analysis (Yield and Bin correlation) of 1 wafer.
Passing Criteria: Yield to Yield difference <3%; Bin to Bin swap < 6%.
• Confirm Probe marks on one wafer.
Passing Criteria: Verify marks are acceptable per global specification.
• Execute ILD experiment with 3 different overdrive settings, 2,4, and and 8 touchdowns on one wafer and de-process top layer for visual inspection of
underlying layers.
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Passing Criteria: No Electrical bin changes, and no under-pad damage.
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P2020 ARDT Qualification Results Summary:
Test Status Results Date Completed
ILD: FSL Baseline Complete Pass 25-Mar-2011
Kappa Correlation Complete Pass 30-Mar-2011
ILD: ARDT Qual Complete Pass 7-Apr-2011
ARDT Audit Complete Pass 11-Apr-2011
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Probe ILD Plan:Wafer: Global Foundaries:WB01M82Y; QA0291; wafer 25
Probe Card:
MJC x1 Ultra LowK Card Design
BCF 0.5, tip dia. 0.6 mil
Platform:
Teradyne UFLEX with InTest/VSM
OPUSII
Inputs:
• Probe Overdrive:
CELL
Probe
Events
40um OD
from first
2X
4X
8X
60um OD
from first
2X
4X
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• Probe Overdrive:• 40• 60 (nominal)• 80
• Probe Events*:• 2 (typical)• 4• 8
* Note: A x1 card using double-touch probe process will make 2 touchdowns within a single probe event.
8X
80um OD
from first
2X
4X
8X
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P2020 (M82Y) ASGP Probe ILD Summary:
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Conclusion: The ASGP M82Y probe process passes electrical stability and mechanical requirements for the 60um & 80um process cells.
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FSL to ARDT Kappa:
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Conclusion / Recommendations
Conclusion• M82Y (0M82Y, 1M82Y) passes all correlation/qualification requirements
without any issues at Ardentec Singapore.
• Probe mark inspections pass all requirements without any issues.
• For ILD study: � no cells failed due to probe card related issues for any of the overdrive and
touch downs DOE conditions.
� No abnormalities noted on inspected pads post probe,
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� No abnormalities noted on inspected pads post probe,
� No abnormalities noted on underlying layers of de-processed wafer.
Recommendations• Probe of 0M82Y and 1M82Y can be released in Ardentec-Singapore.
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Data and Back-up Information
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Probe Marks & ILD Inspection: 60um OD
Ardentec
4X
Events Probe Marks Under-Probe (ILD)
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8X
Results: Probe marks are well centered on the probe pads.Inspection of the de-processed wafer revealed no under-probe damage.Note that some etching and discoloration from the de-processing chemistry is observed.
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Probe Marks & ILD Inspection: 80um OD
Ardentec
4X
Events Probe Marks Under-Probe (ILD)
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8X
Results: Probe marks are well centered on the probe pads.Inspection of the de-processed wafer revealed no under-probe damage.Note that some etching and discoloration from the de-processing chemistry is observed.