LTS company profile

Introduction to Laser Total Solution

www.ltsolution.com

Company Profile

Company Profile

COMPANY

PRESIDENT

FOUNDATION

ADDRESS

EMPLOYEE

SCALE

QUALITY MANAGEMENT SYSTEM

CERTIFICATION

LTS Co., Ltd. (Laser Total Solution)

Ph. D. Hongjin Park

2003. Feb. 14th

38-13, Ojeon-dong, Uiwang-si, Gyeonggi-do, Korea

214 (standard 2013. January. 7th)

Total 4,500㎡ (Factory 2,500㎡/ Office 2,000㎡

ISO 9001: 2008/ISO 14001:2004

Ventures, INNI-Biz, Main-Biz, CE Certified

Revenue : 63.3 billion (74.2%

growth)

- AMOLED Cell Sealing System

- LGP Laser Engraving System

- Solar-Cell Selective Emitter

Technology Available : Patent Application 52 cases

Has Laser Source Manufacturing Technology

R&D Center : 61 people

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World Class 300 (Ministry of Knowledge Economy)

Organization

CEO

DISPLAY STRATEG Y

LED/BLU SEMICONDUCTO

R

N E W TECHNOL O G Y

MANAGEMENT

On the Fly T/F

COO

Software

Hardware

Mechanical Design

Optics Design

17%

12%

21%

15%

Customer Service

Management

Sales

20%

8%

7%

Doctor Master B.A. College TOTAL

10 14 142 48 214

3

‘13. 01. 07

R & D CENTER

Cutting T / F

Planning Marketin

g L a s e r Q .A.

T E A M S / W H / W SALES

Company History

Establishment Steps

(‘03∼’05)

Customer and Market

Application Discovery

- 2003. 02. LTS established

- 2003. 05. BLU Laser Engraver developed

- 2004. 07. UV Laser Dry Etcher developed : Touch Screen用

- 2005. 01. High Speed CMP Pad用 Laser Driller

Market Entry Steps

(‘06∼’07)

Reference Ensure Specialty

Products

- 2006. 02. PDP Glass用 Laser Driller

- 2006. 05. Laser Sealing System Developed : AMOLED用

- 2007. 06. Solar cell Edge Isolation

- 2007. 08. Relocated Office to Gyeonggi-do, Uiwang-si

Growth Steps

(‘08∼’09)

Business Capacity and

Growth Engine

- 2008. 03. Laser ITO Section Etching Machine

- 2008. 03. DSSC Scribing & Sealing System

- 2008. 06. Laser Ablation Layer System

- 2008. 07. Laser BLU Mold Pattering System

- 2008. 10. Laser Area Dry Etching System

- 2009. 02. Laser Polarizing Film Cutter

- 2009. 03. AMOLED In-Glass Marker(Galaxy S)

Stabilization Steps

(‘10∼’Present)

M/S and Expanding

New Business Areas

Prepared Based on

Global Business

- 2010. 02. Pico Second Laser Drilling

- 2010. 04. High Speed Laser Engraver (LGP用)

- 2010. 10. Ochang Ofiice produce LGP

- 2011. 03. Solar cell Laser Selective Emitter Doping System

- 2011. 06. Registered on KOSDAQ

- 2011. 09. 2ND Battery Foil Cutting & Welding System

- 2011. 10. OLED Lighting Laser Sealing System

- 2011. 12. Ceramic Laser Drilling / Full Cutting System

- 2012. 02. Jang Youngsil Prize

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Flagship Product Configuration

Laser Cell Sealing M/C

Laser Repair M/C

Laser Cutting M/C LGP Engraving M/C

LGP Cutting M/C

LGP Laser Serration M/C

Selective Emitter Laser Doping M/C

Solar Cell Scribing M/C

Solar Cell Drilling M/C

AMOLED LED TV

Film Laser Cutter

Display Energy

Battery Foil Cutting

Lift-Off M/C

Flexible (Marking)

Battery Welding

Flexible M/C

Solar Cell Battery

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Laser Frit Cell Sealing System for AM-OLED

AMOLED Sealing Process Equipment - SMD Exclusive Supply

- SMART Phone, Tablet PC for AMOLED Equipment Supply in Priority

- Exclusive Supply for S company AMOLED Sealing Equipment (in 2011)

S Company AMOLED M/S – More than 98%.

- Completed the Development of Large AMOLED (8.5G)

- Features

High Throughput

High Accuracy Stage

High Resolution

Fine Align Function

Frit

GLASS 접착제

Laser sealing

합착 및 Sealing Cutting

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Laser OLED Thin Film Layer Isolation & In-Glass Marking Laser Cutting System For Glass (LCD, AMOLED)

Laser Cutting Edge Grinding

- Mass Production & Engineering Work : 3G ~ 8G AMOLED & TFT LCD. Solar Cell

- Pssible to the Tempered Glass (Max DOL 20um)

- Clean/Fine Images of the Cutting Edges (No Particle)

Laser OLED Thin Film Layer Isolation & In-Glass Marking

Laser Cutting System For Glass (LCD, AMOLED)

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Laser Cutting System for Glass (Tempered Glass)

[Gorilla Tempered Galss Cutting (DOL 40um)]

[Straight Line] [Round Line] [Circle Line]

① ② ③

General Specification

- Laser : Picosecond Laser

- Cutting speed : min 200mm/sec (外形 ) - Chipping : ±50μm - Burr : ±50μm

Feature

- Mass Production & Engineering Work

: AMOLED. TFT LCD. Tempered Glass DOL 40um - Easy & Low Maintenance Cost - Eco_Friendly : Dry Process (no Particle)

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Laser Lift-Off System for Flexible Display Excimer Laser Application

Flexible Display Laser Lift-Off (OLED,LCD, E-Paper)

Excimer Laser Application

Lift-Off by Laser Absorption

DPSS SHG Green Laser

LED Laser Lift-Off Laser Cutting of Wafer

Fine Control : Ultra Narrow Width

Lowest Thermal Damage

Dry Process / Edge Sintering

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Laser Engraver of the LGP for LED TV

The World First Laser LGP Engraver for LED TV

Max 100” Inch

· LGP Laser Patterning for LED TV M/S 90% (in 2011)

- Supply of New Production Equipment in Companies Affiliate

S Company (150 Units)

- Production for the TV LGP To SONY and GA (in 2011 - 350K)

: Has Production Capacity

- Complete the LGP Development for Monitor (0.8T) and Lighting

- New Equipment Supply Related Display Company

: LGP Cutting System, Serration System Developing Supply

- Feature

Engraving speed : 4,000 mm/sec

High Brightness (Best Light Efficiency)

High Throughput & Performance

Flexibility : Variable Size

User Friendly & Editing Software

Easy & Low Maintenance Cost

Eco-Friendly : Dry Process (no Chemicals)

Multi Line

The World First Laser LGP Cutter for LED TV

Max 63” Inch

10

POL Film Laser Cutting System for LCD TV / Monitor

Narrow Bezel · L Company Bezel-Less Process Equipment

- Cutting POL Film accurately by Laser

- Released in LGD CES1212 (Bezel 1mm)

- Work size : Min7”~ Max 23”

- Work Process :

LD→ POL Pick Up → POL Stage Loading → Vision Align

→ Laser Cutting → Pickup /ULD

- Feature

High throughput

High Accuracy Stage

High Cutting Quality

(minimize the yellow band & burr)

Easy operation & maintenance

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Laser ITO Patterning, Film Cutting and Ag paste Direct Patterning for Touch Screen Panel

Capacitive Touch Screen

Resistive Touch Screen

Laser Bonding System Laser Film Cutting System

The World First Area Laser Patterning for Touch Panel

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Laser Repair System for AM-OLED Laser System for Dye Sensitized Solar Cells

Working Table

Coaxial Type Light

Laser SourceMotorized

Slit

Linear Motor

Lens

Granite Base

Vision

illuminationAttenuator

Main X, Y Table

Isolator System

- Cutting

- Firing

- Welding / Bonding

- Deposition

Glass Cutting TCO Isolation Hole Drilling Catalyst

Deposition Interconnect & 1st Seal Attachment

Hole Sealing

Residual Dye Removal

Dye Application Cohesion Tio2 Deposition

2nd Sealing Wire

Connection Electrolyte Injection

Sintering

TCO Isolation Hole Drilling

Laser Sintering Laser Frit Sealing

Laser Repair System for AM-OLED Laser System for Dye Sensitized Solar Cells

13

Laser System for CIGS Solar Cells

Inner Glass Marker

P1,P2,P3 Laser Scriber

Laser Edge Deletion

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P2 (left) P3(right) Pico-second laser scribing

(Reference from Industrial Laser Solutions)

Pico-second laser (F = 0.72 J/cm2, v = 20 mm/s).

P1 Pico-second laser scribing

Laser Selective Emitter for Bulk Type Si Solar Cells

Damage Free

UPH World Record : Max 3,600!!

· Entry Japanese Solar Cell Market

- Exclusive supply to Japan K company,

Selective Emitter one of the Laser Doping process equipment.

Evaluation : Increase Solar cell efficiency

/ Saving investment costs

LTS Laser Doping M/C Available apply in Existing line

Solar Cell Efficiency 1% Synergy

3~4% overall equipment investment cost savings

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Laser Tabbing Machine for Si Wafer Solar Cells Laser Edge Isolation System for Bulk Type Si Solar Cells

전극

LaserHead

LaserHead

Up/Down Jig

고정용 Pin

Work (Wafer)

Heater

Main X Axis Table

Working Table &

Clamping JigLaser #1

Laser #2Focusing Head #2

Fiber

Fiber

Focusing Head #1

Mono or Polycrystalline Silicon

Isolation Cut (Reduction of Recombination Losses)

Front Contact

n

Si (p)

Rear Side Contact

Laser Tabbing Machine

Laser Edge Isolation System

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Rechargeable Battery Cutting System

Roll to Roll Type Roll to Cell Type

Roll to Roll System : Max speed 30m/min

Scanner speed : 1,000mm/s

Max Capability : 30매/min (300×300)

Roll to Cell System : Max speed 20m/min

Scanner speed : 1,000mm/s

Max Capability : 20매/min (350×350)

- Cell unit Loading of Electrode

Inspection 기능 추가 가능(Option)

2 Moving Stage 적용 시 Max 35매 생산가능

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Rechargeable Battery Welding System

Multi-Cell Foil Welding

Pack (Between dissimilar metals Welding) Features : Welding between electrode parts and Tab

- Improve the internal resistance

- Improve the upper and lower bonding strength

Use Scanners : High Speed Welding Implementation

Spatter Protection : sealed Chamber + Suction

Inert Gas Blowing

Available 60 sheets electrode Tab welding

Important Component

- Laser : According to customer spec.

- Expression Jig Unit

- Isolated 2 Chamber

- 3 Axis Motion Unit

Related Patent Applications : 2 cases

Features : Between dissimilar metals Welding

(Anode-Cathode/ Cell- Busbar)

- Reduce contact electrical resistance

Improved heat issues

- Minimize Intermetallic Compound

Spatter Suction

Inert Gas Blowing

Use welding parts vision checker(Option)

3 Axis Motion Unit (z axis Focusing Unit)

Package Jig + Expression Jig

18

ETC Machine System

Laser Driller For the CMP Pad Dejunk System

Laser Deflasher

<60㎛>

Laser Marker

Fiber Laser Marker CO2 Laser Marker

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High Power Green Laser

High Power DPSS Green 100w Laser

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100W at 532nm 2% rms 240hours

Long term stability measurement

Specification GREEN 100 Watts

Wavelength 532 nm

Average Power 100 Watt

Repetition Rate 10 kHz

Polarization Linear

Beam Mode Multi-Mode

Beam Size 4.0 mm

Beam Divergence 4 mr

Pulse-to-Pulse Stability

5 %

Power Stability < 3 % @ 24 hrs

Controller Electrical Power

220/8A AC, Single Phase, 60 Hz

Chiller Electrical Power

220/11.4A AC, Single Phase, 60 Hz

Cooling Method Closed-Loop Water Cooling

Thank You !

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