P-Channel NexFET™ Power MOSFETs Sheets/Texas Instruments PDFs... · Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data ... ELECTRICAL
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−VGS − Gate to Source Voltage − V
0
5
10
15
20
25
30
0 1 2 3 4 5 6 7 8 9 10
RD
S(o
n)
−O
n-S
tate
Resis
tance
−m
W
G006
TC = 125 C°
TC = 25 C°
ID = −10A
Qg − Gate Charge − nC
0
1
2
3
4
5
6
0 2 4 6 8 12 16
−V
G−
Gate
Voltage
−V
G003
ID
DS
= −10A
V = −10V
1410
7
8
9
10
1 S
S
S
S
S5
G
6D
7D
8D
4
3
2
CSD25401Q3
www.ti.com SLPS211C –AUGUST 2009–REVISED APRIL 2013
P-Channel NexFET™ Power MOSFETsCheck for Samples: CSD25401Q3
1FEATURESTable 1. PRODUCT SUMMARY
2• Ultra Low Qg and QgdVDS Drain to Source Voltage –20 V• Low Thermal ResistanceQg Gate Charge Total (4.5V) 8.8 nC
• Battery ManagementABSOLUTE MAXIMUM RATINGS• Load Switch
TA = 25°C unless otherwise stated VALUE UNIT• Battery ProtectionVDS Drain to Source Voltage –20 V
VGS Gate to Source Voltage +12 / -12 VDESCRIPTIONContinuous Drain Current, TC = 25°C –60 AThe NexFET™ power MOSFET has been designed IDContinuous Drain Current(1) –14 Ato minimize losses in power conversion load
IDM Pulsed Drain Current, TA = 25°C(2) –82 Amanagement applications. The SON 3×3 packagePD Power Dissipation(1) 2.8 Woffers excellent thermal performance for the size of
the package. TJ, Operating Junction and Storage –55 to 150 °CTSTG Temperature Range
Figure 1. Top View (1) RθJA = 45°C/W on 1inch2 Cu (2 oz.) on 0.060" thick FR4 PCB.
(2) Pulse width ≤300µs , duty cycle ≤2%
RDS(ON) vs VGS Gate Charge
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
SLPS211C –AUGUST 2009–REVISED APRIL 2013 www.ti.com
Tape and Reel Information
Notes:1. 10 sprocket hole pitch cumulative tolerance ±0.22. Camber not to exceed 1mm IN 100mm, noncumulative over 250mm3. Material:black static dissipative polystyrene4. All dimensions are in mm (unless otherwise specified)5. Thickness: 0.30 ±0.05mm6. MSL1 260°C (IR and Conection) PbF Reflow Compatible
www.ti.com SLPS211C –AUGUST 2009–REVISED APRIL 2013
REVISION HISTORY
Changes from Original (August 2009) to Revision A Page
• Changed 300s to 300µs in Note 2 of the Abs Max Ratings table ........................................................................................ 1
• Changed Qg Gate Charge Total (4.5V) - max value From: 2.3 To: 12.3 .............................................................................. 2
Changes from Revision A (October 2009) to Revision B Page
• Deleted the Package Marking Information section ............................................................................................................... 8
Changes from Revision B (October 2010) to Revision C Page
• Replaced the THERMAL CHARACTERISTICS table with the new Thermal Information Table .......................................... 2
• Changed the CSD25401Q3 Package Dimensions section .................................................................................................. 6
• Changed the Recommended PCB Pattern section .............................................................................................................. 7
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