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Optoelectronics in satellite payloadsIndustrialization concerns and Quality constraintsQuality Assurance tools to be builtMulti-partnership build up : an Optoelectronic and Reliability ad-hoc working group synergy.Conclusion
Optoelectronic innovative payloads : interests and impacts.
Advantage of such a flexible Opto microwave reconfigurable repeater (ORR).
System based on LO’s transferred on optical carriers andSystem based on LO’s transferred on optical carriers and delivered to modulator-based electro-optical mixers.
exceed the capabilities of equivalent microwave implementations.at identical system functionality and scale,
• it may bring drastic mass savings,y g g ,• very low loss of optical fibers compared to copper wires, • full RF isolation and suppression of EMC/EMI issues, • and above all could grow up to larger connectivity (10’s of beams)
Other benefits arise from transparency to RF frequency bands and new
and above all, could grow up to larger connectivity (10 s of beams) and cross-connect a large number of channels.
Other benefits arise from transparency to RF frequency bands and new functions routing like WDM (Wavelength Division Multiplexing).
Optoelectronic innovative payloads : interests and impacts.
Optoelectronic innovative payloads.Optoelectronic system architectures are potentially attractive and innovative solutions for Space hardware equipments in telecommunications.
System re-configurability, flexibility, complex multiple spot-beam coverage based on frequency reuse will take the large advantage of optoelectronic thanks to the following benefits :
drastic mass savings
exceed the capabilities of equivalent microwave implementations,
grow up to larger connectivity (10’s of beams)
cross-connect a large number of channels
new functions routing like WDMnew functions routing like WDM
The demonstrators phase is engaged.
Th i d t i li ti h t b d fi d d i iti t d th t tThe industrialization phase must be defined and initiated as the next step.
The Optoelectronic parts qualification methodology for space application must be prepared and built
Which level of integration to address : High Tech product
3 LEVELS OF COMPLEXITY
FACE TO
l ifi ti ith t t 3HIGH TECHNOLOGY LEVEL PRODUCTS : classification with respect to 3 LEVELS of complexity. We need to define an interactive option testing (basic purpose is to not duplicate testing from one level to another for
t d lit ti i ti )cost and quality optimization).
Main proposed pragmatic approach:
Corresponding industrialization, manufacturing, screening and qualification methodologies must be organized and adapted to each Level considered
Are basic optoelectronic elements used stand alone in a package orready to be assembled into higher complex optoelectronic functionsready to be assembled into higher complex optoelectronic functions(level 2 or 3)
Main proposed pragmatic approach :
Known materials and constructional analysis, Industrialization, manufacturing, screening and g gqualification methodologies must refer to stress test able to discriminate direct impact on intrinsic
f f th l tperformance of the element.
For example : Endurance stress tests (vacuum gazFor example : Endurance stress tests (vacuum, gaz or ionic contaminant, radiation stress, biasing steady state DC or pulsed) may modify and degrade
LEVEL 2 MODULE FUNCTIONS :What to address : High Tech product (cont’d)
LEVEL 2 MODULE FUNCTIONS :
Are assembled optoelectronic elements in a simple function (in asemi-complex packaged module ) used in a multi chip package andready to be used at subsystem or system level into higher complexoptoelectronic functions (level 3)
Main proposed pragmatic approach :Known materials and constructional analysis, design, industrialization, manufacturing, screening
Main proposed pragmatic approach :
g g gand qualification methodologies must refer to stress test able to discriminate direct impact on f ti lit d f f th i lfunctionality and performance of the semi-complex product.
For example : Mechanical & Environment stress tests at assembly and package level.
Which relevant parameters and characteristics to address ?
To increase the performance and reliability of the system under design, MIL-HDBK-1547 defines rules to use Electrical, Electronic, Electromagnetic, Opticaland Mechanical parts Such products are considered aging sensitive whenand Mechanical parts. Such products are considered aging sensitive, whenthey are subjected to gradual shortening over their useful life. On MOEMS forexample, aging mechanisms include the following:
Design considerations (maximum rating and derating)Design considerations (maximum rating and derating)
Handling and assembly ability and controls (where are the li it ?)limits ?)
Humidity and salt atmosphere before launch
Acceleration, vibration and shocks during launch
Pressure and temperature : during launch rapidPressure and temperature : during launch rapid depressurization and from room temperature to –120°C in few minutes (freezing, outgassing, …)few minutes (freezing, outgassing, …)
Quality assurance tools for Micro-Opto-ElectronicsQuality assurance tools for Micro Opto ElectronicsEuropean Space agency• ECSS-Q-ST-60-05: Generic procurement requirements for hybrid microcircuits. • Generic specification ESCC-9010 : Monolithic Microwave Integrated Circuits (MMICs) JEDEC• JEDEC JESD49 Procurement Standard for Semiconductor Die Products IncludingJEDEC JESD49 Procurement Standard for Semiconductor Die Products Including
Known Good Die• JEP149 : Application Thermal Derating MethodologiesMILITARYMILITARY• MIL-PRF-19500, General Specification for Semiconductor Devices• MIL-PRF-38534, General Specification for Hybrid Microcircuits
MIL PRF 38535 G l S ifi ti f I t t d Ci it M f t i• MIL-PRF-38535, General Specification for Integrated Circuits Manufacturing • MIL-STD-883 Microelectronics Test Methods, and Procedures, • MIL-HDBK-781A: Handbook for reliability test methods, plans and environments for
engineering development qualification and productionengineering, development, qualification and production.OTHER• TELCORDIA GR-468-CORE : Generic Reliability Assurance for Optoelectronic Devices
M lti t hi b ildMulti-partnership build up :the Optoelectronic andthe Optoelectronic andReliability ad-hoc workingReliability ad hoc workinggroup synergy.
There is a strong need for a Standards Quality assurance documents.
But prior to built such standards it has been presented during ISROSBut prior to built such standards it has been presented during ISROS 2009 and 2010 the need to elaborate a guideline document to synthesize the best practices and recommendations to design, test, industrialize,
f fuse, control, screen and qualify optoelectronic products for end-use in Space Application.
A tentative was initiated to work on a common document titled :
“PRODUCT ASSURANCE GUIDELINE FOR OPTOELECTRONIC DEVICES FOR SPACE APPLICATION”
Today, this initiative need to be enlarged and more deeply activatedToday, this initiative need to be enlarged and more deeply activated thanks to the effort of the existing community.
AbstractThe guide is foreseen to be a high technical synthesis for :
understanding the various aspects of Opto-Electronic devices
b h i d S E i ibehaviors under Space Environment constraints
Semiconductor material properties and device structures along with the final products (Emitters, Receivers, Opto-Electronic functions, passive Opto-Electronic functions)
Performance and reliability aspects of Opto-Electronic devices.
Failure mechanisms and analysis
Q lit d lifi ti th d l i iQuality assurance and qualification methodologies overview.
It will present in details Opto-Electronic device designs, packaging, d l t f t i i d t i li ti li ti t tdevelopment, manufacturing, industrializations, application uses, test and controls, screening sequences, qualification procedures and test methods, environment effects (Radiation, vacuum, thermal, mechanical, long term and end of life, …) and will help the reader to understand the means of developing suitable qualification plans and demonstrate high reliability equipment achievement using optoelectronic products.