May 2012. Version 1.1 MagnaChip Semiconductor Ltd. 1 MDP12N50B / MDF12N50B N-channel MOSFET 500V Absolute Maximum Ratings (Ta = 25 o C) Characteristics Symbol MDP12N50B MDF12N50B Unit Drain-Source Voltage V DSS 500 V Gate-Source Voltage V GSS ±30 V Continuous Drain Current T C =25 o C I D 11.5 11.5* A T C =100 o C 7.0 7.0* A Pulsed Drain Current (1) I DM 46 46* A Power Dissipation T C =25 o C P D 165 42 W Derate above 25 o C 1.33 0.32 W/ o C Repetitive Avalanche Energy (1) E AR 16.5 mJ Peak Diode Recovery dv/dt (3) dv/dt 4.5 V/ns Single Pulse Avalanche Energy (4) E AS 460 mJ Junction and Storage Temperature Range T J , T stg -55~150 o C ※ Id limited by maximum junction temperature Thermal Characteristics Characteristics Symbol MDP12N50B MDF12N50B Unit Thermal Resistance, Junction-to-Ambient (1) R θJA 62.5 62.5 o C/W Thermal Resistance, Junction-to-Case (1) R θJC 0.75 3.0 MDP12N50B / MDF12N50B N-Channel MOSFET 500V, 11.5A, 0.65Ω General Description The MDP/F12N50B uses advanced Magnachip’s MOSFET Technology, which provides low on-state resistance, high switching performance and excellent quality. MDP/F12N50B is suitable device for SMPS, high Speed switching and general purpose applications. Features V DS = 500V I D = 11.5A @V GS = 10V R DS(ON) ≤ 0.65Ω @V GS = 10V Applications Power Supply PFC Ballast
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N-Channel MOSFET 500V, 11.5A, 0.65 ΩMay 2012. Version 1.1 3 MagnaChip Semiconductor Ltd . MDP12N50B / MDF12N50B N-channel MOSFET 500V Fig.5 Transfer Characteristics Variation with
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May 2012. Version 1.1 MagnaChip Semiconductor Ltd. 1
MD
P12N
50B
/ MD
F12N
50
B N
-ch
an
nel M
OS
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T 5
00
V
Absolute Maximum Ratings (Ta = 25oC)
Characteristics Symbol MDP12N50B MDF12N50B Unit
Drain-Source Voltage VDSS 500 V
Gate-Source Voltage VGSS ±30 V
Continuous Drain Current TC=25
oC
ID 11.5 11.5* A
TC=100oC 7.0 7.0* A
Pulsed Drain Current(1) IDM 46 46* A
Power Dissipation TC=25
oC
PD 165 42 W
Derate above 25 oC 1.33 0.32 W/
oC
Repetitive Avalanche Energy(1) EAR 16.5 mJ
Peak Diode Recovery dv/dt(3) dv/dt 4.5 V/ns
Single Pulse Avalanche Energy(4) EAS 460 mJ
Junction and Storage Temperature Range TJ, Tstg -55~150 oC
The MDP/F12N50B uses advanced Magnachip’s MOSFET Technology, which provides low on-state resistance, high switching performance and excellent quality. MDP/F12N50B is suitable device for SMPS, high Speed switching and general purpose applications.
Gate Leakage Current IGSS VGS = ±30V, VDS = 0V - - 100 nA
Drain-Source ON Resistance RDS(ON) VGS = 10V, ID = 5.75A - 0.55 0.65 Ω
Forward Transconductance gfs VDS = 30V, ID = 5.75A - 15 - S
Dynamic Characteristics
Total Gate Charge Qg
VDS = 400V, ID = 11.5A, VGS = 10V(3)
- 19.3 -
nC Gate-Source Charge Qgs - 4.6 -
Gate-Drain Charge Qgd - 6.1 -
Input Capacitance Ciss
VDS = 25V, VGS = 0V, f = 1.0MHz
- 1034 -
pF Reverse Transfer Capacitance Crss - 5.1 -
Output Capacitance Coss - 126 -
Turn-On Delay Time td(on)
VGS = 10V, VDS = 250V, ID =11.5A, RG = 25Ω
(3)
- 16 -
ns Rise Time tr - 35 -
Turn-Off Delay Time td(off) - 31 -
Fall Time tf - 40 -
Drain-Source Body Diode Characteristics
Maximum Continuous Drain to Source Diode Forward Current
IS - 11.5 - A
Source-Drain Diode Forward Voltage VSD IS = 11.5A, VGS = 0V - - 1.4 V
Body Diode Reverse Recovery Time trr
IF = 11.5A, di/dt = 100A/µs
- 310 - ns
Body Diode Reverse Recovery Charge
Qrr - 2.6 - µC
Note :
1. Pulse width is based on RθJC & RθJA and the maximum allowed junction temperature of 150°C. 2. Pulse test: pulse width ≤300us, duty cycle≤2%, pulse width limited by junction temperature TJ(MAX)=150°C.
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